FBFS256GBB-EB40

The FBFS256GBB-EB40 is a high-capacity 256GB (2.048 Tbit) Universal Flash Storage (UFS) 3.1 module from Flexxon, engineered to deliver robust non-volatile storage performance in demanding automotive environments. Built on advanced 3D TLC flash technology in a compact 153-ball FBGA package (11.5×13×1.4mm), this surface-mount memory solution offers the speed and reliability required for next-generation automotive infotainment, advanced driver-assistance systems (ADAS), and connected vehicle platforms.

Qualified to AEC-Q100 Grade 2 standards and rated for operation from -40°C to 105°C, the FBFS256GBB-EB40 combines high-density storage with automotive-grade durability. Its UFS 3.1 interface ensures fast data throughput while the 256G×8 memory organization provides flexible access for data-intensive applications. RoHS-compliant and designed for surface-mount integration, this module simplifies board design while meeting the stringent environmental and reliability requirements of automotive OEMs.

Key Features

• High-Capacity Storage
  256GB (2.048 Tbit) of non-volatile flash memory provides ample space for high-resolution maps, multimedia content, system logs, and over-the-air update packages in automotive applications.
• UFS 3.1 Interface
  Universal Flash Storage 3.1 protocol delivers enhanced data transfer speeds and improved power efficiency compared to legacy eMMC solutions, enabling faster boot times and responsive user experiences.
• 3D TLC NAND Technology
  Advanced three-dimensional triple-level cell architecture balances high storage density with cost efficiency while maintaining reliable performance across the automotive temperature range.
• Automotive-Grade Reliability
  AEC-Q100 Grade 2 qualification ensures the module meets rigorous automotive quality and reliability standards for components operating in extended temperature environments.
• Extended Temperature Range
  Operating temperature range of -40°C to 105°C supports deployment in harsh automotive environments, from cold-start conditions to under-hood or direct-sunlight exposure scenarios.
• Compact Surface-Mount Package
  153-ball FBGA package measuring just 11.5×13×1.4mm enables space-efficient PCB layouts in size-constrained automotive control modules and infotainment head units.
• Memory Organization
  256G×8 organization provides flexible addressing and efficient data access patterns optimized for both sequential media streaming and random access operations.
• Environmental Compliance
  RoHS-compliant construction meets global environmental regulations for automotive electronics manufacturing and end-of-life disposal requirements.

Typical Applications

• Automotive Infotainment Systems
  Stores operating system images, navigation databases, multimedia libraries, and user profiles in next-generation connected vehicle head units requiring fast boot and responsive UI performance.
• Advanced Driver-Assistance Systems (ADAS)
  Provides high-capacity storage for HD map data, camera calibration files, machine learning models, and sensor fusion algorithms in safety-critical driver assistance platforms.
• Digital Instrument Clusters
  Supports high-resolution graphics assets, configurable display themes, and system software for modern digital cockpit implementations requiring quick wake-from-sleep and smooth animation rendering.
• Telematics and Connected Vehicle Modules
  Enables local buffering of telemetry data, over-the-air update packages, and vehicle diagnostic logs in connected car gateways and telematics control units.
• Automotive Data Recorders
  Captures and stores event data, video footage, and sensor streams in automotive black box systems and fleet management recording devices operating across extreme temperature ranges.

Unique Advantages

• Automotive-Qualified for Mission-Critical Systems: AEC-Q100 Grade 2 certification provides OEMs with confidence in long-term reliability for safety-relevant and customer-facing automotive applications, reducing warranty risk and field failure rates.
• Next-Generation Interface Performance: UFS 3.1 protocol delivers significantly faster sequential and random I/O compared to eMMC, enabling richer user experiences, faster system updates, and improved multitasking in automotive compute platforms.
• Thermal Resilience for Harsh Environments: -40°C to 105°C operational range ensures consistent performance across extreme climate conditions and thermal cycling, from arctic cold starts to summer dashboard temperatures without derating.
• Space-Efficient Integration: Compact 11.5×13×1.4mm FBGA footprint minimizes PCB real estate requirements, enabling smaller module designs or freeing board space for additional functionality in densely packed automotive ECUs.
• High Density Reduces System Complexity: 256GB capacity in a single package eliminates the need for multiple lower-capacity devices or external storage expansion, simplifying BOM management, reducing assembly costs, and improving system reliability.
• Proven 3D NAND Foundation: Three-dimensional TLC flash architecture leverages mature, volume-production technology to deliver the balance of performance, endurance, and cost-effectiveness required for high-volume automotive deployments.

Why Choose the FBFS256GBB-EB40?

The FBFS256GBB-EB40 represents a purpose-built storage solution for automotive systems engineers who require the combination of high capacity, interface performance, and environmental qualification that modern connected vehicles demand. With its AEC-Q100 Grade 2 pedigree and extended temperature rating, this module addresses the unique reliability challenges of automotive electronics while the UFS 3.1 interface future-proofs designs against increasing data bandwidth requirements. The compact surface-mount package and RoHS compliance streamline manufacturing and global market access.

For development teams designing next-generation infotainment platforms, ADAS controllers, or connected vehicle systems, the FBFS256GBB-EB40 offers a proven foundation that balances technical performance with automotive-grade durability. Flexxon's focus on industrial and automotive memory solutions ensures access to technical support and quality assurance processes aligned with automotive tier-1 supplier requirements, making this module an ideal choice for designs targeting volume production and long product lifecycles.

Ready to integrate automotive-grade UFS 3.1 storage into your next design? Request a quote today to discuss pricing, lead times, and technical support for the FBFS256GBB-EB40. Our team is available to answer your questions and help you evaluate this solution for your specific application requirements.