 | | LPC1112JHN33/103E | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 838 | |
 | | LPC1112JHN33/203E | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 553 | |
 | | LPC1112LVFHI33/103 | NXP Semiconductors | IC MCU 32BIT 16KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (5x5) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (5×5) Package / Case: 32-VFQFN Exposed Pad | 1,453 | |
 | | LPC1112LVFHN24/003 | NXP Semiconductors | LPC1112 - Scalable Entry Level 3 | Microcontrollers | 24-HVQFN (4x4) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: FIFO, I2C, SPI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 16KB (16K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.65V ~ 1.95V Data Converters: A/D 6x8b SAR Oscillator Type: External, Internal Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 24-HVQFN (4×4) Package / Case: 24-VFQFN Exposed Pad | 90 | |
 | | LPC1113FBD48/301,1 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 1,364 | |
 | | LPC1113FBD48/302,1 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 1,855 | |
 | | LPC1113FBD48/302EL | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 1,262 | |
 | | LPC1113FBD48/303,1 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 48LQFP | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 1,680 | |
 | | LPC1113FHN33/201,5 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 791 | |
 | | LPC1113FHN33/202,5 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 1,820 | |
 | | LPC1113FHN33/202:5 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 797 | |
 | | LPC1113FHN33/203,5 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 399 | |
 | | LPC1113FHN33/301,5 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 611 | |
 | | LPC1113FHN33/302,5 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 192 | |
 | | LPC1113FHN33/302:5 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 914 | |
 | | LPC1113FHN33/302K | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 1,929 | |
 | | LPC1113FHN33/303,5 | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 85°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 598 | |
 | | LPC1113JBD48/303QL | NXP Semiconductors | LPC1113 - Scalable 32-bit Microc | Microcontrollers | 48-LQFP (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 48-LQFP (7×7) | 587 | |
 | | LPC1113JHN33/203E | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 1,092 | |
 | | LPC1113JHN33/303E | NXP Semiconductors | IC MCU 32BIT 24KB FLASH 32HVQFN | Microcontrollers | 32-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M0 Core Size: 32-Bit Single-Core Connectivity: I2C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, POR, WDT Program Memory Size: 24KB (24K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 8x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 32-HVQFN (7×7) Package / Case: 32-VQFN Exposed Pad | 836 | |