 | | FIN1531MTC | Fairchild Semiconductor | IC DRIVER 4/0 16TSSOP | Drivers, Receivers, Transceivers | 16-TSSOP | 4.5V ~ 5.5V | -40°C ~ 85°C | Number of Drivers/Receivers: 4/0 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) Supplier Device Package: 16-TSSOP | 807 | |
 | | FIN1531MTCX | onsemi | IC DRIVER 4/0 16TSSOP | Drivers, Receivers, Transceivers | 16-TSSOP | 4.5V ~ 5.5V | -40°C ~ 85°C | Number of Drivers/Receivers: 4/0 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) Supplier Device Package: 16-TSSOP | 671 | |
 | N/A | FIN1531MX | onsemi | IC DRIVER 4/0 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 4.5V ~ 5.5V | -40°C ~ 85°C | Number of Drivers/Receivers: 4/0 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 1,092 | |
 | | FIN1532M | onsemi | IC RECEIVER 0/4 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 4.5V ~ 5.5V | -40°C ~ 85°C | Number of Drivers/Receivers: 0/4 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 778 | |
 | | FIN1532M | Fairchild Semiconductor | IC RECEIVER 0/4 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 4.5V ~ 5.5V | -40°C ~ 85°C | Number of Drivers/Receivers: 0/4 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 1,042 | |
 | | FIN1532MTC | onsemi | IC RECEIVER 0/4 16TSSOP | Drivers, Receivers, Transceivers | 16-TSSOP | 4.5V ~ 5.5V | -40°C ~ 85°C | Number of Drivers/Receivers: 0/4 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) Supplier Device Package: 16-TSSOP | 99 | |
 | | FIN1532MTC | Fairchild Semiconductor | IC RECEIVER 0/4 16TSSOP | Drivers, Receivers, Transceivers | 16-TSSOP | 4.5V ~ 5.5V | -40°C ~ 85°C | Number of Drivers/Receivers: 0/4 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) Supplier Device Package: 16-TSSOP | 1,318 | |
 | | FIN1532MTCX | onsemi | IC RECEIVER 0/4 16TSSOP | Drivers, Receivers, Transceivers | 16-TSSOP | 4.5V ~ 5.5V | -40°C ~ 85°C | Number of Drivers/Receivers: 0/4 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-TSSOP (0.173″”, 4.40mm Width) Supplier Device Package: 16-TSSOP | 556 | |
 | | FIN1532MX | onsemi | IC RECEIVER 0/4 16SOIC | Drivers, Receivers, Transceivers | 16-SOIC | 4.5V ~ 5.5V | -40°C ~ 85°C | Number of Drivers/Receivers: 0/4 Voltage – Supply: 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C Mounting Type: Surface Mount Package / Case: 16-SOIC (0.154″”, 3.90mm Width) Supplier Device Package: 16-SOIC | 1,319 | |
 | N/A | FLIXF6151BEA2834984 | Intel | IC 28 T1/E1 MAPPER 352BGA | Controllers | - | - | – | | 639 | |
| N/A | N/A | FM62D1G1GMB (2G) | ESMT | 1Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162 ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162 ball | 1,167 | |
| N/A | N/A | FM62D2G1GXA (2U) | ESMT | 2Gb NAND+LPDDR2 MCP | MCP Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 447 | |
| N/A | N/A | FM62D2G2GKA (2Q) | ESMT | 2Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 128M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 459 | |
| N/A | N/A | FM62D2G2GXA (2L) | ESMT | 2Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 128M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 160 | |
| N/A | N/A | FM62D4G2GXB (2V) | ESMT | 4Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 128M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 508 | |
| N/A | N/A | FM6BD1G12MB(2W) | ESMT | 1Gb NAND+LPDDR2 MCP Ind. | MCP Memory | 10.5x8 (mm),162ball | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 32M x 16 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 1,425 | |
| N/A | N/A | FM6BD1G1GMB (2G) | ESMT | 1Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162 ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 32M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162 ball | 377 | |
| N/A | N/A | FM6BD2G2GKA (2Q) | ESMT | 2Gb NAND+LPDDR2 MCP | MCP Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 1,586 | |
| N/A | N/A | FM6BD2G2GXA(2L) | ESMT | 2Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 1,506 | |
| N/A | N/A | FM6BD2G2GXA2L | ESMT | 2Gb NAND+LPDDR2 MCP Ind. | Flash Memory | 10.5x8 (mm),162ball | 2.5V | -40°C – 85°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 1,094 | |