FDME008GME-N230

The FDME008GME-N230 is an 8GB embedded SD (eSD) memory card from Flexxon, featuring Multi-Level Cell (MLC) NAND flash technology in a compact 100-BGA surface-mount package. Designed to meet the demanding requirements of industrial applications, this non-volatile memory solution delivers high data transfer rates, robust reliability, and wide temperature operation from -40°C to 85°C. Compatible with SD 2.0/3.0 interface specifications and JEDEC 100-ball BGA standards, the FDME008GME-N230 provides an integrated storage solution for embedded systems requiring persistent data retention in challenging environments.

Engineered for industrial-grade performance, this eSD memory card combines the capacity and speed benefits of MLC flash with features such as high random IOPS, power loss protection, and read/program disturb management. The surface-mount BGA format enables direct PCB integration, making it ideal for space-constrained designs where traditional removable SD cards are impractical. With full RoHS compliance and support for both SD system specification version 3.0 and SD SPI mode, the FDME008GME-N230 offers designers a reliable, standards-compliant storage solution for embedded industrial systems.

Key Features

• 8GB Storage Capacity with MLC Flash Technology
  Utilizes 64 Gbit Multi-Level Cell NAND flash to provide 8GB of non-volatile storage, balancing capacity, performance, and endurance for industrial data logging, firmware storage, and embedded applications.
• SD 2.0/3.0 Interface Compatibility
  Implements standard SD interface protocols including support for SD system specification version 3.0 and SD SPI mode, ensuring broad compatibility with existing SD host controllers and simplified integration into embedded designs. Supports multiple speed modes including Default, High-Speed, SDR12, SDR25, SDR50, SDR104, and DDR50 for flexible performance scaling.
• Industrial Temperature Range
  Operates reliably across -40°C to 85°C, enabling deployment in harsh industrial environments, automotive under-hood applications, outdoor equipment, and other temperature-extreme conditions where consumer-grade storage would fail.
• Compact 100-BGA Surface Mount Package
  The 100-ball BGA package enables direct soldering to the PCB, providing a secure, vibration-resistant connection ideal for mobile and harsh-environment applications while minimizing board space compared to socket-based solutions.
• Wide Voltage Supply Range
  Operates from 2.7V to 3.6V, providing compatibility with standard 3.3V logic systems and tolerance for voltage variations in real-world power supply conditions.
• Data Protection and Reliability Features
  Incorporates power loss protection, read/program disturb management, and other reliability mechanisms designed to ensure data integrity and extend operational lifespan in demanding industrial use cases.
• RoHS Compliant
  Fully compliant with RoHS environmental standards, meeting regulatory requirements for lead-free manufacturing and environmental responsibility.

Typical Applications

• Industrial Control Systems
  Provides reliable non-volatile storage for PLCs, industrial controllers, and automation equipment requiring firmware storage, configuration data retention, and operational logging in factory floor environments.
• Embedded Computing Platforms
  Serves as boot media and primary storage for embedded Linux, Android, and RTOS-based systems in single-board computers, gateway devices, and edge computing applications where soldered storage ensures reliability.
• Data Logging and Instrumentation
  Enables high-speed data capture and long-term storage in test equipment, measurement instruments, and field data recorders operating across wide temperature ranges.
• Medical and Healthcare Devices
  Supports firmware storage and patient data logging in portable medical devices, diagnostic equipment, and healthcare monitoring systems requiring reliable, compact storage solutions.
• Transportation and Fleet Management
  Provides rugged storage for telematics systems, fleet tracking devices, and transportation control units exposed to vibration, shock, and temperature extremes.

Unique Advantages

• Soldered Reliability for Mission-Critical Applications
  The surface-mount BGA package eliminates connector failures, contact corrosion, and accidental removal issues associated with socketed SD cards, ensuring continuous operation in vibration-prone and harsh environments.
• High Performance with Multiple Speed Modes
  Support for advanced SD 3.0 speed modes including SDR50, SDR104, and DDR50 enables high data transfer rates and random IOPS performance, reducing bottlenecks in data-intensive applications.
• Industrial-Grade Temperature and Voltage Tolerance
  The -40°C to 85°C operating range combined with 2.7V to 3.6V supply tolerance ensures reliable operation across varying environmental conditions and power supply fluctuations common in industrial deployments.
• Standards-Based Integration
  Full compatibility with SD 2.0/3.0 specifications and JEDEC 100-ball BGA standards ensures straightforward design-in with existing SD host controllers, reducing development time and leveraging proven software stacks.
• Enhanced Data Integrity Features
  Built-in power loss protection and read/program disturb management mechanisms safeguard data integrity during unexpected power interruptions and extend the operational lifespan of the flash memory.
• Space-Efficient Form Factor
  The compact 100-BGA footprint minimizes PCB real estate requirements, enabling storage integration in space-constrained designs such as handheld devices, compact industrial modules, and miniaturized embedded systems.

Why Choose the FDME008GME-N230?

The FDME008GME-N230 delivers the performance and reliability required for industrial embedded storage applications where traditional removable SD cards fall short. By combining 8GB of MLC flash capacity with industrial temperature ratings, surface-mount reliability, and comprehensive data protection features, this eSD memory card addresses the specific challenges of embedded system designers working in demanding environments. The standards-compliant SD interface ensures compatibility with a wide ecosystem of host controllers and software, while the 100-BGA package provides the mechanical robustness necessary for high-vibration and temperature-extreme deployments.

For engineers developing industrial control systems, embedded computing platforms, medical devices, or rugged data logging equipment, the FDME008GME-N230 offers a proven storage solution that balances capacity, performance, and environmental resilience. Flexxon's focus on industrial-grade memory products ensures long-term availability and consistent quality, making the FDME008GME-N230 a dependable choice for designs requiring multi-year production lifecycles and field service lifetimes.

Ready to integrate reliable industrial-grade storage into your next embedded design? Contact our sales team today to request a quote for the FDME008GME-N230 or to discuss how this eSD memory solution can meet your specific application requirements.