F59L4G81XB-25TG2X

4Gb NAND Flash
Part Description

SLC NAND Flash, 4Gbit (512M×8), 3.3V, x8, 25ns, 48-pin TSOPI

Quantity 1,351 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerESMT
Manufacturing StatusMP
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device PackageTSOPI-48Memory FormatFLASHTechnologyNAND Flash - SLC
Memory Size4 GbitAccess Time20 nsGradeCommercial
Clock FrequencyN/AVoltage2.7V ~ 3.6VMemory TypeNon-Volatile
Operating Temperature0°C – 70°CWrite Cycle Time Word Page200 µsPackaging48-TSOPI
Mounting MethodSurface MountMemory InterfaceParallelMemory Organization512M x 8
Moisture Sensitivity Level3RoHS ComplianceCompliantREACH ComplianceREACH Unknown
QualificationN/AECCNEAR99HTS Code8542.32.00.71

Overview of F59L4G81XB-25TG2X – SLC NAND Flash, 4Gbit (512M×8), 3.3V, x8, 25ns, 48-pin TSOPI

The F59L4G81XB-25TG2X from ESMT is a 4.295 Gbit single-level cell (SLC) NAND Flash device organized as 512M × 8 with a parallel 8-bit multiplexed interface. It supports VCC from 2.7V to 3.6V and operates across a commercial temperature range of 0 °C to 70 °C.

Designed for non-volatile storage in commercial embedded systems, the device implements the ONFI 1.0 command set and offers on-die ECC, program/read cache modes, and hardware status signals for robust integration into storage and firmware applications.

Key Features

  • Memory Core & Organization — 4.295 Gbit total capacity organized as 512M × 8; page size 4,352 bytes (4,096 + 256), block size 64 pages, single plane.
  • Performance — Asynchronous I/O with RC/WC = 25 ns and a listed access time of 20 ns. Read page times up to 115 µs (max) with on-die ECC enabled and 25 µs (max) with ECC disabled. Typical program page time is 200 µs (without on-die ECC) and 240 µs (with on-die ECC); typical erase block time is 2 ms.
  • Interface & Signals — Standard ONFI NAND Flash protocol over a highly multiplexed 8-bit I/O bus (I/Ox), with CE#, CLE, ALE, WE#, RE#, R/B# and WP# for hardware-level control and status.
  • Error Management & Security — Internal 8-bit ECC (disabled by default and configurable via SET FEATURE). Permanent block locking, one-time programmable (OTP) mode, block lock and Read Unique ID are supported.
  • Reliability & Endurance — Endurance rated to 100,000 program/erase cycles; uncycled data retention of 10 years 24/7 at 70 °C; qualification referenced to JESD47G.
  • Power & Temperature — Wide operating voltage range of 2.7 V to 3.6 V and commercial operating temperature of 0 °C to 70 °C.
  • Package & Mounting — Surface-mount TSOPI-48 package (48-pin TSOPI, Pb-free) with a standard low pin-count NAND pinout that facilitates board upgrades across densities.

Typical Applications

  • Embedded storage and firmware — Non-volatile storage for firmware, boot code and system images where program/erase endurance and long data retention matter.
  • Commercial embedded systems — Fits designs requiring commercial-grade temperature operation (0 °C to 70 °C) and a standard parallel NAND interface.
  • Data storage and logging — Suitable for designs that need reliable page/block program and erase performance combined with on-die ECC and long-term retention.

Unique Advantages

  • SLC endurance and retention — Rated for 100,000 program/erase cycles and 10 years uncycled retention at 70 °C, providing predictable lifecycle behavior for non-volatile storage needs.
  • Configurable on-die ECC — 8-bit internal ECC can be enabled or disabled via SET FEATURE, allowing system designers to balance error correction and raw throughput as required.
  • ONFI 1.0 compatibility — Standard NAND command set and protocols simplify integration and future upgrades across ONFI-compliant devices.
  • Fast asynchronous I/O — Low RC/WC (25 ns) and short program/read latencies support responsive read/write operations for embedded storage tasks.
  • Flexible block management — Permanent block locking, OTP mode and block lock features support secure and reliable storage partitioning and protection.
  • Compact surface-mount package — TSOPI-48 surface-mount form factor enables compact board designs while retaining a standard pinout for density upgrades.

Why Choose F59L4G81XB-25TG2X?

The F59L4G81XB-25TG2X combines SLC NAND architecture, configurable on-die ECC, and a standard ONFI interface to deliver a reliable, high-endurance non-volatile memory option for commercial embedded designs. Its documented program/read/erase performance numbers and 100,000 program/erase cycle endurance make it suitable for firmware storage, data logging and other applications requiring predictable lifecycle characteristics.

Packaged in a surface-mount TSOPI-48 with a 2.7–3.6 V supply range and commercial temperature rating, this ESMT device is positioned for designers seeking straightforward integration, long-term data retention, and the flexibility of configurable ECC and block protection features.

Request a quote or submit an inquiry for pricing and availability to include the F59L4G81XB-25TG2X in your next design.

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