Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,622
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AHD6473644RDVRenesasMICROCONTROLLER, 16-BIT, OTPROMMicrocontrollersN/AN/AN/A

N/A

1,078
HD6473657HVHD6473657HVRenesas16-BIT, OTPROM, 5MHZMicrocontrollersN/AN/AN/A

N/A

161
HD6473657WVHD6473657WVRenesasIC MCU 8BIT 60KB OTP 80TQFPMicrocontrollers80-TQFP (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
67
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.2V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
815
HD6473724FVHD6473724FVRenesas8-BIT, OTPROM, H8/300L CPUMicrocontrollersN/AN/AN/A

N/A

976
HD6473726FVHD6473726FVRenesasIC MCU 8BIT 48KB OTP 80QFPMicrocontrollers80-QFP (14x20)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
PWM, VFD
Number of I/O:
60
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×20)
Package / Case:
80-BQFP
1,462
HD6473726HVHD6473726HVRenesasIC MCU 8BIT 48KB OTP 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
PWM, VFD
Number of I/O:
60
Program Memory Size:
48KB (48K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
4V ~ 5.5V
Data Converters:
A/D 8x8b
Oscillator Type:
External
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
824
HD64738024DVHD64738024DVRenesasMICROCONTROLLER, 8 BIT, H8 CPU,MicrocontrollersN/AN/AN/A

N/A

1,344
HD64738024HVHD64738024HVRenesasIC MCU 8BIT 32KB OTP 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
670
HD64738024WIVHD64738024WIVRenesasIC MCU 8BIT 32KB OTP 80TQFPMicrocontrollers80-TQFP (12x12)N/A-40°C ~ 85°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
1,462
HD64738024WVHD64738024WVRenesasIC MCU 8BIT 32KB OTP 80TQFPMicrocontrollers80-TQFP (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
51
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
787
HD6473802FPVHD6473802FPVRenesasIC MCU 8BIT 16KB OTP 64LQFPMicrocontrollers64-LFQFP (10x10)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
39
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LFQFP (10×10)
Package / Case:
64-LQFP
308
HD6473802HVHD6473802HVRenesasIC MCU 8BIT 16KB OTP 64QFPMicrocontrollers64-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
39
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-QFP (14×14)
Package / Case:
64-BQFP
1,512
N/AHD6473802PVRenesasMICROCONTROLLER, 8-BIT, H8 CPU,MicrocontrollersN/AN/AN/A

N/A

329
HD6473827RHVHD6473827RHVRenesasIC MCU 8BIT 60KB OTP 80QFPMicrocontrollers80-QFP (14x14)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
55
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-QFP (14×14)
Package / Case:
80-BQFP
276
HD6473827RWVHD6473827RWVRenesasIC MCU 8BIT 60KB OTP 80TQFPMicrocontrollers80-TQFP (12x12)N/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
8MHz
Connectivity:
SCI
Peripherals:
LCD, PWM, WDT
Number of I/O:
55
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-TQFP (12×12)
Package / Case:
80-TQFP
1,141
HD6473834EHD6473834ERenesas8-BIT, UVPROM, H8/300L CPU, 5MHZMicrocontrollersN/AN/AN/A

N/A

812
HD6473834UHHD6473834UHRenesasIC MCU 8BIT 32KB OTP 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM
Number of I/O:
71
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
OTP
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
910
N/AHD6473837AVRenesas8-BIT, H8/300L CPU, 5MHZMicrocontrollersN/AN/AN/A

N/A

29
HD6473837FVHD6473837FVRenesasIC MCU 8BIT 60KB OTPMicrocontrollersN/AN/A-20°C ~ 75°C (TA)
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM
Number of I/O:
84
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Mounting Type:
Surface Mount
Package / Case:
100-BQFP
1,500
HD6473837HHD6473837HRenesasIC MCU 8BIT 60KB OTP 100QFPMicrocontrollers100-QFP (14x14)N/A-20°C ~ 75°C
Core Processor:
H8/300L
Core Size:
8-Bit
Speed:
5MHz
Connectivity:
SCI
Peripherals:
LCD, PWM
Number of I/O:
84
Program Memory Size:
60KB (60K x 8)
Program Memory Type:
OTP
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 12x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C
Mounting Type:
Surface Mount
Supplier Device Package:
100-QFP (14×14)
Package / Case:
100-BFQFP
1,007

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