 | | FS32V234BJN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 1,535 | |
| N/A | | FS32V234BJN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 320 | |
 | | FS32V234BLN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 522 | |
| N/A | | FS32V234BLN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 1,294 | |
 | | FS32V234BMN1VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 1,769 | |
| N/A | | FS32V234BMN2VUB | NXP Semiconductors | IC MPU FS32V23 800MHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 426 | |
| N/A | | FS32V234CKN1VUB | NXP Semiconductors | ISP CSE 1GHZ 4 CORES | Microprocessors | N/A | N/A | N/A | N/A | 716 | |
| N/A | | FS32V234CKN1VUBR | NXP Semiconductors | ISP CSE 1GHZ 4 CORES | Microprocessors | N/A | N/A | N/A | N/A | 1,883 | |
| N/A | | FS32V234CKN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 1,113 | |
| N/A | | FS32V234CKN2VUBR | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 69 | |
 | | FS32V234CMN1VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 830 | |
| N/A | | FS32V234CMN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 862 | |
 | | FS32V234CON1VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M4 Number of Cores/Bus Width: 4 Core, 64-Bit/1 Core, 32-Bit Co-Processors/DSP: Multimedia; NEON™ MPE RAM Controllers: DDR3, DDR3L, LPDDR2 Graphics Acceleration: Yes Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 105°C (TA) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 225 | |
| N/A | | FS32V234CON1VUBR | NXP Semiconductors | ISP GPU CSE 1GHZ 4 CO | Microprocessors | N/A | N/A | N/A | N/A | 878 | |
| N/A | | FS32V234CON2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 684 | |
| N/A | | FS32V234CON2VUBR | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 367 | |
| N/A | | FS32V234CTN1VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 123 | |
| N/A | | FS32V234CTN2VUB | NXP Semiconductors | IC MPU FS32V23 1GHZ 621FCPBGA | Microprocessors | 621-FCPBGA (17x17) | N/A | -40°C ~ 125°C (TJ) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 32/64-Bit Co-Processors/DSP: ARM® Cortex®-M4 RAM Controllers: DDR3, DDR3L, LPDDR2 Display & Interface Controllers: APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU Voltage – I/O: 1V, 1.8V, 3.3V Operating Temperature: -40°C ~ 125°C (TJ) Security Features: AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG Mounting Type: Surface Mount Package / Case: 621-FBGA, FCBGA Supplier Device Package: 621-FCPBGA (17×17) Additional Interfaces: I2C, SPI, PCI, UART | 952 | |
 | N/A | FSA1153UCX | onsemi | IC SWITCH DP3T X 1 2OHM 12WLCSP | Analog Switches, Multiplexers, Demultiplexers | 12-WLCSP (1.41x1.575) | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 3:1 On-State Resistance (Max): 2Ohm Channel-to-Channel Matching (ΔRon): 200mOhm (Max) Voltage – Supply, Single (V+): 2.7V ~ 5.5V Switch Time (Ton, Toff) (Max): 80µs, 400ns (Typ) Channel Capacitance (CS(off), CD(off)): 2.5pF, 7pF Current – Leakage (IS(off)) (Max): 100nA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 12-UFBGA, WLCSP Supplier Device Package: 12-WLCSP (1.41×1.575) | 1,537 | |
 | | FSA1156L6X | onsemi | IC SW SPST-NOX1 900MOHM 6MICROPK | Analog Switches, Multiplexers, Demultiplexers | 6-MicroPak | N/A | -40°C ~ 85°C (TA) | Multiplexer/Demultiplexer Circuit: 1:1 On-State Resistance (Max): 900mOhm Voltage – Supply, Single (V+): 1.65V ~ 5.5V Switch Time (Ton, Toff) (Max): 20ns, 30ns Channel Capacitance (CS(off), CD(off)): 20pF Current – Leakage (IS(off)) (Max): 2nA Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 6-MicroPak | 1,148 | |