FS32V234CTN1VUB

IC MPU FS32V23 1GHZ 621FCPBGA
Part Description

ARM® Cortex®-A53 Microprocessor IC FS32V23 4 Core, 32/64-Bit 1GHz 621-FCPBGA (17x17)

Quantity 1,153 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesFS32V234
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPARM® Cortex®-M4Core ProcessorARM® Cortex®-A53Device Package621-FCPBGA (17x17)
Display & Interface ControllersAPEX2-CL, DCU (2D-ACE), ISP, LCD, MIPICSI2, Video, VIUECCNOBSOLETEEthernetGbE
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width4 Core, 32/64-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case621-FBGA, FCBGARAM ControllersDDR3, DDR3L, LPDDR2
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSecurity FeaturesAES, ARM TZ, Boot, CSE, OCOTP_CTRL, System JTAG
Speed1GHzSupplier Device Package621-FCPBGA (17×17)Voltage – I/O1V, 1.8V, 3.3V

Overview of FS32V234CTN1VUB – IC MPU FS32V23 1GHz 4‑Core 621‑FCPBGA

The FS32V234CTN1VUB is an ARM® Cortex®-A53 based microprocessor IC featuring a quad-core 32/64-bit application processor running up to 1 GHz. It integrates a Cortex®-M4 co-processor and a broad set of memory, display, security and communications interfaces aimed at industrial embedded systems and vision-enabled edge applications.

Designed for performance and integration, this device targets industrial designs that require multicore application processing, real-time control and secure boot/system protection across an extended temperature range.

Key Features

  • Core processing — Quad ARM® Cortex®-A53 application cores up to 1 GHz with 32 KB/32 KB L1 caches and NEON MPE co-processor; two clusters with 256 KB L2 cache per cluster and integrated GIC interrupt controller.
  • Real-time co-processor — ARM® Cortex®-M4 32-bit CPU for deterministic control and background tasks with dedicated tightly coupled memory and L1 caches.
  • Memory subsystem — 32-bit DRAM controller supporting LPDDR2, DDR3 and DDR3L (data rate up to 1066 MT/s at 533 MHz) with ECC and triple error detection support; QuadSPI with Execute-In-Place (XIP) and boot flash fault detection/correction schemes.
  • Display and vision interfaces — Display Control Unit (2D-ACE), Image Signal Processor (ISP), APEX2-CL, VIU and dual MIPI CSI-2 inputs for camera and image-processing workflows.
  • Communications — 1 Gbit Ethernet subsystem with IEEE 1588 timers (PTP), PCI Express 2.0 (endpoint/root complex), FD‑CAN and FlexRay support; I²C, SPI and UART interfaces available.
  • Security and system protection — On-chip CSE with secure RAM/ROM, ARM TrustZone support, AES boot, On-Chip One-Time Programmable controller (OCOTP_CTRL) and System JTAG Controller for secure boot and device identity.
  • Safety and reliability — ECC/parity support across memories, hardware CRC, watchdog, unique 120-bit chip identifier and fault detection schemes for memory and boot integrity (safety concept information available in series documentation).
  • Power and clocking — Multiple PLLs, external and internal oscillators, flexible run modes, peripheral clock gating and power gating for unused A53 cores to reduce operational currents.
  • Package and temperature — 621-FCPBGA (17×17) surface-mount package; industrial operating temperature range from -40 °C to 125 °C; RoHS compliant.

Typical Applications

  • Industrial vision and inspection — Camera inputs (MIPI CSI-2, VIU) and ISP support enable real-time image acquisition and processing for machine vision and inspection tasks.
  • Edge compute and protocol gateways — Quad A53 cores with robust communications (GbE, PCIe, CAN, FlexRay) suit networked edge devices and protocol translation appliances.
  • Safety‑aware embedded systems — Memory ECC, boot integrity checks and built-in safety measures support designs requiring fault detection and system-level protection.
  • Industrial control and HMI — Combined application cores and Cortex-M4 co-processor enable high-level user interfaces alongside real-time control and sensor interfacing.

Unique Advantages

  • Dual-class processing: Combines quad ARM Cortex-A53 application cores with a Cortex-M4 real-time core to separate high-performance application workloads from deterministic control tasks.
  • Integrated multimedia and vision IO: Native support for MIPI CSI-2, ISP, VIU and display controllers simplifies camera-to-processor pipelines for imaging applications.
  • Robust memory and boot protection: ECC/parity, boot flash fault detection and multi-dimensional error detection schemes reduce system-level memory and boot faults.
  • Comprehensive system security: On-chip CSE, TrustZone support, AES boot, OCOTP and System JTAG provide multiple layers for secure boot and device identity.
  • Industrial ready: Industrial qualification and an extended -40 °C to 125 °C operating range support deployment in harsh environments.
  • High integration reduces BOM: On-chip peripherals including Ethernet, PCIe, CAN/FD, FlexRay, SPI, I²C and ADC minimize external components and simplify board design.

Why Choose FS32V234CTN1VUB?

The FS32V234CTN1VUB positions itself as a highly integrated microprocessor for industrial embedded designs that demand multicore application performance, deterministic real-time control and a broad set of I/O for vision, networking and control. Its combination of Cortex‑A53 processing, Cortex‑M4 co-processing, memory ECC and secure boot features supports robust system designs with reduced external component count.

Engineers developing industrial imaging systems, edge compute gateways or safety‑aware embedded controllers will find the device’s extended temperature rating, extensive communications interfaces and security/set-up features helpful for scalable, long‑lifecycle deployments.

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