FDME002GSE-N330

The FDME002GSE-N330 is a 2GB embedded SD (eSD) memory card from Flexxon, built on proven SLC (Single-Level Cell) NAND flash technology. Designed for industrial applications demanding high reliability and extended temperature operation, this surface-mount memory solution delivers SD 2.0/3.0 interface compatibility in a compact 100-BGA package. With a wide operating voltage range of 2.7V to 3.6V and industrial-grade temperature tolerance from -40°C to 85°C, the FDME002GSE-N330 provides dependable non-volatile storage for embedded systems requiring consistent performance in challenging environments.

This eSD memory card combines high data transfer rates, strong random IOPS performance, and advanced features including Power Loss Protection and read/program disturb management. The SLC architecture ensures superior endurance and data retention compared to MLC alternatives, making it ideal for applications where write-intensive operations and mission-critical data integrity are paramount. RoHS-compliant and ready for integration, the FDME002GSE-N330 delivers a robust storage solution for industrial control systems, automation equipment, and embedded computing platforms.

Key Features

• SLC NAND Flash Technology
  Single-Level Cell architecture provides superior endurance, faster write speeds, and extended data retention compared to multi-level cell alternatives, ensuring reliable performance throughout the product lifecycle.
• 2GB Storage Capacity (16 Gbit)
  Provides ample non-volatile flash memory for embedded applications requiring persistent storage of firmware, configuration data, logs, and operational parameters.
• SD 2.0/3.0 Interface Compatibility
  Standard SD interface ensures broad compatibility with existing embedded system designs, supporting Default, High-Speed, SDR12, SDR25, SDR50, SDR104, and DDR50 operating modes for flexible performance options.
• Industrial Temperature Range
  Operates reliably across -40°C to 85°C, meeting the demands of industrial automation, outdoor installations, and harsh environment deployments where consumer-grade memory would fail.
• Wide Operating Voltage Range
  2.7V to 3.6V supply voltage tolerance accommodates various system power architectures and enables compatibility with both 3.3V and lower-voltage embedded platforms.
• Power Loss Protection
  Integrated safeguards protect data integrity during unexpected power interruptions, critical for industrial control systems and applications where data corruption would cause system failures or safety concerns.
• Compact Surface-Mount Package
  100-BGA form factor enables direct PCB mounting for space-constrained embedded designs, eliminating the need for card sockets and reducing system footprint while improving mechanical reliability.
• Advanced Management Features
  Built-in read/program disturb management and other reliability mechanisms ensure consistent performance and extend operational life in write-intensive applications.
• RoHS Compliant
  Meets environmental compliance standards for lead-free manufacturing and global market requirements.

Typical Applications

• Industrial Automation and Control Systems
  Provides reliable data logging, configuration storage, and firmware retention for PLCs, HMIs, and process control equipment operating in factory environments with temperature extremes and power fluctuations.
• Embedded Computing Platforms
  Serves as boot media and persistent storage for single-board computers, embedded Linux systems, and real-time operating system platforms requiring dependable non-volatile memory with industrial-grade reliability.
• Data Acquisition and Instrumentation
  Stores measurement data, calibration parameters, and event logs in test equipment, monitoring systems, and scientific instruments where data integrity and long-term retention are essential.
• Transportation and Fleet Systems
  Enables rugged storage solutions for vehicle telematics, fleet management devices, and transit system controllers exposed to vibration, temperature cycling, and harsh operating conditions.
• Communication Infrastructure
  Provides configuration storage and system logging for routers, gateways, network appliances, and telecom equipment requiring reliable memory that withstands extended operation in uncontrolled environments.

Unique Advantages

• SLC Reliability for Mission-Critical Applications
  Single-Level Cell technology delivers significantly higher endurance cycles and longer data retention than MLC or TLC alternatives, reducing warranty costs and field failures in industrial deployments.
• Simplified BOM with Integrated Package
  Surface-mount BGA format eliminates external card sockets, reducing component count, assembly complexity, and potential mechanical failure points while improving shock and vibration resistance.
• Power-Resilient Design
  Built-in Power Loss Protection prevents data corruption during unexpected shutdowns, critical for industrial equipment where power instability is common and data integrity directly impacts operational safety.
• Extended Temperature Operation Without Derating
  Full -40°C to 85°C specification ensures consistent performance across the industrial temperature range, eliminating the need for thermal management in most embedded applications.
• Multiple Speed Mode Support
  SD 2.0/3.0 interface with support for Default through DDR50 modes allows system designers to optimize for power efficiency or performance based on specific application requirements.
• Proven Industrial-Grade Platform
  Part of Flexxon's comprehensive eSD memory card series spanning 512MB to 64GB, offering a clear upgrade path and consistent interface as application storage requirements evolve.

Why Choose the FDME002GSE-N330?

The FDME002GSE-N330 delivers the combination of reliability, performance, and environmental resilience that industrial embedded systems demand. Its SLC flash technology provides the endurance and data retention required for applications with frequent write cycles and long field lifetimes, while the industrial temperature rating and wide voltage tolerance ensure operation in challenging environments where consumer-grade memory cannot be trusted. The compact surface-mount package reduces system complexity and improves mechanical robustness compared to socketed card solutions.

For engineers designing automation controllers, embedded computing platforms, data acquisition systems, or communication infrastructure, the FDME002GSE-N330 offers a field-proven storage solution backed by comprehensive datasheet specifications and standard SD interface compatibility. Its Power Loss Protection and advanced management features provide peace of mind in applications where data integrity is non-negotiable, while RoHS compliance ensures global market readiness. Whether you're upgrading legacy designs or developing new industrial equipment, the FDME002GSE-N330 delivers the reliable, long-life storage foundation your embedded system requires.

Ready to integrate industrial-grade SLC storage into your next embedded design? Request a quote for the FDME002GSE-N330 today to discuss your specific application requirements, volume pricing, and technical support options. Our team can help you select the optimal capacity and configuration from Flexxon's eSD memory card series to match your performance, reliability, and lifecycle needs.