Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
HD64F3334YFLH16VHD64F3334YFLH16VRenesasIC MCU 8BIT 32KB FLASH 80QFPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
Host Interface, I2C, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
80-QFP
985
HD64F3334YTF16VHD64F3334YTF16VRenesas8-BIT, FLASH, H8/300 CPU, 16MHZMicrocontrollersN/AN/AN/A

N/A

1,557
HD64F3337SF16VHD64F3337SF16VRenesasIC MCU 8BIT 60KB FLASH 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
Host Interface, I2C, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
573
N/AHD64F3337STF16VRenesasIC MCU 32BIT 60KB FLASH 80TQFPMicrocontrollers80-TQFP (12x12)4.5V - 5.5V-20°C – 75°C
Core Processor:
H8/300
Core Size:
32-Bit
Speed:
16MHz
Program Memory Size:
60KB (60K x 8)
Mounting Type:
Surface Mount
1,020
HD64F3337YTFLH16HD64F3337YTFLH16Renesas8-BIT, FLASH, H8/300 CPU, 16MHZMicrocontrollersN/AN/AN/A

N/A

505
HD64F3434FJ16HD64F3434FJ16Renesas16-BIT, FLASH, H8MicroprocessorsN/AN/AN/A

N/A

364
N/AHD64F3434TF16VRenesasIC MCU 16BIT 32KB FLASH 100QFPMicrocontrollers100-QFP (14x14)4.5V - 5.5V-20°C – 75°C
Core Processor:
H8/300
Core Size:
16-Bit
Speed:
16MHz
Program Memory Size:
32KB (32K x 8)
Mounting Type:
Surface Mount
1,035
HD64F3437SF16VHD64F3437SF16VRenesasMICROCONTROLLER, 16-BIT, FLASH,MicrocontrollersN/AN/AN/A

N/A

1,305
HD64F3437STF16VN/AHD64F3437STF16VRenesasIC MCU 8BIT 60KB FLASH 100TQFPMicrocontrollers100-TQFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300
Core Size:
8-Bit
Speed:
16MHz
Connectivity:
Host Interface, I2C, SCI
Peripherals:
POR, PWM, WDT
Number of I/O:
74
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-TQFP (14×14)
Package / Case:
100-TQFP
940
HD64F3437TF16HD64F3437TF16Renesas8-BIT, FLASH, H8/300 CPU, 16MHZMicrocontrollersN/AN/AN/A

N/A

234
HD64F3437TF16VHD64F3437TF16VRenesas8-BIT, FLASH, 16MHZMicroprocessorsN/AN/AN/A

N/A

162
HD64F36024FPVHD64F36024FPVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
30
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
406
HD64F3642APVHD64F3642APVRenesasIC MCU 8BIT 16KB FLASH 64SDIPMicrocontrollers64-SDIPN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
53
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Through Hole
Supplier Device Package:
64-SDIP
Package / Case:
64-SDIP (0.750″”, 19.05mm)
68
HD64F3642AWVHD64F3642AWVRenesas8-BIT, FLASH, 8MHZMicroprocessorsN/AN/AN/A

N/A

1,124
HD64F3644DVN/AHD64F3644DVRenesasIC MCU 8BIT 32KB FLASH 64QFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
53
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-QFP
441
HD64F3664DVN/AHD64F3664DVRenesasIC MCU 16BIT 32KB FLASH 64QFPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
64-QFP
857
HD64F3664FPIVHD64F3664FPIVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
408
HD64F3664FPVHD64F3664FPVRenesasIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
940
HD64F3664FXVHD64F3664FXVRenesasIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (10×10)
Package / Case:
48-LQFP
249
HD64F3664FYIVHD64F3664FYIVRenesasIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LFQFP (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
I2C, SCI
Peripherals:
PWM, WDT
Number of I/O:
29
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LFQFP (7×7)
Package / Case:
48-LQFP
309

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