Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AH26M51002KPRSK Hynix16GB eMMC 5.1 e-NAND commercialeMMC Memory153-BGA (11.5x13mm)3.3V-25°C – 85°C
Memory Size:
128 Gbit
Memory Format:
FLASH
Technology:
FLASH – NAND (MLC)
Clock Frequency:
200 MHz
Access Time:
N/A
Memory Interface:
eMMC 5.1
Grade:
Commercial
Memory Type:
Non-Volatile
Memory Organization:
N/A
Mounting Method:
Surface Mount
160,000
N/AH26M62002JPRSK Hynix32GB eMMC 5.1 e-NAND commercialeMMC Memory153-BGA (11.5x13mm)3.3V-25°C – 85°C
Memory Size:
256 Gbit
Memory Format:
FLASH
Technology:
FLASH – NAND (MLC)
Clock Frequency:
200 MHz
Access Time:
N/A
Memory Interface:
eMMC 5.1
Grade:
Commercial
Memory Type:
Non-Volatile
Memory Organization:
N/A
Mounting Method:
Surface Mount
107,000
H54G46CYRBX267H54G46CYRBX267SK Hynix2GB LPDDR4/LPDDR4X 4266Mbps CommercialDRAM Memory200-FBGA (10×15)0.57V ~ 1.95V−25°C – 85°C
Memory Size:
2 GB
Clock Frequency:
2133 MHz
Write Cycle Time Word Page:
18 ns
Access Time:
3.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR4/LPDDR4X
Memory Organization:
2 × 512M × 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
200-FBGA
20,000
H54G46CYRVX267H54G46CYRVX267SK Hynix2GB LPDDR4X 4266Mbps AutomotiveDRAM Memory200-FBGA (10×15)0.57V ~ 1.95V−40°C – 95°C
Memory Size:
2 GB
Clock Frequency:
2133 MHz
Write Cycle Time Word Page:
18 ns
Access Time:
3.5 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR4X
Memory Organization:
2 × 512M × 16
Memory Interface:
Parallel
Grade:
Automotive
Qualification:
AEC-Q100
Packaging:
200-FBGA
4,800
N/AN/AH58G66BK8QX105NSK Hynix8GB LPDDR5X-8533 automotive 441-FBGADRAM Memory441-ball FBGA (14×14)0.5V ~ 1.8V-40°C ~ 105°C
Memory Size:
8 GB
Clock Frequency:
4266 MHz
Write Cycle Time Word Page:
N/A
Access Time:
N/A
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
LPDDR5X
Memory Organization:
4 × 1G × 16
Memory Interface:
Parallel
Grade:
Automotive
Qualification:
JEDEC
Packaging:
441-FBGA
2,000
N/AH5TQ4G83EFR-TEISK HynixDDR3-2133 4Gb DDR3 SDRAM x8DRAM Memory78-BGA (7.5x11.0mm)1.5V-40°C - 95°C
Memory Size:
4 Gbit
Memory Format:
DRAM
Technology:
SDRAM - DDR3
Clock Frequency:
1066 MHz
Access Time:
13.09 ns
Memory Interface:
DDR3 SDRAM
Grade:
Industrial
Memory Type:
Volatile
Memory Organization:
x8
Mounting Method:
Surface Mount
1,785
N/AN/AH9HCNNNCPMMLXR-NEESK Hynix4GB LPDDR4X-4266 200-ball FBGADRAM Memory200-FBGA0.6V ~ 1.8V-25°C – 85°C
Memory Size:
4 GB
Memory Format:
DRAM
Technology:
LPDDR4X
Clock Frequency:
2133 MHz
Memory Interface:
Parallel
Grade:
Commercial
Memory Type:
Volatile
Memory Organization:
x16
Mounting Method:
Surface Mount
Qualification:
JEDEC
140,000
N/AN/AHA13721FPK-ERenesasIC TRANSCEIVER 1/1 8PSOPDrivers, Receivers, Transceivers8-PSOP4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Receiver Hysteresis:
200 mV
Data Rate:
1Mbps
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.173″”, 4.40mm Width)
Supplier Device Package:
8-PSOP
271
N/AN/AHA13721FPKEL-ERenesasIC TRANSCEIVER 1/1 8PSOPDrivers, Receivers, Transceivers8-PSOP4.5V ~ 5.5V-40°C ~ 125°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Receiver Hysteresis:
200 mV
Data Rate:
1Mbps
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 125°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.173″”, 4.40mm Width)
Supplier Device Package:
8-PSOP
1,016
N/AN/AHA13721RPJEEL-ERenesasICDrivers, Receivers, Transceivers8-SOP4.5V ~ 5.5V-40°C ~ 105°C
Type:
Transceiver
Protocol:
CANbus
Number of Drivers/Receivers:
1/1
Receiver Hysteresis:
200 mV
Data Rate:
1Mbps
Voltage – Supply:
4.5V ~ 5.5V
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOP
1,208
N/AHAT1111C-EL-ERenesasMICROCONTROLLERMicrocontrollersN/AN/AN/A

N/A

488
HC1S30F780NAEHC1S30F780NAEIntelIC FPGA 597 I/O 780FBGAFPGAs780-FBGA (29x29)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
597
Number of LABs/CLBs:
3247
Number of Logic Elements/Cells:
32470
Qualification:
N/A
Total RAM Bits:
2137536
372
HC1S60F1020AGHC1S60F1020AGIntelIC FPGA 782 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
782
Number of LABs/CLBs:
5712
Number of Logic Elements/Cells:
57120
Qualification:
N/A
Total RAM Bits:
5215104
1,564
HC1S60F1020BQHC1S60F1020BQIntelIC FPGA 782 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
782
Number of LABs/CLBs:
5712
Number of Logic Elements/Cells:
57120
Qualification:
N/A
Total RAM Bits:
5215104
721
HC1S60F1020CAHC1S60F1020CAIntelIC FPGA 782 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
782
Number of LABs/CLBs:
5712
Number of Logic Elements/Cells:
57120
Qualification:
N/A
Total RAM Bits:
5215104
364
HC1S60F1020CBHC1S60F1020CBIntelIC FPGA 782 I/O 1020FBGAFPGAs1020-FBGA (33x33)1.425 V - 1.575 V0°C – 85°C
Grade:
Commercial
Number of Gates:
N/A
Number of I/O:
782
Number of LABs/CLBs:
5712
Number of Logic Elements/Cells:
57120
Qualification:
N/A
Total RAM Bits:
5215104
630
N/AHC20K1000FC672IntelIC FPGA 672FBGAFPGAs672-FBGA (27x27)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1000000
Number of I/O:
488
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
38400
Qualification:
N/A
Total RAM Bits:
327680
536
N/AHC20K1000FC672ABIntelIC FPGA 672FBGAFPGAs672-FBGA (27x27)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
1000000
Number of I/O:
488
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
38400
Qualification:
N/A
Total RAM Bits:
327680
1,749
N/AHC20K600FC672ACIntelIC FPGA 672FBGAFPGAs672-FBGA (27x27)1.71 V - 1.89 V0°C – 85°C
Grade:
Commercial
Number of Gates:
600000
Number of I/O:
488
Number of LABs/CLBs:
N/A
Number of Logic Elements/Cells:
24320
Qualification:
N/A
Total RAM Bits:
311296
152
HCF4051BEYHCF4051BEYSTMicroelectronicsIC MUX 8:1 280OHM 16DIPAnalog Switches, Multiplexers, Demultiplexers16-PDIPN/A-55°C ~ 125°C (TA)
Multiplexer/Demultiplexer Circuit:
8:1
Number of Circuits:
1
On-State Resistance (Max):
280Ohm
Channel-to-Channel Matching (ΔRon):
5Ohm
Voltage – Supply, Single (V+):
3V ~ 20V
-3db Bandwidth:
60MHz
Channel Capacitance (CS(off), CD(off)):
0.2pF, 5pF
Current – Leakage (IS(off)) (Max):
100nA
Crosstalk:
-40dB @ 3MHz
Operating Temperature:
-55°C ~ 125°C (TA)
Mounting Type:
Through Hole
Package / Case:
16-DIP (0.300″”, 7.62mm)
Supplier Device Package:
16-PDIP
391

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