FS32V234BLN2VUB

IC MPU FS32V23 800MHZ 621FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC FS32V23 4 Core, 32/64-Bit 800MHz 621-FCPBGA (17x17)

Quantity 1,359 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesFS32V234
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time52 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A53Device Package621-FCPBGA (17x17)
Display & Interface ControllersAPEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIUECCNN/AEthernetGbE
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32/64-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case621-FBGA, FCBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceUnknownSecurity FeaturesAES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Speed800MHzSupplier Device Package621-FCPBGA (17×17)Voltage – I/O1V, 1.8V, 3.3V

Overview of FS32V234BLN2VUB – IC MPU FS32V23 800MHz 621-FCPBGA

The FS32V234BLN2VUB is an NXP Semiconductors microprocessor IC from the FS32V234 series featuring an ARM® Cortex®-A53 multicore architecture. This device integrates a 4-core, 32/64-bit application processor running at 800 MHz together with an ARM® Cortex®-M4 co-processor and a broad set of system peripherals.

Designed for industrial-grade embedded applications, the part combines compute performance, extensive memory interfaces and rich I/O to support vision, networking and safety-aware system designs while meeting industrial temperature requirements.

Key Features

  • Processor Cores  ARM® Cortex®-A53 4-core, 32/64-bit application CPU at 800 MHz with an ARM® Cortex®-M4 co-processor for real-time tasks.
  • Memory Interfaces  32-bit DRAM controller supporting DDR3, DDR3L and LPDDR2. Datasheet-level memory protection includes ECC and multi-bit fault detection schemes for external DDR-RAM.
  • Display, Vision and Image Processing  Integrated display and image subsystems noted in the series: Display Control Unit (2D-ACE), ISP, VIU and MIPI CSI-2 interfaces, plus APEX2-CL image cognition processors.
  • Communications and Connectivity  GbE Ethernet, PCI Express 2.0 (endpoint and root complex), FD-CAN, FlexRay dual channel, UART, SPI and I2C provide wide connectivity for networked and vehicle-domain topologies.
  • Security and Boot  Hardware security elements include AES, ARM TrustZone support, CSE with on-chip secure RAM/ROM primitives, boot with AES support and On-Chip One-Time Programmable controller (OCOTP_CTRL) and System JTAG control.
  • System Reliability and Safety  Series-level safety measures include fault detection in memory and logic, memory correction schemes and hardware modules such as watchdog and CRC for integrity verification.
  • Timing and Control  Multiple timers and high-resolution timing features, eDMA controller with DMAMUX and IEEE 1588 timers (part of the Ethernet subsystem) for precise synchronization and data movement.
  • Analog and Peripheral  On-chip analog includes a 12-bit SAR ADC and a variety of peripheral controllers supporting sensor interfacing and control functions.
  • Package and Environmental  621-FCPBGA supplier package (17 × 17 mm), surface-mount mounting and industrial operating temperature range of −40°C to 125°C.

Typical Applications

  • Embedded Vision Systems  Leverage the device’s image processors, MIPI CSI-2 inputs and ISP support for camera capture, preprocessing and vision analytics.
  • Industrial Networking and Control  Use GbE, PCIe, CAN and FlexRay interfaces for deterministic communications, device networking and distributed control systems.
  • Safety‑Aware Embedded Platforms  Employ onboard fault detection, memory ECC and hardware watchdog capabilities to build systems with enhanced operational integrity.
  • Human–Machine Interfaces (HMIs)  Combine the A53 multicore performance and display control units to handle graphical user interfaces and multimedia decoding workloads.

Unique Advantages

  • Balanced Multi‑Core Architecture: A 4-core ARM® Cortex®-A53 application cluster paired with an ARM® Cortex®-M4 co-processor lets designers partition high-level compute and real-time control tasks efficiently.
  • Comprehensive Memory Support with ECC: Native support for DDR3/DDR3L/LPDDR2 and ECC-enabled DRAM controller reduces system-level complexity for reliable memory operation.
  • Rich I/O and Multimedia Capability: Integrated display, camera and high-speed interfaces simplify BOM and accelerate development of vision and multimedia applications.
  • Hardware Security Primitives: On-chip CSE, TrustZone support, AES and OCOTP_CTRL provide foundational building blocks for secure boot and protected execution.
  • Industrial Temperature Range: −40°C to 125°C rating enables deployment in demanding environmental conditions.
  • Compact BGA Package: 621-FCPBGA (17×17 mm) package supports high pin density while keeping board area optimized for embedded systems.

Why Choose FS32V234BLN2VUB?

FS32V234BLN2VUB delivers a combination of multi-core processing, real-time co-processing and extensive I/O that suits industrial embedded platforms requiring vision, networking and robust security foundations. Its memory interface options and built-in fault detection/correction features help designers address reliability and integrity needs without extensive external logic.

This part is well suited for teams developing industrial-grade systems that need scalable compute, a broad peripheral set and compact packaging. With NXP’s FS32V234 series-level features available in this device, customers gain a practical platform for accelerating development and reducing system BOM.

Request a quote or submit an inquiry to obtain pricing and availability for FS32V234BLN2VUB and to discuss how this device fits your embedded design requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up