| N/A | | FS32R294LAK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | – | Core Processor: e200z4, e200z7 (2) Speed: 250MHz, 500MHz, 430MHz Connectivity: CAN, Ethernet, FlexRay Program Memory Size: 3MB (3M x 8) Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 393 | |
| N/A | | FS32R294LBK0MJDR | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | – | Core Processor: e200z4, e200z7 (2) Speed: 250MHz, 500MHz, 430MHz Connectivity: CAN, Ethernet, FlexRay Program Memory Size: 3MB (3M x 8) Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 356 | |
| N/A | | FS32R294LBK0MJDT | NXP Semiconductors | S32R29 MULTICORE POWER ARCHITECT | Microcontrollers | 269-LFBGA (14x14) | N/A | – | Core Processor: e200z4, e200z7 (2) Speed: 250MHz, 500MHz, 430MHz Connectivity: CAN, Ethernet, FlexRay Program Memory Size: 3MB (3M x 8) Mounting Type: Surface Mount Supplier Device Package: 269-LFBGA (14×14) | 287 | |
| N/A | | FS32R294LCK0MJDR | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 132 | |
| N/A | | FS32R294LCK0MJDT | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 697 | |
| N/A | | FS32R294LDK0MJDR | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 423 | |
| N/A | | FS32R294LDK0MJDT | NXP Semiconductors | IC MCU 32BIT 2MB CRAM 269LFBGA | Microcontrollers | N/A | N/A | N/A | N/A | 508 | |
| N/A | | FS32R372SBK0MMMT | NXP Semiconductors | IC MCU 32B 1.3MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, SPI Peripherals: POR, PWM, WDT Program Memory Size: 1.3MB (1.3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 552 | |
| N/A | | FS32R372SBK0MMVT | NXP Semiconductors | IC MCU 32B 1.3MB FLASH 141MAPBGA | Microcontrollers | 141-MAPBGA (10x10) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, SPI Peripherals: POR, PWM, WDT Program Memory Size: 1.3MB (1.3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 141-MAPBGA (10×10) | 1,264 | |
| N/A | | FS32R372SCK0MMMT | NXP Semiconductors | IC MCU 32B 1.3MB FLASH 257MAPBGA | Microcontrollers | 257-LFBGA (14x14) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, SPI Peripherals: POR, PWM, WDT Program Memory Size: 1.3MB (1.3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 257-LFBGA (14×14) | 187 | |
| N/A | | FS32R372SDK0MMVT | NXP Semiconductors | IC MCU 32B 1.3MB FLASH 141MAPBGA | Microcontrollers | 141-MAPBGA (10x10) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, SPI Peripherals: POR, PWM, WDT Program Memory Size: 1.3MB (1.3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 141-MAPBGA (10×10) | 1,581 | |
| N/A | | FS32R372SEK0MMVT | NXP Semiconductors | IC MCU 32B 1.3MB FLASH 141MAPBGA | Microcontrollers | 141-MAPBGA (10x10) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Dual-Core Connectivity: CANbus, I2C, LINbus, SPI Peripherals: POR, PWM, WDT Program Memory Size: 1.3MB (1.3M x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.19V ~ 5.5V Data Converters: A/D 16x12b SAR Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 141-MAPBGA (10×10) | 1,405 | |
| N/A | | FS32V232BMN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TA) | Core Processor: ARM® Cortex®-A53, Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: LPDDR2, DDR3, DDR3L Display & Interface Controllers: LCD, Video Operating Temperature: -40°C ~ 125°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 1,478 | |
| N/A | | FS32V232BMN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 1,978 | |
| N/A | | FS32V232CKN1VUB | NXP Semiconductors | ISP CSE 1GHZ DUAL CORE | Microprocessors | N/A | N/A | N/A | N/A | 956 | |
| N/A | | FS32V232CKN1VUBR | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 992 | |
| N/A | | FS32V232CKN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 217 | |
| N/A | | FS32V232CKN2VUBR | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 879 | |
| N/A | | FS32V232CTN1VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 879 | |
| N/A | | FS32V232CTN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 2 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 1,564 | |