FC51J32SJTS2A (2D)

The FC51J32SJTS2A (2D) is an industrial-grade eMMC flash memory device from ESMT that combines 3D TLC NAND with the JEDEC eMMC 5.1 interface. It provides a managed non-volatile storage solution in a compact 153-ball BGA package and is specified for operation from -40 °C to 85 °C.

With a 32 GB user capacity (31,096,569,856 bytes), multi-bit bus width support and high-speed modes documented in the datasheet, the device targets embedded and industrial systems that require a standardized, board-level removable storage option with defined boot and RPMB partitions.

Key Features

• Memory Capacity — 32 GB user capacity (31,096,569,856 bytes) implemented as 32G × 8 (274.9 Gbit).
• eMMC 5.1 Interface — Compliant with JEDEC eMMC 5.1 electrical standard; supports 1-bit (default), 4-bit and 8-bit data bus widths.
• High-Speed Performance — Datasheet-listed sequential performance for the FC51J32SJTS2A-2.5BWGI2D variant: up to 250 MB/s read and 210 MB/s write (measured with 8-bit bus in HS400 mode per ESMT tool).
• Operating Frequency — 200 MHz device clock specification for high-speed modes.
• Power and Voltage — Product listing indicates a 2.5 V supply; datasheet specifies VCCQ ranges (1.70–1.95 V or 2.7–3.6 V) and VCC (2.7–3.6 V) options consistent with eMMC power domains.
• Industrial Temperature Range — Guaranteed operation from -40 °C to 85 °C (TCASE), with the same range listed for storage.
• Package & Mounting — 153-ball BGA surface mount package (11.5 × 13 mm footprint referenced in datasheet packaging figures).
• Partitioning — Defined boot partitions and RPMB: Boot Partition 1 = 4096 KB, Boot Partition 2 = 4096 KB, RPMB = 4096 KB.
• Standards & Compliance — RoHS compliant; Pb-free package option listed in ordering information.
• Sector Size — Device does not support 4 KB large sector size (per datasheet note).

Typical Applications

• Industrial Embedded Storage — Designed for industrial systems requiring non-volatile storage across a wide operating temperature range.
• Board-Level Flash for Embedded Controllers — eMMC 5.1 interface and defined boot/RPMB partitions make it suitable for embedded controllers and single-board computers that use standard eMMC sockets.
• Edge and Field Devices — Compact 153-ball BGA package and industrial grade specification fit space-constrained devices operating in field conditions.

Unique Advantages

• Wide temperature tolerance — Specified for -40 °C to 85 °C operation, supporting deployment in harsh industrial environments.
• Standardized interface — JEDEC eMMC 5.1 compatibility simplifies integration with host controllers that support the eMMC protocol and bus widths.
• Measured high-speed throughput — Datasheet performance figures (up to 250 MB/s read, 210 MB/s write in HS400/8-bit conditions) provide clear expectations for sequential data transfer capacity.
• Defined boot and security partitions — Boot Partition and RPMB sizing (4,096 KB each) enable bootloader placement and authenticated storage use cases.
• Compact BGA packaging — 153-ball BGA reduces board footprint while providing robust soldered mounting for industrial assemblies.
• Regulatory compliance — RoHS compliant and offered in Pb-free package per ordering information.

Why Choose FC51J32SJTS2A (2D)?

The FC51J32SJTS2A (2D) delivers a purpose-built eMMC 5.1 storage option for industrial and embedded designs where wide temperature operation, standardized host interface, and defined partitioning matter. Backed by ESMT specifications and datasheet performance data, it provides predictable sequential throughput and a compact BGA footprint for space-constrained boards.

This device is well suited to engineers and procurement teams specifying managed flash for industrial controllers, embedded systems, or edge devices that require a JEDEC-compliant eMMC solution with documented electrical and timing specifications.

Request a quote or submit an inquiry to get pricing and availability for the ESMT FC51J32SJTS2A (2D) eMMC device.