FBFS256GBG-EA40

The FBFS256GBG-EA40 is a high-capacity 256GB (2.048 Tbit) Universal Flash Storage 2.2 solution from Flexxon, designed to deliver reliable non-volatile memory performance in demanding industrial environments. Built on advanced 3D TLC NAND technology in a compact 153-ball BGA package, this surface-mount flash storage module provides the speed and density required for data-intensive embedded applications.

Engineered for industrial-grade reliability, the FBFS256GBG-EA40 operates across an extended temperature range of -25°C to 85°C, making it ideal for automotive infotainment, industrial control systems, medical devices, and other mission-critical applications where consistent performance and environmental resilience are essential.

Key Features

• High-Capacity Storage
  256GB (2.048 Tbit) of non-volatile flash memory organized as 256G × 8, providing ample space for operating systems, applications, multimedia content, and data logging in space-constrained embedded designs.
• UFS 2.2 Interface
  Universal Flash Storage 2.2 protocol delivers high-bandwidth data transfer and low latency, enabling fast boot times, responsive application performance, and efficient multitasking in advanced embedded systems.
• 3D TLC NAND Technology
  Three-dimensional triple-level cell architecture balances density, performance, and cost-effectiveness, offering a compelling storage solution for applications requiring substantial capacity without compromising reliability.
• Industrial Temperature Range
  Qualified for operation from -25°C to 85°C, ensuring stable performance across harsh environmental conditions including outdoor installations, vehicular systems, and industrial automation equipment.
• Compact BGA Package
  Surface-mount 153-ball BGA in an 11.5 × 13 × 1.4mm footprint minimizes board space requirements, ideal for space-constrained designs in mobile, handheld, and embedded computing platforms.
• RoHS Compliant
  Fully compliant with environmental regulations, supporting sustainable design practices and global market requirements.

Typical Applications

• Automotive Infotainment Systems
  Provides high-capacity storage for navigation databases, multimedia libraries, and real-time operating systems in vehicle head units and digital cockpit platforms, with industrial-grade temperature tolerance for in-cabin environments.
• Industrial Automation and Control
  Enables reliable data logging, firmware storage, and HMI graphics in programmable logic controllers, industrial PCs, and edge computing gateways operating in factory and outdoor environments.
• Medical Devices
  Supports storage requirements for patient data, diagnostic imaging, and embedded operating systems in portable medical equipment, patient monitors, and diagnostic instruments where reliability is critical.
• Surveillance and Security Systems
  Delivers the capacity and performance needed for video buffering, system firmware, and configuration data in IP cameras, network video recorders, and access control systems deployed across varied environmental conditions.
• Embedded Computing Platforms
  Serves as primary storage for single-board computers, embedded modules, and IoT gateways requiring substantial local storage for edge analytics, caching, and application execution.

Unique Advantages

• Industrial-Grade Reliability
  Extended temperature qualification from -25°C to 85°C ensures consistent operation in demanding environments where consumer-grade components would fail, reducing field failure rates and warranty costs.
• Space-Efficient Integration
  The compact 11.5 × 13mm BGA footprint and surface-mount design enable high-density PCB layouts, freeing valuable board space for additional functionality or enabling smaller product form factors.
• High-Speed Data Access
  UFS 2.2 interface architecture provides superior read/write performance compared to legacy eMMC solutions, accelerating boot times, application launches, and data-intensive operations in performance-sensitive applications.
• Proven 3D NAND Technology
  Three-dimensional TLC NAND construction delivers density advantages over planar architectures while maintaining reliability characteristics suitable for industrial deployment, optimizing cost-per-gigabyte without sacrificing quality.
• Simplified BOM Management
  Single-component storage solution eliminates the need for discrete flash arrays and complex controller implementations, reducing procurement complexity, inventory overhead, and assembly costs.
• Environmental Compliance
  RoHS-compliant construction ensures regulatory conformance for global markets, simplifying certification processes and supporting corporate sustainability initiatives.

Why Choose the FBFS256GBG-EA40?

The FBFS256GBG-EA40 combines industrial-grade environmental tolerance with the high performance of the UFS 2.2 interface and the capacity advantages of 3D TLC NAND technology. This combination makes it an ideal choice for embedded system designers who need substantial storage in a compact, surface-mount package that can withstand the thermal and environmental challenges of industrial, automotive, and professional equipment deployments.

Backed by Flexxon's expertise in embedded storage solutions, the FBFS256GBG-EA40 offers a reliable, proven platform for your next-generation designs. Whether you're developing advanced infotainment systems, industrial controllers, or medical devices, this industrial-grade UFS solution delivers the performance, capacity, and environmental resilience your application demands.

Ready to integrate reliable, high-capacity storage into your next design? Request a quote for the FBFS256GBG-EA40 today and discover how industrial-grade UFS 2.2 technology can elevate your embedded system performance.