FDME001GSE-N330

eSD Memory Card (MLC/pSLC/SLC)
Part Description

FDME001GSE-N330 1GB eSD SLC

Quantity 1,426 Available (as of May 5, 2026)
Product CategoryMemory
ManufacturerFlexxon
Manufacturing StatusActive
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package100-BGAMemory FormatFLASHTechnologySLC
Memory Size8 GbitGradeIndustrialClock FrequencyN/A
Voltage2.7 ~ 3.6VMemory TypeNon-VolatileOperating Temperature-40°C - 85°C
Packaging100-BGAMounting MethodSurface MountMemory InterfaceSD 2.0/3.0
Memory OrganizationN/AMoisture Sensitivity Level3RoHS ComplianceCompliant
REACH ComplianceREACH UnknownQualificationN/AECCNEAR99
HTS Code8542.32.00.71

Overview of FDME001GSE-N330 – 1GB Industrial-Grade Embedded SD Memory Card

The FDME001GSE-N330 is a 1GB embedded SD (eSD) memory card featuring SLC NAND flash technology in a compact 100-pin BGA surface-mount package. Designed for embedded systems requiring reliable, non-volatile storage, this industrial-grade memory solution delivers robust performance across extended temperature ranges from -40°C to 85°C. Compliant with SD 2.0/3.0 interface specifications, the FDME001GSE-N330 provides high data transfer rates, exceptional reliability, and power loss protection for demanding industrial, instrumentation, and embedded computing applications.

With its JEDEC-standard 100-ball BGA footprint and surface-mount design, this eSD card integrates seamlessly into space-constrained embedded designs while delivering the proven reliability of SLC flash technology. The combination of industrial temperature tolerance, wide voltage supply support (2.7V to 3.6V), and robust data management features makes the FDME001GSE-N330 an ideal storage solution for mission-critical embedded applications requiring long-term data retention and operational dependability.

Key Features

  • 1GB SLC NAND Flash Memory
    8 Gbit non-volatile flash storage utilizing Single-Level Cell (SLC) technology delivers superior endurance, faster write speeds, and enhanced reliability compared to MLC alternatives, making it ideal for applications with frequent write cycles and demanding operational requirements.
  • SD 2.0/3.0 Interface Compatibility
    Standard SD interface ensures broad compatibility with a wide range of embedded processors, microcontrollers, and system-on-chip platforms. Supports high-speed data transfer modes including SDR12, SDR25, SDR50, SDR104, and DDR50 for flexible performance scaling.
  • Industrial Temperature Range
    Qualified for operation from -40°C to 85°C, enabling reliable performance in harsh industrial environments, outdoor installations, automotive systems, and other applications exposed to extreme temperature conditions.
  • Wide Voltage Supply Range
    Operates across 2.7V to 3.6V supply voltage, providing compatibility with both 3.3V and lower-voltage embedded systems while simplifying power supply design and enhancing system flexibility.
  • Compact Surface Mount Package
    100-pin BGA package optimized for space-constrained embedded designs. Surface-mount construction enables automated assembly processes and reduces overall system footprint compared to socketed memory card solutions.
  • Advanced Data Protection
    Built-in power loss protection and read/program disturb management ensure data integrity during unexpected power interruptions and throughout the device lifecycle, critical for industrial control and data logging applications.
  • RoHS Compliant
    Fully compliant with RoHS environmental standards, meeting regulatory requirements for lead-free manufacturing and supporting environmentally responsible product development.

Typical Applications

  • Industrial Control Systems
    Provides reliable program code storage, configuration data retention, and event logging for PLCs, industrial controllers, and automation equipment operating in factory environments with extended temperature exposure.
  • Instrumentation and Test Equipment
    Delivers dependable non-volatile storage for measurement data, calibration parameters, and firmware in laboratory instruments, field measurement devices, and portable test equipment requiring high data integrity.
  • Embedded Computing Platforms
    Serves as boot media, operating system storage, and application data repository for embedded single-board computers, industrial PCs, and edge computing devices in IoT and industrial networking applications.
  • Medical Device Electronics
    Supports firmware storage and patient data logging in medical diagnostic equipment, patient monitoring systems, and portable medical devices requiring reliable operation across varying environmental conditions.
  • Transportation and Fleet Management
    Enables data recording, GPS track logging, and system configuration storage in vehicle tracking systems, fleet management devices, and transportation monitoring equipment exposed to temperature extremes and vibration.

Unique Advantages

  • SLC Technology Reliability: Single-Level Cell flash architecture provides superior endurance with higher write cycle ratings compared to MLC or TLC alternatives, reducing long-term maintenance costs and extending product lifecycle in write-intensive applications.
  • Industrial-Grade Qualification: Extended -40°C to 85°C temperature qualification ensures consistent performance across harsh operating environments without derating, eliminating the need for thermal management solutions in many applications.
  • Embedded Design Integration: JEDEC-standard 100-BGA package and SD interface compatibility simplify board layout and reduce engineering effort, enabling faster time-to-market while maintaining design flexibility for future capacity scaling.
  • Enhanced Data Integrity: Built-in power loss protection safeguards against data corruption during unexpected shutdowns or power interruptions, critical for industrial control systems and data acquisition applications where data loss is unacceptable.
  • Space-Efficient Solution: Surface-mount BGA package eliminates the need for socketed card connectors, reducing board space requirements, improving shock and vibration resistance, and lowering total system cost compared to removable card implementations.
  • Flexible Voltage Operation: Wide 2.7V to 3.6V supply voltage range accommodates diverse power architectures and simplifies integration into both legacy 3.3V systems and modern low-power embedded platforms without external level translation circuitry.

Why Choose FDME001GSE-N330?

The FDME001GSE-N330 combines proven SLC flash reliability with industrial-grade qualification and flexible system integration capabilities, making it the ideal choice for engineers developing embedded systems that demand long-term data retention and operational dependability. Its SD-compatible interface, wide voltage tolerance, and compact surface-mount package address the key requirements of modern embedded designs: reliability, compatibility, and space efficiency.

For applications requiring predictable performance across harsh environmental conditions—from factory automation to field instrumentation—the FDME001GSE-N330 delivers the endurance, data protection, and thermal robustness needed for mission-critical deployments. Flexxon's focus on industrial memory solutions ensures this eSD card meets the rigorous demands of professional embedded applications while maintaining the standard interfaces and form factors that simplify design integration and enable long-term product support.

Ready to integrate reliable industrial-grade embedded storage into your next design? Request a quote for the FDME001GSE-N330 today and discover how SLC-based eSD memory can enhance your product's performance and reliability. Our team is available to discuss your specific application requirements and provide technical guidance for optimal integration.

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    Headquarters: Singapore


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