Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
LP431GCSFLP431GCSFTAEJIN TechnologyVREF SHUNT ADJ 0.5%Voltage Reference SOT23-3N/A-40°C ~ 85°C (TA)
Operating Temperature:
-40°C ~ 85°C (TA)
Supplier Device Package:
SOT23-3
Packaging:
Tape & Reel
1,159
LPC1101LVUKZLPC1101LVUKZNXP SemiconductorsIC MCU 32BIT 32KB FLASH 25WLCSPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
21
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 1.95V
Data Converters:
A/D 6x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
25-UFBGA, WLCSP
375
LPC1102LVUKZLPC1102LVUKZNXP SemiconductorsIC MCU 32BIT 32KB FLASH 25WLCSPMicrocontrollersN/AN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
21
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.65V ~ 1.95V
Data Converters:
A/D 6x8b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
25-UFBGA, WLCSP
667
LPC1102UK,118LPC1102UK,118NXP SemiconductorsIC MCU 32BIT 32KB FLASH 16WLCSPMicrocontrollers16-WLCSP (2.17x2.32)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
11
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 5x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-WLCSP (2.17×2.32)
Package / Case:
16-UFBGA, WLCSP
1,596
N/ALPC1104UK,118NXP SemiconductorsIC MCU 32BIT 32KB FLASH 16WLCSPMicrocontrollers16-WLCSP (2.17x2.32)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
11
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 5x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-WLCSP (2.17×2.32)
Package / Case:
16-UFBGA, WLCSP
183
LPC1110FD20,529LPC1110FD20,529NXP SemiconductorsIC MCU 32BIT 4KB FLASH 20SOMicrocontrollers20-SON/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
16
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 5x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SO
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
32
N/ALPC1110FD20YNXP SemiconductorsSCALABLE ENTRY LEVEL 32-BIT MICRMicrocontrollers20-SON/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
16
Program Memory Size:
4KB (4K x 8)
Program Memory Type:
FLASH
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 5x10b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-SO
Package / Case:
20-SOIC (0.295″”, 7.50mm Width)
966
LPC1111FDH20/002,5LPC1111FDH20/002,5NXP SemiconductorsIC MCU 32BIT 8KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
16
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 5x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
525
LPC1111FHN33/101,5LPC1111FHN33/101,5NXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
565
LPC1111FHN33/102,5LPC1111FHN33/102,5NXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
113
LPC1111FHN33/102'5LPC1111FHN33/102'5NXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
785
LPC1111FHN33/102KLPC1111FHN33/102KNXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
706
N/ALPC1111FHN33/103NXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
1,772
LPC1111FHN33/103,5LPC1111FHN33/103,5NXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
849
LPC1111FHN33/103KLPC1111FHN33/103KNXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
140
LPC1111FHN33/201,5LPC1111FHN33/201,5NXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
462
LPC1111FHN33/202,5LPC1111FHN33/202,5NXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
951
LPC1111FHN33/203,5LPC1111FHN33/203,5NXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
215
LPC1111JHN33/103ELPC1111JHN33/103ENXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
1,040
LPC1111JHN33/203ELPC1111JHN33/203ENXP SemiconductorsIC MCU 32BIT 8KB FLASH 32HVQFNMicrocontrollers32-HVQFN (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0
Core Size:
32-Bit Single-Core
Speed:
50MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, WDT
Number of I/O:
28
Program Memory Size:
8KB (8K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (7×7)
Package / Case:
32-VQFN Exposed Pad
695

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