| N/A | | LPC55S28JEV98E | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 98VFBGA | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) | 250 | |
 | | LPC55S28JEV98K | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 98VFBGA | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) | 944 | |
| N/A | | LPC55S28JEV98Y | NXP Semiconductors | IC MCU 32BIT 512KB FLASH 98VFBGA | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 512KB (512K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) | 1,948 | |
| N/A | | LPC55S36JBD100E | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 100HLQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 23x16b; D/A 3x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) | 1,951 | |
| N/A | | LPC55S36JBD100K | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 100HLQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 23x16b; D/A 3x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) | 1,107 | |
| N/A | | LPC55S36JBD100MP | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 100HLQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART, USB2.0 Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 23x16b; D/A 3x12b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) | 741 | |
 | | LPC55S36JHI48E | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 48HVQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,024 | |
 | | LPC55S36JHI48K | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 48HVQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,176 | |
 | | LPC55S36JHI48MP | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 48HVQFN | Microcontrollers | 48-HVQFN (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Single-Core Connectivity: CAN FD, Flexcomm, I2C, I3C, SPI, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Oscillator Type: External, Internal Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount, Wettable Flank Supplier Device Package: 48-HVQFN (7×7) Package / Case: 48-VFQFN Exposed Pad | 1,692 | |
| N/A | | LPC55S66JBD100E | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 100LQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 359 | |
 | | LPC55S66JBD100K | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 100HLQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 1,960 | |
| N/A | | LPC55S66JBD100Y | NXP Semiconductors | IC MCU 32BIT 256KB FLSH 100LQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 1,671 | |
 | | LPC55S66JBD64E | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64TQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 31 | |
 | | LPC55S66JBD64K | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64HTQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 998 | |
| N/A | | LPC55S66JBD64Y | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64TQFP | Microcontrollers | 64-HTQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-HTQFP (10×10) Package / Case: 64-TQFP Exposed Pad | 90 | |
| N/A | | LPC55S66JEV98E | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 98VFBGA | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) | 1,018 | |
 | | LPC55S66JEV98K | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 98VFBGA | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) | 213 | |
| N/A | | LPC55S66JEV98Y | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 98VFBGA | Microcontrollers | 98-VFBGA (7x7) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 98-VFBGA (7×7) | 534 | |
| N/A | | LPC55S69JBD100E | NXP Semiconductors | IC MCU 32BIT 640KB FLASH 100LQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) Package / Case: 100-LQFP Exposed Pad | 446 | |
| N/A | | LPC55S69JBD100K | NXP Semiconductors | IC MCU 32BIT 640KB FLSH 100HLQFP | Microcontrollers | 100-HLQFP (14x14) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-M33 Core Size: 32-Bit Dual-Core Connectivity: Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB Peripherals: Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT Program Memory Size: 640KB (640K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 1.8V ~ 3.6V Data Converters: A/D 10x16b SAR Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 100-HLQFP (14×14) | 413 | |