FBFS512GBA-EA40
| Part Description |
FBFS512GBA-EA40 512GB UFS 2.2 |
|---|---|
| Quantity | 1,058 Available (as of May 5, 2026) |
Specifications & Environmental
| Device Package | 153 BGA | Memory Format | FLASH | Technology | 3D TLC | ||
|---|---|---|---|---|---|---|---|
| Memory Size | 4.096 Tbit | Grade | Automotive grade 3 | Clock Frequency | N/A | ||
| Voltage | N/A | Memory Type | Non-Volatile | Operating Temperature | -40°C - 85°C | ||
| Packaging | 11.5x13x1.52mm | Mounting Method | Surface Mount | Memory Interface | UFS 2.2 | ||
| Memory Organization | 512G x 8 | Moisture Sensitivity Level | 3 | RoHS Compliance | Compliant | ||
| REACH Compliance | REACH Unknown | Qualification | AEC-Q100 Grade 3 | ECCN | EAR99 | ||
| HTS Code | 8542.32.00.71 |
Overview of FBFS512GBA-EA40 – 512GB Automotive-Grade UFS 2.2 Embedded Flash Storage
The FBFS512GBA-EA40 is a high-capacity 512GB embedded flash storage solution from Flexxon's BGA UFS 2.2 series. Built on 3D TLC NAND technology and organized as 512Gbit × 8, this non-volatile memory device delivers robust performance through the UFS 2.2 interface. Designed to meet the demanding requirements of automotive and industrial applications, this surface-mount storage module offers reliable data retention across extended temperature ranges while maintaining a compact 11.5×13×1.52mm footprint.
AEC-Q100 Grade 3 qualified and engineered for automotive-grade reliability, the FBFS512GBA-EA40 addresses the growing need for high-capacity, high-speed storage in next-generation embedded systems. Whether deployed in automotive infotainment, advanced driver assistance systems, industrial controllers, or rugged computing platforms, this UFS 2.2 solution provides the combination of capacity, speed, and environmental resilience required for mission-critical applications.
Key Features
- High-Capacity 3D TLC Flash Storage
Delivers 512GB (4.096 Tbit) of non-volatile storage using advanced 3D TLC NAND technology, providing ample space for operating systems, applications, multimedia content, and data logging in embedded systems. - UFS 2.2 High-Speed Interface
Features the UFS 2.2 interface standard, enabling fast sequential and random read/write performance with low latency, significantly outperforming traditional eMMC solutions for data-intensive applications. - Automotive-Grade Qualification
AEC-Q100 Grade 3 qualified, ensuring reliability and quality standards suitable for automotive and other high-reliability applications requiring extended temperature operation and long product lifecycles. - Extended Temperature Range
Operates reliably across -40°C to +85°C, supporting deployment in harsh automotive, industrial, and outdoor environments where temperature extremes are common. - Compact BGA Package
Housed in a space-efficient 153-ball BGA package measuring just 11.5×13×1.52mm, enabling integration into space-constrained designs while maintaining thermal and electrical performance. - Memory Organization
Organized as 512Gbit × 8 architecture, optimizing data throughput and access patterns for modern embedded system requirements. - RoHS Compliant
Fully compliant with RoHS environmental standards, supporting green manufacturing initiatives and global regulatory requirements.
Typical Applications
- Automotive Infotainment Systems
Provides high-capacity storage for navigation maps, multimedia libraries, user profiles, and system software in next-generation in-vehicle infotainment platforms requiring fast boot times and responsive user experiences. - Advanced Driver Assistance Systems (ADAS)
Stores critical system software, map data, and enables high-speed data logging for sensor fusion, camera processing, and AI-based driver assistance features in modern vehicles. - Industrial Control and Automation
Delivers reliable storage for industrial controllers, HMI systems, and data acquisition platforms operating in harsh environments with extended temperature ranges and long service life requirements. - Rugged Computing Platforms
Supports embedded computing systems deployed in transportation, defense, and outdoor applications where environmental resilience and high-speed storage are essential. - Edge Computing and IoT Gateways
Enables edge analytics, local data caching, and system software storage in industrial IoT gateways and edge servers requiring automotive-grade reliability and performance.
Unique Advantages
- Proven Automotive Reliability:
AEC-Q100 Grade 3 qualification provides confidence for automotive OEMs and tier-1 suppliers, ensuring the device meets stringent quality and reliability standards for vehicular deployment. - Superior Performance Over eMMC:
The UFS 2.2 interface architecture delivers significantly faster data throughput and lower latency compared to legacy eMMC solutions, enabling smoother application performance and faster system boot times. - High Capacity in Compact Form Factor:
512GB storage capacity in an 11.5×13mm footprint addresses the growing storage demands of multimedia-rich applications without consuming valuable board space in space-constrained designs. - Extended Temperature Operation:
The -40°C to +85°C operating range ensures reliable performance across automotive and industrial temperature extremes, eliminating the need for additional thermal management in many applications. - Surface Mount Integration:
BGA surface mount packaging enables automated assembly processes and robust mechanical attachment, reducing manufacturing complexity and improving long-term connection reliability. - Environmental Compliance:
RoHS compliance simplifies supply chain management and ensures compatibility with global environmental regulations, supporting green product initiatives and reducing regulatory risk.
Why Choose the FBFS512GBA-EA40?
The FBFS512GBA-EA40 delivers the perfect balance of capacity, performance, and reliability for demanding automotive and industrial embedded applications. Its AEC-Q100 Grade 3 qualification, combined with the high-speed UFS 2.2 interface and 512GB capacity, positions it as an ideal storage solution for next-generation systems that require both performance and environmental resilience. The extended -40°C to +85°C operating temperature range and compact BGA form factor make integration straightforward even in the most challenging thermal and space-constrained environments.
Backed by Flexxon's expertise in embedded storage solutions, the FBFS512GBA-EA40 offers long-term supply stability and proven quality for applications where reliability cannot be compromised. Whether you're designing automotive infotainment systems, ADAS platforms, industrial controllers, or rugged embedded computers, this UFS 2.2 storage module provides the foundation for responsive, data-intensive applications that must perform reliably over extended product lifecycles.
Ready to enhance your embedded design with automotive-grade, high-capacity UFS 2.2 storage? Request a quote for the FBFS512GBA-EA40 today to discuss your specific application requirements, volume pricing, and technical support options.

Date Founded: 2007
Headquarters: Singapore
Employees: 51-200
Revenue: NA
Certifications and Memberships: ISO9001:2015