FBFS512GBB-EB40

The FBFS512GBB-EB40 is a high-capacity 512GB Universal Flash Storage (UFS) 3.1 memory module from Flexxon's BGA UFS 3.1 series. Built on 3D TLC NAND flash technology, this non-volatile memory solution delivers the performance and reliability needed for demanding automotive and industrial applications. With a compact 153-pin FBGA package measuring just 11.5×13×1.52mm, it provides substantial storage capacity in a surface-mount form factor optimized for space-constrained designs.

Qualified to AEC-Q100 Grade 2 automotive standards and rated for operation from -40°C to 105°C, the FBFS512GBB-EB40 addresses the stringent requirements of automotive infotainment, advanced driver assistance systems, industrial automation, and other mission-critical embedded systems. Its UFS 3.1 interface delivers high-speed data access while maintaining low power consumption, making it an ideal storage solution for next-generation connected devices.

Key Features

• High-Capacity Non-Volatile Storage
  512GB (4.096 Tbit) of 3D TLC NAND flash memory provides ample storage for operating systems, applications, multimedia content, and data logging in embedded systems.
• UFS 3.1 High-Speed Interface
  Universal Flash Storage 3.1 interface delivers superior read/write performance compared to legacy eMMC solutions, enabling faster boot times, application loading, and data transfers.
• 3D TLC Flash Technology
  Advanced three-dimensional triple-level cell architecture offers an optimal balance of density, performance, and cost-effectiveness for high-capacity storage requirements.
• Automotive-Grade Reliability
  AEC-Q100 Grade 2 qualification ensures the component meets automotive industry standards for quality and reliability in demanding vehicular environments.
• Extended Temperature Range
  Operational from -40°C to 105°C, supporting deployment in harsh temperature environments including automotive under-hood applications and industrial control systems.
• Compact Surface-Mount Package
  153-ball FBGA package (11.5×13×1.52mm) enables high-density PCB layouts and minimizes board space requirements in size-constrained designs.
• RoHS Compliant
  Meets environmental compliance standards for lead-free manufacturing and global market requirements.

Typical Applications

• Automotive Infotainment Systems
  Provides high-capacity storage for navigation maps, multimedia content, operating systems, and user data in next-generation vehicle entertainment and information systems.
• Advanced Driver Assistance Systems (ADAS)
  Stores critical calibration data, software updates, and recorded sensor data for autonomous driving features, collision avoidance systems, and driver monitoring applications.
• Industrial Automation and Control
  Enables reliable data logging, firmware storage, and configuration management in programmable logic controllers, human-machine interfaces, and industrial PCs operating in challenging environments.
• Medical Imaging Equipment
  Supports storage of diagnostic images, patient data, and system software in medical devices requiring high capacity and reliability in controlled-temperature environments.
• Transportation and Fleet Management
  Provides robust storage for GPS tracking data, video recording, telemetry, and communication systems in commercial vehicles, railways, and marine applications.

Unique Advantages

• Automotive-Qualified Performance: AEC-Q100 Grade 2 certification eliminates the risk and uncertainty of using non-qualified components in automotive designs, ensuring compliance with industry requirements and long-term supply stability.
• Future-Proof Interface: UFS 3.1 technology provides a significant performance upgrade path over eMMC, offering bandwidth and efficiency improvements that extend product lifecycles and enable more feature-rich applications.
• Thermal Resilience: The -40°C to 105°C operating range ensures reliable operation in extreme environments without requiring additional thermal management, simplifying system design and reducing BOM costs.
• Space-Efficient Integration: The compact FBGA package minimizes PCB footprint while delivering substantial storage capacity, enabling smaller product form factors and more flexible industrial designs.
• Memory Organization Flexibility: 512G × 8 organization supports efficient data management and access patterns optimized for embedded operating systems and real-time applications.
• Environmental Responsibility: RoHS compliance ensures compatibility with global environmental regulations and supports corporate sustainability initiatives without compromising performance or reliability.

Why Choose the FBFS512GBB-EB40?

The FBFS512GBB-EB40 delivers a compelling combination of high capacity, automotive-grade reliability, and modern UFS 3.1 performance in a compact surface-mount package. Its AEC-Q100 Grade 2 qualification and extended temperature range make it particularly well-suited for automotive and industrial applications where component reliability and environmental resilience are non-negotiable requirements. The UFS 3.1 interface provides the bandwidth needed for data-intensive applications while maintaining the low power consumption essential for battery-operated and thermally-constrained systems.

For design engineers developing next-generation automotive infotainment, ADAS, industrial control systems, or other embedded applications requiring substantial non-volatile storage, the FBFS512GBB-EB40 offers a proven, standards-compliant solution backed by Flexxon's expertise in embedded storage technology. Its compact footprint, wide temperature range, and automotive qualification reduce design risk and accelerate time-to-market while providing the performance headroom needed for future software updates and feature enhancements.

Ready to integrate automotive-grade UFS 3.1 storage into your next design? Contact our technical sales team today to request a quote for the FBFS512GBB-EB40, discuss volume pricing, or receive application-specific guidance for your project requirements.