Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AGWIXP425ABBTIntelIC MPU INTEL 266MHZ PBGA492Microprocessors492-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Grade:
Industrial
189
N/AGWIXP425ABCTIntelIC MPU INTEL 400MHZ PBGA492Microprocessors492-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Grade:
Industrial
75
N/AGWIXP425BCTIntelIC MPU INTEL 400MHZ PBGA492Microprocessors492-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP42X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
SDRAM
Graphics Acceleration:
No
Ethernet:
10/100Mbps (2)
USB:
USB 1.1 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, SHA-1
Mounting Type:
Surface Mount
Package / Case:
492-BBGA
Supplier Device Package:
492-PBGA (35×35)
Grade:
Industrial
1,141
N/AGWIXP455BABIntelIC MPU INTEL 266MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Commercial
368
N/AGWIXP455BACIntelIC MPU INTEL 400MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Commercial
352
N/AGWIXP455BADIntelIC MPU IXP455 533MHZ PBGA544Microprocessors544-PBGA (35x35)N/A0°C ~ 70°C (TA)
Core Processor:
Intel® IXP45x
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
0°C ~ 70°C (TA)
Security Features:
3DES, AES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Commercial
19
N/AGWIXP460BABIntelIC MPU INTEL 266MHZ PBGA544Microprocessors544-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP45X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Industrial
1,174
N/AGWIXP460BADIntelIC MPU INTEL 533MHZ PBGA544Microprocessors544-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP45X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Industrial
489
N/AGWIXP460BADTIntelIC MPU INTEL 533MHZ PBGA544Microprocessors544-PBGA (35x35)N/A-40°C ~ 85°C (TA)
Core Processor:
Intel® IXP45X
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
533MHz
Co-Processors/DSP:
Communications; Network Processor Engine, Math Engine; Multiply Accumulate
RAM Controllers:
DDR, SDRAM
Graphics Acceleration:
No
Ethernet:
Mll (3), SMII (3)
USB:
USB 1.1 (1), USB 2.0 (1)
Voltage – I/O:
2.5V, 3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
3DES, AES, DES, MD5, RNG, SHA1
Mounting Type:
Surface Mount
Package / Case:
544-BBGA
Supplier Device Package:
544-PBGA (35×35)
Grade:
Industrial
688
GX1-233B-85-1.8GX1-233B-85-1.8Advanced Micro DevicesIC MPU 233MHZ 352EBGAMicroprocessors352-EBGA (35x35)N/A0°C ~ 85°C (TC)
Core Processor:
AMD Geode™ GX1
Number of Cores/Bus Width:
1 Core
Speed:
233MHz
Graphics Acceleration:
Yes
Display & Interface Controllers:
LCD
USB:
USB (2)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
352-BGA Exposed Pad
Supplier Device Package:
352-EBGA (35×35)
Grade:
Commercial
24
N/AGX72170-DNTRenesasIC DRIVERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

105
N/AN/AGX72472-GNURenesasIC MODULE REQUIRES WAFERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

823
N/AN/AGX72472B-GNURenesasIC MODULE REQUIRES WAFERDrivers, Receivers, TransceiversN/AN/AN/A

N/A

581
N/AN/AGX74870-JIURenesasIC MODULE REQUIRES WAFERDrivers, Receivers, TransceiversN/AN/AN/A
Protocol:
SPI
797
N/AGX76470-DNTRenesasIC DRIVER 4/4Drivers, Receivers, TransceiversN/A-–
Type:
Driver
Number of Drivers/Receivers:
4/4
Data Rate:
64Gps
762
N/AGX76471-DNTRenesasIC DRIVER 4/4Drivers, Receivers, TransceiversN/A-–
Type:
Driver
Number of Drivers/Receivers:
4/4
Data Rate:
64Gps
1,045
N/AGX76472-DNTRenesasIC DRIVER 4/4Drivers, Receivers, TransceiversN/A-–
Type:
Driver
Number of Drivers/Receivers:
4/4
Data Rate:
64Gps
414
N/AGX76473-DNTRenesasIC DRIVER 4/4Drivers, Receivers, TransceiversN/A-–
Type:
Driver
Number of Drivers/Receivers:
4/4
Data Rate:
64Gps
869
N/AGX76474-F-DNTRenesasIC DRIVER 4/0 DIEDrivers, Receivers, TransceiversDie-–
Type:
Driver
Number of Drivers/Receivers:
4/0
Data Rate:
64Gbps
Mounting Type:
Surface Mount
Package / Case:
Die
Supplier Device Package:
Die
935
N/AGX76476-DNTRenesasIC LINEAR DIFFDrivers, Receivers, TransceiversN/AN/AN/A

N/A

121

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