FBFS512GBE-EB40

The FBFS512GBE-EB40 from Flexxon is a high-capacity 512GB embedded storage solution built on the UFS 3.1 interface standard. Utilizing advanced 3D TLC NAND flash technology in a compact 153-ball FBGA package, this non-volatile memory device delivers robust performance for industrial applications requiring reliable, high-speed data storage in space-constrained designs.

Designed for demanding industrial environments, the FBFS512GBE-EB40 operates across an extended temperature range of -40°C to 85°C, making it ideal for edge computing, industrial IoT, ruggedized mobile devices, and embedded systems where consistent performance and long-term reliability are essential.

Key Features

• High-Capacity Storage
  512GB (4.096 Tbit) of non-volatile flash memory provides ample space for data-intensive applications, operating system images, application code, and logging in industrial and embedded systems.
• UFS 3.1 Interface
  Industry-standard UFS 3.1 protocol delivers high-speed sequential and random access performance, optimized for modern embedded applications requiring fast boot times and responsive data access.
• Advanced 3D TLC Technology
  Built using 3D triple-level cell NAND architecture, offering an optimal balance of density, performance, and cost-effectiveness for industrial-grade embedded storage applications.
• Industrial Temperature Range
  Qualified for -40°C to 85°C operation, ensuring reliable performance in harsh environmental conditions including outdoor installations, industrial equipment, and transportation systems.
• Compact Surface-Mount Package
  153-ball FBGA package measuring just 11.5×13×1.52mm enables high-density PCB layouts and integration into space-constrained embedded designs.
• RoHS Compliant
  Manufactured to meet RoHS environmental compliance standards, supporting sustainable product development and global market requirements.

Typical Applications

• Industrial Edge Computing
  Provides reliable, high-capacity storage for edge servers, gateways, and industrial PCs processing and caching data locally in factory automation and industrial IoT deployments.
• Ruggedized Mobile Devices
  Ideal for handheld terminals, portable diagnostic equipment, and field service devices operating in challenging industrial environments with extended temperature exposure.
• Transportation and Telematics
  Supports in-vehicle computing systems, fleet management devices, and transportation infrastructure equipment requiring reliable data storage across wide temperature ranges.
• Smart City Infrastructure
  Enables embedded storage in outdoor surveillance systems, traffic management equipment, and environmental monitoring stations exposed to temperature extremes.
• Medical and Healthcare Equipment
  Powers portable diagnostic devices, patient monitoring systems, and medical imaging equipment requiring dependable, high-capacity storage in compact form factors.

Unique Advantages

• Industrial-Grade Reliability:
  Extended temperature qualification and industrial-grade construction ensure consistent operation in demanding environments where consumer-grade components would fail.
• Space-Efficient Integration:
  The compact 11.5×13mm FBGA footprint minimizes PCB real estate requirements, enabling smaller product designs and more flexible board layouts in space-constrained applications.
• Performance-Optimized Architecture:
  UFS 3.1 interface combined with 3D TLC technology delivers the read/write performance needed for modern embedded applications including fast boot, real-time logging, and responsive user interfaces.
• Simplified BOM Management:
  High 512GB capacity in a single component reduces the need for multiple memory devices, simplifying procurement, inventory management, and design complexity.
• Future-Proof Capacity:
  512GB storage headroom accommodates growing application requirements, extended data retention, and feature expansion without hardware redesign.
• Environmental Compliance:
  RoHS-compliant manufacturing supports regulatory requirements and corporate sustainability goals for global product distribution.

Why Choose the FBFS512GBE-EB40?

The FBFS512GBE-EB40 combines high-capacity storage, industrial-grade reliability, and modern interface performance in a compact, surface-mount package. Its -40°C to 85°C operating range and robust construction make it the right choice for embedded system designers developing products for industrial, transportation, and outdoor applications where environmental stress and long-term reliability are critical considerations.

With 512GB of 3D TLC flash memory accessible via the UFS 3.1 interface, this Flexxon BGA UFS solution provides the storage performance and capacity headroom needed for next-generation industrial embedded systems, while its compact 153-ball FBGA package enables integration into space-constrained designs without compromising functionality.

Ready to integrate industrial-grade UFS 3.1 storage into your next embedded design? Request a quote for the FBFS512GBE-EB40 today to discuss volume pricing, lead times, and technical support for your project requirements.