FS32V234CMN1VUB

IC MPU FS32V23 1GHZ 621FCPBGA
Part Description

ARM® Cortex®-A53, ARM® Cortex®-M4 Microprocessor IC FS32V23 4 Core, 64-Bit/1 Core, 32-Bit 1GHz 621-FCPBGA (17x17)

Quantity 273 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesFS32V234
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A53, ARM® Cortex®-M4Device Package621-FCPBGA (17x17)
Display & Interface ControllersAPEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIUECCN5A992CEthernet1Gbps
Graphics AccelerationYesHTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 64-Bit/1 Core, 32-Bit
Operating Temperature-40°C ~ 105°C (TA)Package / Case621-FBGA, FCBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Speed1GHzSupplier Device Package621-FCPBGA (17×17)Voltage – I/O1V, 1.8V, 3.3V

Overview of FS32V234CMN1VUB – IC MPU FS32V23 1GHZ 621FCPBGA

The FS32V234CMN1VUB is a high-integration microprocessor IC from NXP Semiconductors combining ARM® Cortex®-A53 and ARM® Cortex®-M4 cores. The device pairs up to a 1 GHz quad-core 64-bit Cortex-A53 cluster with a 32-bit Cortex-M4 core to address embedded and industrial applications that require mixed high-performance application processing and real-time control.

Designed for imaging, multimedia and networked embedded systems, the part delivers a blend of compute, graphics/video acceleration, and advanced security features while supporting industrial operating temperatures from −40 °C to 105 °C.

Key Features

  • Cores and Processing — Quad ARM Cortex-A53 (up to 1 GHz) for 64-bit application processing and an ARM Cortex-M4 (up to 133 MHz) for real-time control and deterministic tasks.
  • Heterogeneous Compute — NEON™ MPE co-processor and dual-precision FPUs on the A53 cluster plus a dedicated M4 core enable mixed workloads for multimedia and control.
  • Memory and Boot — 32-bit DRAM controller with support for DDR3, DDR3L and LPDDR2 (data rates up to 1066 MT/s with ECC), QuadSPI with Execute-In-Place (XIP) and boot flash fault detection and correction schemes.
  • Graphics, Video and Imaging — Display Control Unit (2D-ACE), GPU (GC3000) with frame buffer compression, image signal processor (ISP), 2× VIU and 2× MIPI-CSI2 camera interfaces for embedded vision and display tasks.
  • Communications — Integrated 1 Gbps Ethernet (with PTP IEEE 1588), UART (with LIN support), SPI, I2C, FD‑CAN and PCIe 2.0 endpoint/root complex support for broad connectivity.
  • Security — AES, ARM TrustZone support, CSE with on-chip secure RAM/ROM, secure boot capabilities and on-chip One-Time Programmable controller (OCOTP_CTRL) plus System JTAG for secure lifecycle management.
  • System Reliability and Safety — ECC/parity support for memories, hardware CRC, hardware watchdog, fault detection measures for memory and logic, and safety documentation including FMEDA reports.
  • Power and Clocking — Integrated PLLs, multiple oscillators, peripheral clock gating and power gating for unused cores and GPU to support flexible power management.
  • Package and Environmental — 621-FCPBGA (17×17 mm) surface-mount package; Industrial temperature range −40 °C to 105 °C. RoHS compliant.

Typical Applications

  • Industrial Vision and Imaging — On-board ISP, MIPI-CSI2 camera interfaces and GPU acceleration make the device suitable for machine vision, inspection and imaging pipelines.
  • HMI and Multimedia Systems — Cortex-A53 processing, GPU and display controller support rich user interfaces, video playback and graphical displays in embedded HMIs.
  • Networked Embedded Controllers — 1 Gbps Ethernet with PTP and a broad set of serial interfaces enable high-bandwidth, time-synchronized industrial networking and gateway roles.
  • Robotics and Automation — Mixed high-level application processing and real-time M4 control support sensor fusion, local perception and deterministic control tasks.

Unique Advantages

  • Highly Integrated Compute Fabric — Combines 64-bit application processing and a dedicated 32-bit real-time core in one device to reduce BOM and simplify system architecture.
  • Imaging and Graphics Acceleration — On-chip ISP, VIUs, MIPI-CSI2 and GPU reduce development effort for vision and display subsystems.
  • Robust Security Building Blocks — Hardware AES, TrustZone support, CSE secure RAM/ROM and secure boot capabilities help protect system integrity and IP.
  • Industrial-Grade Operation — Qualified for industrial temperature ranges and designed with memory ECC and watchdog features to support reliable operation in demanding environments.
  • Flexible Memory and Boot Options — Support for DDR3/DDR3L/LPDDR2, QuadSPI XIP and advanced boot fault detection enable flexible system memory architectures and reliable booting.
  • Documented Safety Support — On-chip fault detection measures and available FMEDA/safety documentation assist integration into safety-aware designs.

Why Choose FS32V234CMN1VUB?

The FS32V234CMN1VUB positions itself as a versatile embedded processor for industrial and high-functionality embedded systems that require a combination of application performance, real-time control and imaging capabilities. Its heterogeneous core architecture, broad I/O and memory support, and integrated security and reliability features deliver a compact platform for systems that combine multimedia, networking and control.

Engineers building industrial vision, HMI, robotics or networked control solutions will find the device’s integration, industrial temperature rating and available safety documentation useful for simplifying design and accelerating development while maintaining system robustness over the product lifecycle.

Request a quote or submit an inquiry to get pricing and availability for FS32V234CMN1VUB and to discuss how this microprocessor can fit your next embedded or industrial design.

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