FS32V234CON2VUB
| Part Description |
ARM® Cortex®-A53 Microprocessor IC FS32V23 4 Core, 32/64-Bit 1GHz 621-FCPBGA (17x17) |
|---|---|
| Quantity | 446 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | FS32V234 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 12 Weeks |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | ARM® Cortex®-M4 | Core Processor | ARM® Cortex®-A53 | Device Package | 621-FCPBGA (17x17) | ||
|---|---|---|---|---|---|---|---|
| Display & Interface Controllers | APEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIU | ECCN | 5A992C | Ethernet | GbE | ||
| Graphics Acceleration | No | HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 1 (Unlimited) | ||
| Mounting Method | Surface Mount | Mounting Type | Surface Mount | Number of Cores/Bus Width | 4 Core, 32/64-Bit | ||
| Operating Temperature | -40°C ~ 125°C (TJ) | Package / Case | 621-FBGA, FCBGA | RAM Controllers | DDR3, DDR3L, LPDDR2 | ||
| REACH Compliance | REACH Unaffected | RoHS Compliance | ROHS3 Compliant | Security Features | AES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG | ||
| Speed | 1GHz | Supplier Device Package | 621-FCPBGA (17×17) | Voltage – I/O | 1V, 1.8V, 3.3V |
Overview of FS32V234CON2VUB – IC MPU FS32V23 1GHz 621-FCPBGA
The FS32V234CON2VUB is an NXP Semiconductors FS32V234-series microprocessor IC featuring a quad ARM® Cortex®-A53 core cluster running up to 1 GHz and an integrated ARM® Cortex®-M4 coprocessor. Designed for embedded and industrial applications, the device combines multi-core application processing with a real-time coprocessor, broad memory support and a range of peripheral interfaces for imaging, display and networking.
With on-chip security, memory error detection/correction and industrial operating range, this MPU is positioned to deliver balanced compute performance, system integration and robustness for industrial embedded designs.
Key Features
- Core & Processing Quad ARM® Cortex®-A53 application cores up to 1 GHz with 32/32 KB I/D L1 caches and clustered L2 cache architecture; NEON and dual-precision FPU support are included in the series architecture.
- Co-processor Integrated ARM® Cortex®-M4 coprocessor for real-time control tasks, supporting dedicated tightly coupled memory and L1 caches.
- Memory & Storage 32-bit DRAM controller supporting DDR3, DDR3L and LPDDR2 with ECC support; QuadSPI execute-in-place (XIP) and on-chip boot flash fault detection and correction mechanisms are provided.
- Display, Image & Video Interfaces Display and image interfaces include APEX2-CL, Display Control Unit (2D-ACE), ISP, LCD, MIPI CSI-2 and VIU blocks for camera and display applications.
- Interfaces & Connectivity High-speed connectivity options include GbE with IEEE 1588 PTP timers, PCIe 2.0 endpoint/root complex support, FD-CAN, FlexRay dual channel and standard peripherals such as UART, SPI and I2C.
- Security & Debug On-chip security features include AES, ARM TrustZone support, boot security, a Cryptographic Services Engine (CSE), OCOTP controller and System JTAG for secure boot and provisioning.
- System Reliability & Safety Memory ECC/parity support, hardware watchdog, fault detection and hardware measures for detecting memory and logic faults are available to increase system robustness.
- Clocks & Power Management Integrated PLLs, external crystal oscillator and internal oscillator support, plus flexible run modes and peripheral clock gating to reduce power in unused modules.
- Package & Operating Range Supplied in a 621-FCPBGA (17×17 mm) surface-mount package and qualified for industrial use with an operating temperature range of −40 °C to 125 °C. RoHS compliant.
Typical Applications
- Industrial Control & Automation Multi-core processing and real-time coprocessing combine to handle control algorithms, protocol bridging and secure system management in industrial equipment.
- Machine Vision & Image Processing MIPI CSI-2, ISP and image cognition processor support enable camera interfacing and on-device image preprocessing for inspection and monitoring systems.
- Human-Machine Interfaces (HMI) Display controller support and sufficient application processing performance make the device suitable for advanced operator displays and panel controllers.
- Ethernet Gateways & Networked Devices Gigabit Ethernet with PTP and a rich set of communications interfaces support high-throughput networking, protocol conversion and gateway functions.
Unique Advantages
- Multi-domain processing: Quad Cortex-A53 cores with an integrated Cortex-M4 enable separation of application and real-time workloads within a single device.
- Broad memory support with ECC: DDR3/DDR3L/LPDDR2 controller with ECC and boot flash fault detection increases system data integrity and reliability.
- Integrated security primitives: AES, ARM TrustZone, CSE and OCOTP_CTRL support secure boot and device provisioning without external security components.
- Comprehensive I/O and media interfaces: Camera, display and high-speed network interfaces reduce BOM and simplify system design for connected visual applications.
- Industrial-grade operation: Surface-mount 621-FCPBGA package with industrial operating temperature range supports deployment in demanding environments.
- System-level reliability features: ECC, parity, hardware watchdog and fault detection mechanisms help maintain uptime and detect errors in fielded systems.
Why Choose FS32V234CON2VUB?
The FS32V234CON2VUB delivers a balanced combination of application performance, real-time control capability and system integration tailored for embedded industrial designs. Its quad Cortex-A53 cluster at up to 1 GHz alongside a Cortex-M4 coprocessor, multiple memory interfaces with ECC, and extensive peripheral support make it suitable for imaging, HMI and networked gateway applications that require both compute and deterministic control.
With on-chip security features, memory fault detection/correction and an industrial operating temperature range, this MPU supports long-term robustness and integration, helping reduce external components and simplify system architecture for engineers and procurement teams.
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