 | | FS32R274VBK2VMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 375 | |
 | | FS32R274VCK2MMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 101 | |
 | | FS32R274VCK2VMM | NXP Semiconductors | IC MCU 32BIT 2MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: e200z4, e200z7 (2) Core Size: 32-Bit Tri-Core Connectivity: CANbus, Ethernet, FlexRay, I2C, LINbus, SPI, ZipWire Peripherals: POR, PWM, WDT Program Memory Size: 2MB (2M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR, 4×12 Sigma; D/A 1x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 950 | |
| N/A | | FS32R294HAK0MJDR | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 559 | |
| N/A | | FS32R294HAK0MJDT | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,281 | |
| N/A | | FS32R294HBK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,506 | |
| N/A | | FS32R294HBK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,459 | |
| N/A | | FS32R294HEK0MJDR | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 548 | |
| N/A | | FS32R294HEK0MJDT | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 757 | |
| N/A | | FS32R294HFK0MJDR | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 784 | |
| N/A | | FS32R294HFK0MJDT | NXP Semiconductors | IC MCU 32BIT 2.5MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 298 | |
| N/A | | FS32R294JAK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,613 | |
| N/A | | FS32R294JAK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,189 | |
| N/A | | FS32R294JCK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | N/A | N/A | N/A | N/A | 414 | |
| N/A | | FS32R294JCK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | – | Core Processor: e200z4, e200z7 Core Size: 32-Bit Dual-Core Connectivity: CANbus, Ethernet, FlexRay, QSPI, SPI Program Memory Type: ROMless Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,339 | |
| N/A | | FS32R294KAK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,510 | |
| N/A | | FS32R294KAK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 121 | |
| N/A | | FS32R294KCK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,371 | |
| N/A | | FS32R294KCK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 161 | |
| N/A | | FS32R294LAK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | N/A | Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 1,620 | |