Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
FS32K148UJT0VLLTFS32K148UJT0VLLTNXP SemiconductorsIC MCU 32BIT 2MB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
89
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
257
N/AFS32K148UJT0VLQRNXP SemiconductorsS32K148 ARM CORTEX-M4F, 112 MHZ,Microcontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
112MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
754
FS32K148UJT0VLQTFS32K148UJT0VLQTNXP SemiconductorsIC MCU 32BIT 2MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
881
N/AFS32K148UJT0VLURNXP SemiconductorsS32K148 ARM CORTEX-M4F, 112 MHZ,Microcontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
112MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O:
156
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
1,094
FS32K148UJT0VLUTFS32K148UJT0VLUTNXP SemiconductorsIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
156
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
35
N/AFS32K148UJT0VMHRNXP SemiconductorsS32K148 ARM CORTEX-M4F, 112 MHZ,Microcontrollers100-MAPBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit
Speed:
112MHz
Connectivity:
CANbus, EBI/EMI, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
DMA, I2S, LVD, LVR, POR, PWM, WDT
Number of I/O:
89
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
616
FS32K148UJT0VMHTFS32K148UJT0VMHTNXP SemiconductorsIC MCU 32BIT 2MB FLASH 100MAPBGAMicrocontrollers100-MAPBGA (11x11)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
89
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-MAPBGA (11×11)
Package / Case:
100-LFBGA
1,097
FS32K148URT0VLQRFS32K148URT0VLQRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
135
FS32K148URT0VLQTFS32K148URT0VLQTNXP SemiconductorsIC MCU 32BIT 2MB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
128
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,349
FS32K148URT0VLURFS32K148URT0VLURNXP SemiconductorsIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
156
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
523
FS32K148URT0VLUTFS32K148URT0VLUTNXP SemiconductorsIC MCU 32BIT 2MB FLASH 176LQFPMicrocontrollers176-LQFP (24x24)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
112MHz
Connectivity:
CANbus, Ethernet, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
I2S, POR, PWM, WDT
Number of I/O:
156
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
4K x 8
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 32x12b SAR; D/A 1x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-LQFP (24×24)
Package / Case:
176-LQFP
1,223
FS32R274KBK2MMMFS32R274KBK2MMMNXP SemiconductorsIC MCU 32BIT 2MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit Tri-Core
Speed:
180MHz, 240MHz
Connectivity:
CANbus, FlexIO, I2C, LINbus, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
236
FS32R274KBK2MMMRFS32R274KBK2MMMRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit Tri-Core
Speed:
180MHz, 240MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals:
POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
531
FS32R274KBK2VMMFS32R274KBK2VMMNXP SemiconductorsIC MCU 32BIT 2MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit Tri-Core
Speed:
180MHz, 240MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals:
POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
1,203
FS32R274KCK2MMMFS32R274KCK2MMMNXP SemiconductorsIC MCU 32BIT 2MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit Tri-Core
Speed:
180MHz, 240MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals:
POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
889
FS32R274KCK2VMMFS32R274KCK2VMMNXP SemiconductorsIC MCU 32BIT 2MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit Tri-Core
Speed:
180MHz, 240MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals:
POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
858
FS32R274KSK2MMMFS32R274KSK2MMMNXP SemiconductorsIC MCU 32BIT 2MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit Tri-Core
Speed:
180MHz, 240MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals:
POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
532
FS32R274KSK2MMMRFS32R274KSK2MMMRNXP SemiconductorsIC MCU 32BIT 2MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit Tri-Core
Speed:
180MHz, 240MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals:
POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
1,892
FS32R274KSK2VMMFS32R274KSK2VMMNXP SemiconductorsIC MCU 32BIT 2MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit Tri-Core
Speed:
180MHz, 240MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals:
POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
277
FS32R274VBK2MMMFS32R274VBK2MMMNXP SemiconductorsIC MCU 32BIT 2MB FLASH 257MAPBGAMicrocontrollers257-LFBGA (14x14)N/A-40°C ~ 125°C (TA)
Core Processor:
e200z4, e200z7 (2)
Core Size:
32-Bit Tri-Core
Speed:
180MHz, 240MHz
Connectivity:
CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire
Peripherals:
POR, PWM, WDT
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
EEPROM Size:
64K x 8
RAM Size:
1.5M x 8
Voltage – Supply (Vcc/Vdd):
1.19V ~ 5.5V
Data Converters:
A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
257-LFBGA (14×14)
Package / Case:
257-LFBGA
31

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