FBFS256GBG-EB40

The FBFS256GBG-EB40 from Flexxon is a high-capacity 256GB UFS 3.1 flash memory solution designed for demanding embedded applications. Built with 3D TLC NAND technology in a compact 153-ball FBGA package, this non-volatile memory device delivers the performance and reliability required for industrial systems operating in extended temperature environments.

Engineered for industrial-grade applications, the FBFS256GBG-EB40 combines substantial storage capacity with the speed and efficiency of the UFS 3.1 interface. Its wide operating temperature range of -25°C to 85°C and surface-mount form factor make it well-suited for embedded systems in industrial automation, ruggedized computing, networking infrastructure, and other mission-critical applications where both performance and environmental resilience are essential.

Key Features

• High-Capacity Storage
  256GB (2.048 Tbit) of non-volatile flash memory provides ample storage for operating systems, application data, and high-resolution media in embedded systems.
• UFS 3.1 Interface
  Utilizes the Universal Flash Storage 3.1 standard, delivering high-speed data transfer and command queuing capabilities for demanding read/write workloads in modern embedded applications.
• 3D TLC NAND Technology
  Leverages advanced 3D triple-level cell architecture to achieve high density and cost-effective storage while maintaining performance and endurance suitable for industrial use cases.
• Industrial Temperature Range
  Qualified for operation from -25°C to 85°C, ensuring reliable performance across harsh environmental conditions without requiring additional thermal management.
• Compact Surface-Mount Package
  Housed in a space-efficient 153-ball FBGA package measuring just 11.5×13×1.4mm, enabling high-density board designs and integration into space-constrained embedded systems.
• RoHS Compliant
  Meets RoHS environmental compliance standards, supporting green manufacturing initiatives and global regulatory requirements.

Typical Applications

• Industrial Computing and Automation
  Serves as primary storage for embedded controllers, HMI panels, and industrial PCs requiring reliable, high-capacity memory in factory automation and process control systems.
• Network Infrastructure Equipment
  Provides fast, dependable storage for routers, switches, and edge computing devices that demand both performance and extended temperature operation in telecom and enterprise networking environments.
• Ruggedized Mobile and Portable Systems
  Enables robust data storage in handheld terminals, field instruments, and portable diagnostic equipment operating in challenging outdoor and industrial environments.
• Transportation and Fleet Systems
  Supports onboard computing, telematics, and data logging applications in commercial vehicles and transportation infrastructure where wide temperature tolerance is critical.
• Medical and Healthcare Devices
  Delivers reliable storage for patient monitoring systems, diagnostic equipment, and medical imaging devices requiring industrial-grade components and regulatory compliance.

Unique Advantages

• Industrial-Grade Reliability:
  Purpose-built for industrial environments with extended temperature qualification, ensuring consistent operation in conditions where commercial-grade components may fail.
• Performance-Optimized Interface:
  UFS 3.1 protocol enables simultaneous read/write operations and command queuing, significantly improving system responsiveness compared to legacy eMMC solutions.
• Space-Efficient Design:
  Compact FBGA footprint reduces PCB real estate requirements, allowing designers to maximize functionality in size-constrained embedded platforms.
• Simplified Integration:
  Surface-mount packaging and industry-standard UFS interface streamline board design and manufacturing, reducing development time and assembly complexity.
• Proven 3D NAND Architecture:
  Leverages mature 3D TLC technology to balance capacity, performance, and cost-effectiveness for industrial storage applications.
• Environmental Compliance:
  RoHS-compliant construction supports sustainable manufacturing practices and meets international environmental regulations for electronic components.

Why Choose the FBFS256GBG-EB40?

The FBFS256GBG-EB40 delivers the combination of high-capacity storage, modern interface performance, and industrial-grade reliability that today's embedded systems demand. Its 256GB capacity provides headroom for complex operating systems and data-intensive applications, while the UFS 3.1 interface ensures the throughput and responsiveness required for real-time industrial workloads. The extended -25°C to 85°C operating range makes it suitable for installations in uncontrolled environments where temperature extremes are common.

For engineers developing industrial controllers, networking equipment, ruggedized computing platforms, or other mission-critical embedded systems, the FBFS256GBG-EB40 offers a reliable, space-efficient storage foundation. Its compact form factor, proven technology, and industrial qualification enable designers to build robust systems with confidence, while the UFS 3.1 standard ensures compatibility with current and future embedded platforms. Backed by Flexxon's expertise in industrial memory solutions, this device represents a dependable choice for applications where performance and environmental resilience cannot be compromised.

Request a Quote

Ready to integrate the FBFS256GBG-EB40 into your next industrial design? Contact our sales team today to request a quote, discuss volume pricing, or obtain technical support for your specific application requirements.