FC51E08SQP1A (2A)

The FC51E08SQP1A (2A) is an industrial-grade embedded MultiMediaCard (eMMC) flash memory device offering 68.72 Gbit of non-volatile FLASH storage in an eMMC 5.1 implementation. It provides an 8G × 8 memory organization (8 GB user density as listed in the datasheet) with support for 1‑, 4‑ and 8‑bit data bus widths and a 200 MHz device clock.

Designed for compact, surface-mount integration, the device is supplied in a 153-ball BGA package and supports industrial operating temperatures from −40 °C to 85 °C. Measured sequential performance in ESMT documentation reaches up to 180 MB/s read and 80 MB/s write on an 8‑bit bus in HS400 mode.

Key Features

• Memory Capacity & Organization — 68.72 Gbit total density with an 8G × 8 organization corresponding to an 8 GB user density (7,818,182,656 bytes as indicated in the datasheet).
• eMMC 5.1 Interface — Compliant with JEDEC eMMC 5.1 electrical standard; supports 1‑, 4‑ and 8‑bit bus widths for flexible host integration.
• High-speed Modes & Performance — Device clock rated to 200 MHz; documented sequential throughput up to 180 MB/s read and 80 MB/s write (measured on 8‑bit HS400 configuration per ESMT data).
• Power — Product data lists a 2.5 V supply; the datasheet details interface and memory power ranges for VCCQ and VCC for system design reference.
• Industrial Temperature Range — Specified operating temperature range of −40 °C to 85 °C for deployment in temperature-challenging environments.
• Partitions and Security Areas — Boot Partition 1, Boot Partition 2 and RPMB each sized at 4096 KB as defined in the device capacity partitioning.
• Package & Mounting — 153-ball BGA surface-mount package (compact footprint for embedded designs).
• Compliance — RoHS compliant as indicated in the product data.

Typical Applications

• Industrial Embedded Storage — On-board non-volatile storage for industrial systems that require an eMMC form factor and industrial temperature support.
• Systems Requiring Boot Partitions — Designs that use dedicated boot areas, leveraging the device’s Boot Partition 1 and 2 allocations.
• Secure Data Regions — Use cases that rely on an RPMB (Replay Protected Memory Block) for secure storage, with the device providing a 4096 KB RPMB partition.
• Compact Surface-Mount Designs — Applications that benefit from a small 153-ball BGA package for space-constrained PCBs.

Unique Advantages

• Embedded eMMC 5.1 Connectivity: Direct integration with hosts supporting the eMMC 5.1 standard and multiple bus widths simplifies interface design.
• Measured High Throughput: Documented sequential read/write figures (up to 180/80 MB/s in 8‑bit HS400 mode) help accelerate data-transfer use cases where higher sustained throughput is required.
• Industrial Temperature Support: Operation from −40 °C to 85 °C supports deployment in demanding environmental conditions without derating device selection.
• Partition Flexibility: Predefined boot partitions and RPMB area provide system-level partitioning for boot, firmware and secure storage needs.
• Compact BGA Packaging: The 153-ball BGA surface-mount package enables high-density PCB layouts while maintaining reliable soldered connectivity.
• Standards-Based Integration: JEDEC eMMC 5.1 compliance (per datasheet) aligns the device with established host controllers and software stacks that use the eMMC standard.

Why Choose FC51E08SQP1A (2A)?

The FC51E08SQP1A (2A) positions itself as a practical embedded storage option for designs that require JEDEC eMMC 5.1 compatibility, a compact 153-ball BGA footprint, and industrial temperature operation. Its documented sequential performance in HS400 mode and flexible 1/4/8-bit bus widths provide predictable throughput and interface options for system architects.

This device is suited to engineers and procurement teams specifying on-board non-volatile storage with defined boot and RPMB partitions, compact surface-mount integration, and RoHS compliance. The combination of measured performance figures, industrial-grade temperature range, and eMMC 5.1 feature set supports long-term deployment and straightforward host integration.

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