FBFS512GBG-EA40

The FBFS512GBG-EA40 is a high-capacity 512GB Universal Flash Storage (UFS) 2.2 solution from Flexxon, designed to deliver robust non-volatile memory performance for industrial applications. Built on advanced 3D TLC NAND technology and housed in a compact 153-ball BGA package, this surface-mount storage device provides reliable, high-speed data access in space-constrained embedded systems. With industrial-grade temperature tolerance from -25°C to 85°C, the FBFS512GBG-EA40 is engineered for mission-critical deployments where both capacity and environmental resilience are essential.

This UFS 2.2 flash storage module offers a powerful combination of density, speed, and durability, making it ideal for edge computing, industrial automation, medical devices, and ruggedized embedded platforms that demand sustained performance across challenging operating conditions.

Key Features

• High-Capacity 512GB Storage
  Delivers 4.096 Tbit (512 gigabytes) of non-volatile flash memory organized as 512G × 8, providing ample space for data logging, firmware, media files, and application storage in embedded systems.
• UFS 2.2 Interface
  Implements the Universal Flash Storage 2.2 standard, enabling high-speed serial data transfer with lower power consumption and reduced pin count compared to legacy parallel flash interfaces, streamlining PCB design and improving system responsiveness.
• 3D TLC NAND Technology
  Utilizes three-dimensional triple-level cell NAND flash architecture to achieve higher storage density and cost-efficiency, balancing performance and capacity for industrial workloads.
• Industrial Temperature Range
  Qualified for operation from -25°C to 85°C, ensuring reliable performance in factory automation, transportation systems, outdoor installations, and other environments subject to temperature extremes.
• Compact BGA Package
  Surface-mount 153-ball BGA in an 11.5 × 13 × 1.52 mm footprint enables integration into space-critical designs such as single-board computers, embedded modules, and handheld industrial devices.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, supporting green manufacturing initiatives and global regulatory requirements.

Typical Applications

• Industrial Automation and Control
  Provides reliable, high-capacity storage for PLCs, HMI panels, and industrial gateways that require fast boot times, firmware updates, and local data buffering in harsh factory environments.
• Edge Computing and IoT Gateways
  Supports edge analytics, machine learning inference, and data caching at the network edge, where high-speed storage and industrial temperature tolerance are critical for continuous operation.
• Medical and Diagnostic Equipment
  Enables secure storage of patient data, diagnostic images, and system firmware in portable and stationary medical devices that demand both capacity and reliability.
• Transportation and Fleet Management
  Ideal for onboard computing platforms, GPS trackers, and telematics systems that operate across wide temperature ranges and require high-capacity, ruggedized storage for trip logs and video data.
• Ruggedized Embedded Systems
  Suited for military, aerospace, and field-deployed systems where environmental resilience, compact form factor, and fast data access are mission-critical.

Unique Advantages

• Industrial-Grade Reliability:
  Engineered to withstand -25°C to 85°C operating temperatures, the FBFS512GBG-EA40 delivers consistent performance in environments where consumer-grade storage would fail, reducing system downtime and maintenance costs.
• Space-Efficient Integration:
  The compact 11.5 × 13 mm BGA footprint and surface-mount design minimize board real estate requirements, enabling denser system architectures and supporting miniaturization goals in industrial and embedded applications.
• High-Speed UFS 2.2 Interface:
  UFS 2.2 delivers superior throughput and lower latency compared to eMMC, accelerating boot times, application launches, and data transfers—critical for responsive embedded systems and real-time applications.
• Scalable Storage Capacity:
  With 512GB of onboard flash, the FBFS512GBG-EA40 eliminates the need for external storage expansion in many designs, simplifying system architecture and reducing BOM complexity.
• 3D TLC Cost Efficiency:
  3D TLC NAND technology provides an optimal balance between storage density and cost, making high-capacity industrial storage accessible for a broader range of embedded applications.
• RoHS Compliance:
  Environmental compliance simplifies global market access and supports corporate sustainability commitments, reducing regulatory risk for OEMs and system integrators.

Why Choose the FBFS512GBG-EA40?

The FBFS512GBG-EA40 combines high-capacity 512GB storage, industrial temperature resilience, and the performance advantages of UFS 2.2 in a compact, surface-mount package. This convergence of capacity, speed, and ruggedness makes it an ideal choice for embedded system designers who need reliable, high-performance storage that can withstand demanding operational environments. Whether you're developing industrial automation controllers, edge computing platforms, or ruggedized medical devices, the FBFS512GBG-EA40 delivers the storage foundation your application demands.

Flexxon's BGA UFS 2.2 series provides a proven, environmentally compliant storage solution backed by industrial-grade specifications, enabling faster time-to-market and long-term product reliability for mission-critical deployments.

Ready to integrate industrial-grade UFS 2.2 storage into your next design? Request a quote today to learn more about pricing, availability, and technical support for the FBFS512GBG-EA40.