FBFS256GBA-EB40

The FBFS256GBA-EB40 is a high-capacity 256GB (2.048 Tbit) Universal Flash Storage 3.1 memory module designed for demanding automotive and industrial applications. Built on advanced 3D TLC NAND technology and packaged in a compact 153-ball FBGA format (11.5×13×1.4mm), this non-volatile flash memory delivers reliable data storage in space-constrained embedded systems. AEC-Q100 Grade 3 qualified and automotive-grade certified, the FBFS256GBA-EB40 provides robust performance across a wide temperature range of -40°C to 85°C.

Engineered by Flexxon as part of their BGA UFS 3.1 series, this surface-mount memory solution addresses the growing need for high-speed, high-density storage in automotive infotainment systems, advanced driver assistance systems (ADAS), industrial control systems, and connected IoT devices. The UFS 3.1 interface enables superior sequential and random access performance compared to legacy storage technologies, making it ideal for applications requiring fast boot times, responsive data logging, and seamless multimedia playback.

Key Features

• High-Capacity Storage
  256GB (2.048 Tbit) capacity organized as 256G × 8, providing ample space for operating systems, applications, maps, multimedia content, and data logging in embedded systems.
• UFS 3.1 Interface
  Universal Flash Storage 3.1 protocol delivers high-speed data transfer with low latency, supporting demanding read/write operations required by modern automotive and industrial applications.
• Advanced 3D TLC NAND Technology
  3D triple-level cell architecture provides an optimal balance of density, performance, and cost-effectiveness while maintaining reliable data retention characteristics.
• Automotive-Grade Qualification
  AEC-Q100 Grade 3 certified, meeting stringent automotive reliability standards for use in vehicle cabin environments and industrial control applications.
• Extended Operating Temperature Range
  Rated for -40°C to 85°C operation, ensuring reliable performance across harsh automotive and industrial temperature environments.
• Compact Surface-Mount Package
  153-ball FBGA package measuring just 11.5×13×1.4mm enables integration into space-constrained designs while maintaining robust mechanical and thermal performance.
• RoHS Compliant
  Fully compliant with RoHS environmental standards for global manufacturing and distribution requirements.

Typical Applications

• Automotive Infotainment Systems
  Provides high-capacity storage for navigation maps, multimedia content, user profiles, and application data in in-vehicle entertainment and information systems requiring fast access and reliable operation across temperature extremes.
• Advanced Driver Assistance Systems (ADAS)
  Stores firmware, configuration data, and temporary sensor logs for ADAS applications where automotive-grade reliability and extended temperature operation are essential.
• Industrial Control and Automation
  Serves as the primary storage for embedded controllers, HMI systems, and data acquisition equipment in factory automation, process control, and industrial IoT applications operating in harsh environments.
• Connected Vehicle Systems
  Enables over-the-air update capabilities, diagnostic data logging, and application storage for telematics, connected car platforms, and fleet management systems.
• Ruggedized Computing Platforms
  Ideal for embedded computing modules, edge gateways, and ruggedized computing systems deployed in transportation, energy, and outdoor installations requiring automotive-grade reliability.

Unique Advantages

• Automotive-Qualified Reliability
  AEC-Q100 Grade 3 qualification provides confidence for automotive OEMs and Tier 1 suppliers, reducing qualification time and ensuring long-term supply chain stability for vehicle production lifecycles.
• Superior Performance Over eMMC
  UFS 3.1 architecture delivers significantly faster data transfer rates and lower latency compared to legacy eMMC solutions, enabling responsive user experiences and faster system boot times.
• Optimized Form Factor
  The compact 11.5×13×1.4mm FBGA package minimizes PCB footprint while the surface-mount design simplifies automated assembly processes and reduces manufacturing costs.
• Extended Temperature Reliability
  -40°C to 85°C operation ensures consistent performance in automotive cabin and under-hood applications as well as industrial environments with challenging thermal conditions.
• Future-Proof Capacity
  256GB capacity accommodates growing storage requirements for feature-rich automotive infotainment, high-resolution map data, and complex industrial applications without frequent redesigns.
• Simplified Supply Chain
  Single-component storage solution from Flexxon reduces BOM complexity and vendor management overhead while meeting environmental compliance requirements including RoHS.

Why Choose the FBFS256GBA-EB40?

The FBFS256GBA-EB40 delivers automotive-grade reliability, high capacity, and modern UFS 3.1 performance in a compact, surface-mount package designed specifically for demanding embedded applications. With AEC-Q100 Grade 3 qualification and an extended -40°C to 85°C operating temperature range, this memory solution meets the stringent requirements of automotive and industrial designers while providing the performance headroom needed for next-generation connected systems.

Whether you're developing advanced infotainment platforms, ruggedized industrial controllers, or connected vehicle systems, the FBFS256GBA-EB40 offers a proven, qualified storage solution that reduces design risk and accelerates time to market. The combination of 256GB capacity, 3D TLC reliability, and UFS 3.1 interface ensures your design remains competitive while meeting the long-term durability expectations of automotive and industrial customers.

Ready to integrate the FBFS256GBA-EB40 into your next automotive or industrial design? Request a quote today to discuss volume pricing, delivery schedules, and technical support for your specific application requirements.