 | | LP431GCSF | TAEJIN Technology | VREF SHUNT ADJ 0.5% | Voltage Reference | SOT23-3 | N/A | -40°C ~ 85°C (TA) | Operating Temperature: -40°C ~ 85°C (TA) Supplier Device Package: SOT23-3 | 1,159 | |
 | | LPC1101LVUKZ | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 25WLCSP | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP | 375 | |
 | | LPC1102LVUKZ | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 25WLCSP | Microcontrollers | N/A | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Package / Case: 25-UFBGA, WLCSP | 667 | |
 | | LPC1102UK,118 | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 16WLCSP | Microcontrollers | 16-WLCSP (2.17x2.32) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-WLCSP (2.17×2.32) Package / Case: 16-UFBGA, WLCSP | 1,596 | |
| N/A | | LPC1104UK,118 | NXP Semiconductors | IC MCU 32BIT 32KB FLASH 16WLCSP | Microcontrollers | 16-WLCSP (2.17x2.32) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 32KB (32K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 16-WLCSP (2.17×2.32) Package / Case: 16-UFBGA, WLCSP | 183 | |
 | | LPC1110FD20,529 | NXP Semiconductors | IC MCU 32BIT 4KB FLASH 20SO | Microcontrollers | 20-SO | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SO Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 32 | |
| N/A | | LPC1110FD20Y | NXP Semiconductors | SCALABLE ENTRY LEVEL 32-BIT MICR | Microcontrollers | 20-SO | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 4KB (4K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-SO Package / Case: 20-SOIC (0.295″”, 7.50mm Width) | 966 | |
 | | LPC1111FDH20/002,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 20TSSOP | Microcontrollers | 20-TSSOP | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 5x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 20-TSSOP Package / Case: 20-TSSOP (0.173″”, 4.40mm Width) | 525 | |
 | | LPC1111FHN33/101,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 565 | |
 | | LPC1111FHN33/102,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 113 | |
 | | LPC1111FHN33/102'5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 785 | |
 | | LPC1111FHN33/102K | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 706 | |
| N/A | | LPC1111FHN33/103 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 1,772 | |
 | | LPC1111FHN33/103,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 849 | |
 | | LPC1111FHN33/103K | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 140 | |
 | | LPC1111FHN33/201,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 462 | |
 | | LPC1111FHN33/202,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 951 | |
 | | LPC1111FHN33/203,5 | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 215 | |
 | | LPC1111JHN33/103E | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 1,040 | |
 | | LPC1111JHN33/203E | NXP Semiconductors | IC MCU 32BIT 8KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 8KB (8K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 695 | |