FBFS256GBB-EA40

The FBFS256GBB-EA40 from Flexxon is a 256GB (2.048 Tbit) Universal Flash Storage (UFS) 2.2 memory solution built with advanced 3D TLC NAND technology. Designed for automotive and embedded applications requiring high-capacity, high-performance non-volatile storage, this BGA surface-mount device delivers the speed and reliability demanded by mission-critical systems operating in harsh environments.

With AEC-Q100 Grade 2 qualification and an extended temperature range of -40°C to 105°C, the FBFS256GBB-EA40 meets the rigorous requirements of automotive infotainment, advanced driver assistance systems (ADAS), telematics, and industrial automation applications where data integrity and environmental resilience are paramount.

Key Features

• High-Capacity Storage
  256GB (2.048 Tbit) of non-volatile flash memory organized as 256G × 8, providing ample space for data-intensive applications including HD media, navigation databases, firmware updates, and system logs.
• UFS 2.2 Interface
  High-speed Universal Flash Storage 2.2 interface delivers superior sequential and random read/write performance compared to legacy eMMC solutions, accelerating boot times, application loading, and data transfer operations.
• Advanced 3D TLC NAND Technology
  Built on proven 3D triple-level cell (TLC) NAND architecture, offering an optimal balance of capacity, performance, and cost-efficiency for modern embedded systems.
• Automotive-Grade Qualification
  AEC-Q100 Grade 2 qualified for automotive applications, ensuring compliance with stringent industry standards for quality, reliability, and longevity in vehicular environments.
• Extended Temperature Range
  Operational across -40°C to 105°C, supporting deployment in extreme climate conditions and demanding thermal environments found in automotive and industrial settings.
• Compact BGA Package
  Space-efficient 153-ball BGA package measuring just 11.5 × 13 × 1.4mm enables integration into space-constrained designs while maintaining robust electrical performance and thermal characteristics.
• Surface Mount Technology
  Designed for automated surface mount assembly processes, facilitating high-volume manufacturing and reducing production costs.
• RoHS Compliant
  Fully compliant with environmental regulations, meeting RoHS requirements for reduced hazardous substance content.

Typical Applications

• Automotive Infotainment Systems
  Stores operating systems, applications, multimedia content, and navigation maps for in-vehicle entertainment and connectivity platforms requiring fast boot times and responsive user interfaces.
• Advanced Driver Assistance Systems (ADAS)
  Provides high-speed data storage for camera systems, sensor fusion platforms, and AI-based driver assistance features where rapid data access and environmental reliability are critical.
• Vehicle Telematics and Data Logging
  Captures and stores vehicle diagnostics, fleet management data, driving behavior analytics, and over-the-air (OTA) update packages in connected vehicle architectures.
• Industrial Automation and Control
  Supports industrial controllers, human-machine interfaces (HMI), and embedded vision systems operating in factory automation, process control, and robotics applications with extended temperature requirements.
• Medical and Healthcare Equipment
  Enables reliable data storage in portable diagnostic devices, patient monitoring systems, and medical imaging equipment requiring both capacity and environmental tolerance.

Unique Advantages

• Performance Optimized for Automotive:
  UFS 2.2 interface delivers significantly faster data throughput than eMMC alternatives, reducing system latency and improving user experience in responsive automotive applications.
• Proven Environmental Resilience:
  AEC-Q100 Grade 2 qualification and -40°C to 105°C operational range ensure reliable operation across the full spectrum of automotive and industrial environmental conditions without performance degradation.
• High Capacity in Minimal Footprint:
  256GB storage in a compact 11.5 × 13mm BGA package maximizes available capacity while conserving valuable PCB real estate in space-constrained automotive and embedded designs.
• Simplified Design Integration:
  Industry-standard UFS 2.2 interface and BGA form factor streamline board design, reduce component count, and leverage established supply chains for faster time-to-market.
• Cost-Effective 3D TLC Architecture:
  Advanced 3D NAND technology delivers optimal cost-per-gigabyte while maintaining the endurance and reliability characteristics required for automotive-grade applications.
• Manufacturing-Ready Package:
  Surface mount 153-ball BGA packaging supports automated assembly processes and high-volume production runs, reducing manufacturing complexity and improving yield consistency.

Why Choose the FBFS256GBB-EA40?

The FBFS256GBB-EA40 delivers automotive-grade reliability, high-performance UFS 2.2 connectivity, and substantial 256GB capacity in a proven BGA package designed for the most demanding embedded applications. Its AEC-Q100 Grade 2 qualification and extended temperature range make it an ideal choice for automotive OEMs, Tier 1 suppliers, and industrial equipment manufacturers who require certified components that meet stringent quality and environmental standards.

Backed by Flexxon's expertise in industrial and automotive flash storage solutions, the FBFS256GBB-EA40 provides a robust, future-proof foundation for next-generation automotive infotainment, ADAS, telematics, and industrial control systems. Its combination of capacity, performance, compact form factor, and environmental resilience reduces design risk, accelerates qualification cycles, and ensures long-term product reliability in the field.

Ready to integrate high-performance automotive-grade storage into your next design? Contact our sales team today to request detailed specifications, pricing information, and sample availability for the FBFS256GBB-EA40. Our technical experts are available to support your evaluation and help you leverage the advantages of UFS 2.2 technology in your application.