Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 133,696
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
K32L2B21VLH0AK32L2B21VLH0ANXP SemiconductorsIC MCU 32BIT 128KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals:
DMA, LCD, PWM, WDT
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.2V
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
844
N/AK32L2B21VLH0ARNXP SemiconductorsK32 L2B, 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
48MHz
Connectivity:
FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals:
DMA, LCD, PWM, WDT
Number of I/O:
50
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 16x16b; D/A 1x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,289
K32L2B21VMP0AK32L2B21VMP0ANXP SemiconductorsIC MCU 32BIT 128KB FLSH 64MAPBGAMicrocontrollers64-MAPBGA (5x5)N/A
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals:
DMA, LCD, PWM, WDT
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.2V
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
64-MAPBGA (5×5)
Package / Case:
64-LFBGA
289
N/AK32L2B31VFM0ANXP SemiconductorsIC MCU 32BIT 256KB FLASH 32QFNMicrocontrollers32-QFN (5x5)N/A
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals:
DMA, LCD, PWM, WDT
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.2V
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
32-QFN (5×5)
Package / Case:
32-UFQFN Exposed Pad
314
K32L2B31VFT0AK32L2B31VFT0ANXP SemiconductorsIC MCU 32BIT 256KB FLASH 48QFNMicrocontrollers48-QFN (7x7)N/A
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals:
DMA, LCD, PWM, WDT
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.2V
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
48-QFN (7×7)
Package / Case:
48-UFQFN Exposed Pad
542
K32L2B31VLH0AK32L2B31VLH0ANXP SemiconductorsIC MCU 32BIT 256KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals:
DMA, LCD, PWM, WDT
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.2V
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,399
K32L2B31VMP0AK32L2B31VMP0ANXP SemiconductorsIC MCU 32BIT 256KB FLSH 64MAPBGAMicrocontrollers64-MAPBGA (5x5)N/A
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
48MHz
Connectivity:
FlexIO, I2C, SPI, TSI, UART/USART, USB
Peripherals:
DMA, LCD, PWM, WDT
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
1.2V
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
64-MAPBGA (5×5)
Package / Case:
64-LFBGA
705
K32L3A60VPJ1ATK32L3A60VPJ1ATNXP SemiconductorsIC MCU 32B 1.25MB FLASH 176VFBGAMicrocontrollers176-VFBGA (9x9)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4/M0+
Core Size:
32-Bit Dual-Core
Speed:
72MHz
Connectivity:
FlexIO, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals:
AC’97, DMA, I2S, LCD, POR, PWM, WDT
Number of I/O:
104
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
EEPROM Size:
48K x 8
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
176-VFBGA (9×9)
Package / Case:
176-VFBGA
1,791
N/AN/AK32W022S1M2VPJATNXP SemiconductorsMCU BT5/FSK/THREAD 176-VFBGAMicrocontrollers176-VFBGAN/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals:
Bluetooth, DMA, PWM, WDT
Number of I/O:
104
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D – 12bit; D/A – 12bit
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
176-VFBGA
Package / Case:
176-VFBGA
1,586
N/AN/AK32W032S1M2CAVARNXP SemiconductorsMCU KINETIS BT5/FSK WLCSPMicrocontrollers191-WLCSP (5.97x5.85)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals:
Bluetooth, DMA, PWM, WDT
Number of I/O:
104
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D – 12bit; D/A – 12bit
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
191-WLCSP (5.97×5.85)
48
N/AN/AK32W032S1M2VPJATNXP SemiconductorsMCU KINETIS BT5/FSK 176-VFBGAMicrocontrollers176-VFBGAN/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals:
Bluetooth, DMA, PWM, WDT
Number of I/O:
104
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D – 12bit; D/A – 12bit
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
176-VFBGA
1,559
N/AN/AK32W042S1M2CAVARNXP SemiconductorsMCU KINETIS BT5/FSK/THREAD WLCSPMicrocontrollers191-WLCSP (5.97x5.85)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals:
Bluetooth, DMA, PWM, WDT
Number of I/O:
104
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D – 12bit; D/A – 12bit
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
191-WLCSP (5.97×5.85)
669
N/AN/AK32W042S1M2VPJATNXP SemiconductorsMCU KINETIS THREAD 176-VFBGAMicrocontrollers176-VFBGAN/A-40°C ~ 105°C
Core Processor:
ARM® Cortex®-M4/M0
Core Size:
32-Bit Dual-Core
Speed:
72MHz
Connectivity:
EBI/EMI, I2C, SAI, SDHC, SPI, UART/USART, USB
Peripherals:
Bluetooth, DMA, PWM, WDT
Number of I/O:
104
Program Memory Size:
1.25MB (1.25M x 8)
Program Memory Type:
FLASH
RAM Size:
384K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D – 12bit; D/A – 12bit
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C
Mounting Type:
Surface Mount
Supplier Device Package:
176-VFBGA
1,312
K4S510432D-UC75K4S510432D-UC75Samsung Semiconductor, Inc.IC DRAM 512MBIT LVTTL 54TSOP IIDRAM Memory54-TSOP II3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
65 ns
Clock Frequency:
133 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
128M x 4
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
N/A
894
K4S510432D-UC75T00K4S510432D-UC75T00Samsung Semiconductor, Inc.IC DRAM 512MBIT LVTTL 54TSOP IIDRAM Memory54-TSOP II3V ~ 3.6V0°C ~ 70°C (TA)
Access Time:
65 ns
Clock Frequency:
133 MHz
Grade:
Commercial
Memory Format:
DRAM
Memory Interface:
LVTTL
Memory Organization:
128M x 4
Memory Size:
512 Mbit
Memory Type:
Volatile
Packaging:
54-TSOP (0.400", 10.16mm Width)
Qualification:
N/A
Technology:
SDRAM
Write Cycle Time Word Page:
N/A
386
K9S08SG16E1MTGN/AK9S08SG16E1MTGNXP SemiconductorsSAMPLE PACK DEVICEMicrocontrollersN/AN/AN/A

N/A

1,232
KAP-UA9636ACPN/AKAP-UA9636ACPTexas InstrumentsIC ANALOG INTERFACEDrivers, Receivers, TransceiversN/AN/AN/A

N/A

852
N/AKC13213NXP SemiconductorsMC13213 - Microprocessor CircuitMicroprocessorsN/AN/AN/A

N/A

249
KC56F8246MLFKC56F8246MLFNXP SemiconductorsMC56F8246MLF - Microcontroller,MicrocontrollersN/AN/AN/A

N/A

119
N/AKC80524KX266256IntelIC MPU INTEL PENT 266MHZ PBGA615Microprocessors615-PBGAN/A0°C ~ 100°C (TC)
Core Processor:
Intel® Pentium® 4 Processor
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Graphics Acceleration:
No
Voltage – I/O:
1.6V
Operating Temperature:
0°C ~ 100°C (TC)
Mounting Type:
Surface Mount
Package / Case:
615-BGA
Supplier Device Package:
615-PBGA
789

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