FBFS256GBE-EB40

The FBFS256GBE-EB40 is a high-capacity 256GB Universal Flash Storage (UFS) 3.1 memory solution from Flexxon, delivering 2.048 Tbit of non-volatile flash storage in a compact 153-ball FBGA package. Built on advanced 3D TLC NAND technology, this industrial-grade storage device provides reliable, high-speed data access for embedded systems requiring substantial storage capacity and robust performance across extended temperature ranges.

Designed for demanding industrial applications, the FBFS256GBE-EB40 combines the high bandwidth of the UFS 3.1 interface with industrial-grade reliability, making it an ideal storage solution for edge computing devices, industrial controllers, medical equipment, and embedded systems where performance, endurance, and environmental resilience are critical requirements.

Key Features

• High-Capacity Storage
  256GB (2.048 Tbit) capacity organized as 256G × 8 provides ample space for data-intensive applications, operating system storage, logging, multimedia content, and firmware updates in embedded systems.
• UFS 3.1 Interface
  Universal Flash Storage 3.1 interface delivers high-speed sequential and random access performance, significantly outperforming legacy eMMC solutions for applications requiring rapid data throughput and low latency.
• 3D TLC NAND Technology
  Advanced three-dimensional triple-level cell flash architecture provides excellent storage density and cost-effectiveness while maintaining reliable data retention and endurance for industrial workloads.
• Industrial Temperature Range
  Qualified for operation from -40°C to 85°C, ensuring reliable performance in harsh industrial environments, outdoor installations, and automotive-adjacent applications without thermal management concerns.
• Compact Surface-Mount Package
  153-ball FBGA package measuring just 11.5 × 13 × 1.4mm enables space-efficient PCB layouts in size-constrained embedded designs while providing robust mechanical attachment for high-vibration environments.
• RoHS Compliant
  Fully compliant with RoHS environmental regulations, supporting green manufacturing initiatives and simplifying regulatory compliance for global product deployment.

Typical Applications

• Industrial Automation and Control Systems
  Provides high-capacity storage for programmable logic controllers, industrial PCs, and edge computing platforms requiring fast access to control algorithms, configuration data, and operational logs.
• Medical and Healthcare Equipment
  Enables reliable storage of patient data, diagnostic images, and system firmware in medical devices where data integrity and long-term retention are essential requirements.
• Network and Communication Infrastructure
  Supports routers, gateways, base stations, and network attached storage systems with high-bandwidth storage for firmware, configuration files, buffering, and content caching.
• Smart City and IoT Gateway Devices
  Powers edge computing nodes, surveillance systems, and IoT gateways that collect, process, and store sensor data from distributed networks before cloud transmission.
• Transportation and Fleet Management
  Serves onboard computing systems, telematics devices, and fleet management equipment operating in wide temperature ranges with requirements for high-capacity data logging and multimedia storage.

Unique Advantages

• Performance Beyond eMMC
  UFS 3.1 architecture delivers superior random read/write performance and command queuing compared to eMMC alternatives, reducing system bottlenecks in data-intensive embedded applications.
• Industrial Reliability
  Extended temperature qualification and industrial-grade construction ensure consistent operation in challenging environments where consumer-grade storage solutions would fail or degrade prematurely.
• Space-Efficient Integration
  Compact FBGA footprint and surface-mount technology minimize PCB real estate requirements, enabling smaller product form factors and simplified assembly processes.
• Proven 3D NAND Foundation
  3D TLC technology provides a mature, well-characterized storage foundation with predictable endurance characteristics and wear-leveling behavior for long product lifecycles.
• Simplified Supply Chain
  Flexxon's BGA UFS 3.1 series offers consistent availability and quality for industrial customers requiring stable, long-term component sources with manageable obsolescence risk.

Why Choose the FBFS256GBE-EB40?

The FBFS256GBE-EB40 represents an optimal balance of high capacity, performance, and industrial reliability for embedded system designers moving beyond legacy storage interfaces. With 256GB of storage capacity and the bandwidth advantages of UFS 3.1, this memory solution addresses the growing data demands of edge computing, IoT, and industrial applications without compromising on environmental robustness or long-term availability.

For engineering teams developing industrial controllers, medical devices, network infrastructure, or smart city equipment, the FBFS256GBE-EB40 delivers a proven storage platform backed by Flexxon's focus on industrial and embedded markets. Its compact package, wide temperature qualification, and RoHS compliance make it straightforward to integrate into new designs or storage upgrades for existing product lines requiring enhanced capacity and performance.

Ready to integrate industrial-grade UFS 3.1 storage into your next design? Request a quote for the FBFS256GBE-EB40 today to discuss volume pricing, technical specifications, and delivery schedules tailored to your project requirements.