FS32V234BJN2VUB

IC MPU FS32V23 800MHZ 621FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC FS32V23 4 Core, 32/64-Bit 800MHz 621-FCPBGA (17x17)

Quantity 719 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesFS32V234
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A53Device Package621-FCPBGA (17x17)
Display & Interface ControllersAPEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIUECCNN/AEthernetGbE
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32/64-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case621-FBGA, FCBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceUnknownSecurity FeaturesAES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Speed800MHzSupplier Device Package621-FCPBGA (17×17)Voltage – I/O1V, 1.8V, 3.3V

Overview of FS32V234BJN2VUB – IC MPU FS32V23 800MHZ 621FCPBGA

The FS32V234BJN2VUB is an ARM® Cortex®-A53 based microprocessor IC featuring a 4-core, 32/64-bit application processor clocked at 800 MHz and a companion ARM® Cortex®-M4 co-processor. Designed for embedded and industrial systems, it provides a blend of application-level compute, real-time control, and rich multimedia I/O.

With integrated memory controller support, extensive display and camera interfaces, GbE networking and hardware security features, this device targets embedded imaging, vision and industrial networking designs that require performance, integration and extended temperature operation.

Key Features

  • Core Architecture  Quad ARM® Cortex®-A53 application cores (32/64-bit) at 800 MHz for multicore application processing.
  • Co-Processor  ARM® Cortex®-M4 co-processor for real-time control and offloaded processing tasks.
  • Memory Support  Integrated RAM controllers with support for DDR3, DDR3L and LPDDR2 memory types to match a range of system memory configurations.
  • Display & Video I/O  Display and image subsystem support including APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2 and VIU for camera input and display pipeline integration.
  • Connectivity  1 GBit Ethernet (GbE) plus additional peripheral interfaces such as I2C, UART, SPI and PCIe (as indicated in product documentation).
  • Security & Boot  Hardware security features including AES, ARM TrustZone, secure boot, CSE and OCOTP_CTRL, plus System JTAG for secure debug and provisioning.
  • Safety & System Reliability  Industrial qualification with system-level protections and debug capabilities; hardware watchdog and system JTAG are provided for robust system management.
  • Package & Mounting  Supplied in a 621-FCPBGA surface-mount package (17 × 17 mm) for compact board-level integration.
  • Operating Range & Compliance  Industrial operating temperature range from −40 °C to 125 °C and RoHS compliant for industrial deployment.

Typical Applications

  • Embedded Vision & Imaging  Camera input support (MIPI CSI2, VIU, ISP) and image-processing controllers make this device suitable for industrial vision and imaging pipelines.
  • Industrial Networking & Control  GbE connectivity and real-time co-processing with ARM® Cortex®-M4 enable networked control systems and industrial communication nodes.
  • Human-Machine Interfaces  Display controller support (LCD, DCU) allows integration into operator interfaces and graphical displays in industrial equipment.
  • Compute Modules & Embedded Appliances  High integration of application cores, memory interfaces and security features is well suited for compact compute modules and embedded appliances in industrial environments.

Unique Advantages

  • High integration  Combines multicore application processing, a real-time co-processor and extensive I/O in a single package to reduce BOM and board complexity.
  • Industrial temperature capability  Rated from −40 °C to 125 °C to meet the thermal demands of industrial applications and harsh environments.
  • Flexible memory options  Support for DDR3, DDR3L and LPDDR2 enables designers to choose memory configurations that balance cost, performance and power.
  • Security-enabled platform  Built-in AES, TrustZone, secure boot and one-time programmable controller support secure provisioning and runtime protection.
  • Rich multimedia I/O  Multiple display and camera interfaces simplify integration of imaging, video input and display processing in embedded systems.
  • Compact surface-mount package  621-FCPBGA (17×17 mm) package allows a small footprint implementation for space-constrained designs.

Why Choose FS32V234BJN2VUB?

The FS32V234BJN2VUB positions itself as a balanced, industrial-grade embedded processor that combines multi-core application performance with real-time co-processing, extensive imaging and display I/O, and hardware security features. Its support for standard DDR memory types and a compact BGA package make it suitable for integrated modules and industrial systems where space, reliability and secure operation matter.

This part is well suited for designers building industrial vision systems, networked embedded controllers and compact compute modules who require a scalable, secure and robust processing platform backed by documented device features and industrial temperature operation.

Request a quote or submit a request for pricing and availability to initiate procurement or to get further technical and supply information.

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