| N/A | N/A | FM6BD4G2GKA (2J) | ESMT | 4Gb NAND+LPDDR2 MCP | MCP Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 968 | |
| N/A | N/A | FM6BD4G2GXB(2V) | ESMT | 4Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 64M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162ball | 336 | |
| N/A | N/A | FM6BD4G4GKMA (2J) | ESMT | 4Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162 ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 128M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162 ball | 798 | |
| N/A | N/A | FM6BD4G4GXMB (2V) | ESMT | 4Gb NAND+LPDDR2 MCP | Flash Memory | 10.5x8 (mm),162 ball | 2.5V | 0°C – 70°C | Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 128M x 32 Memory Interface: Parallel Packaging: 10.5x8 (mm),162 ball | 387 | |
| N/A | N/A | FM6HZ4G4GKA (2R) | ESMT | 4Gb NAND+LPDDR4x MCP Ind. | MCP Memory | 9.5x8 (mm),149ball | 2.5V | -40°C – 85°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 256M x 16 Memory Interface: Parallel Packaging: 9.5x8 (mm),149ball | 452 | |
| N/A | N/A | FM6HZ4G4GXB | ESMT | 4Gb NAND+LPDDR4x MCP | Flash Memory | 9.5x8 (mm),149ball | 2.5V | 0°C – 70°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 256M x 16 Memory Interface: Parallel Packaging: 9.5x8 (mm),149ball | 556 | |
| N/A | N/A | FM6HZ4G8GXDZB (2H) | ESMT | 4Gb NAND+LPDDR4x MCP Ind. | MCP Memory | 9.5x8 (mm),149ball | 2.5V | -40°C – 85°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 256M x 16 x 2 die Memory Interface: Parallel Packaging: 9.5x8 (mm),149ball | 563 | |
| N/A | N/A | FM6HZ8G8GKDZA (2R) | ESMT | 8Gb NAND+LPDDR4x MCP Auto. | Flash Memory | 9.5x8 (mm),149ball | 2.5V | -40°C – 105°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 256M x 16 x 2 die Memory Interface: Parallel Packaging: 9.5x8 (mm),149ball | 1,136 | |
| N/A | N/A | FM6HZ8G8GXDZB(2H) | ESMT | 8Gb NAND+LPDDR4x MCP | MCP Memory | 9.5x8 (mm),149ball | 2.5V | 0°C – 70°C | Clock Frequency: 2.133 GHz Write Cycle Time Word Page: 15 ns Memory Type: Volatile, Non-Volatile Technology: MCP (NAND + DRAM) Memory Organization: 256M x 16 x 2 die Memory Interface: Parallel Packaging: 9.5x8 (mm),149ball | 1,028 | |
| N/A | | FPD95220DSCG/NOPB | Texas Instruments | IC DRIVER LTPS DOT INV 320CH | Drivers, Receivers, Transceivers | - | - | – | | 343 | |
 | | FPF1204UCX | Fairchild Semiconductor | INTELLIMAX ULTRA-SMALL, SLEW-RAT | Analog Switches, Multiplexers, Demultiplexers | N/A | N/A | N/A | N/A | 54 | |
 | | FS32K116BRT0MFMR | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 80 | |
 | | FS32K116BRT0MFMT | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 1,999 | |
 | | FS32K116BRT0MLFR | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 334 | |
 | | FS32K116BRT0MLFT | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 862 | |
 | | FS32K116BRT0VFMR | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 1,836 | |
 | | FS32K116BRT0VFMT | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 107 | |
 | | FS32K116BRT0VLFR | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 940 | |
 | | FS32K116BRT0VLFT | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0+ Core Size: 32-Bit Single-Core Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 1,052 | |
| N/A | | FS32K116LAT0MFMR | NXP Semiconductors | S32K116 ARM CORTEX-M0+, 48 MHZ, | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-M0+ Connectivity: CANbus, FlexIO, I2C, LINbus, SPI, UART/USART Peripherals: DMA, I2S, LVD, LVR, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 5.5V Data Converters: A/D 13x12b SAR; D/A 1x8b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 309 | |