Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
LPC55S69JBD100YLPC55S69JBD100YNXP SemiconductorsIC MCU 32BIT 640KB FLSH 100HLQFPMicrocontrollers100-HLQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-HLQFP (14×14)
Package / Case:
100-LQFP Exposed Pad
871
N/ALPC55S69JBD64ENXP SemiconductorsIC MCU 32BIT 640KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
497
LPC55S69JBD64KLPC55S69JBD64KNXP SemiconductorsIC MCU 32BIT 640KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
23
N/ALPC55S69JBD64YNXP SemiconductorsIC MCU 32BIT 640KB FLASH 64HTQFPMicrocontrollers64-HTQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
36
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-HTQFP (10×10)
Package / Case:
64-TQFP Exposed Pad
456
N/ALPC55S69JEV98ENXP SemiconductorsIC MCU 32BIT 640KB FLASHMicrocontrollers98-VFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
98-VFBGA (7×7)
Package / Case:
98-VFBGA
1,039
LPC55S69JEV98KLPC55S69JEV98KNXP SemiconductorsIC MCU 32BIT 640KB FLASH 98VFBGAMicrocontrollers98-VFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
98-VFBGA (7×7)
Package / Case:
98-VFBGA
484
N/ALPC55S69JEV98YNXP SemiconductorsIC MCU 32BIT 640KB FLASHMicrocontrollers98-VFBGA (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M33
Core Size:
32-Bit Dual-Core
Speed:
150MHz
Connectivity:
Flexcomm, I2C, MMC/SD/SDIO, SPI, UART/USART, USB
Peripherals:
Brown-out Detect/Reset, DMA, I2S, POR, PWM, RNG, WDT
Number of I/O:
64
Program Memory Size:
640KB (640K x 8)
Program Memory Type:
FLASH
RAM Size:
320K x 8
Voltage – Supply (Vcc/Vdd):
1.8V ~ 3.6V
Data Converters:
A/D 10x16b SAR
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
98-VFBGA (7×7)
Package / Case:
98-VFBGA
501
N/AN/ALPC802M001JDH16NXP SemiconductorsIC MCU 32BIT FLASHMicrocontrollersN/AN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Type:
FLASH
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
525
LPC802M001JDH16FPLPC802M001JDH16FPNXP SemiconductorsIC MCU 32BIT 16KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
514
LPC802M001JDH16JLPC802M001JDH16JNXP SemiconductorsIC MCU 32BIT 16KB FLASH 16TSSOPMicrocontrollers16-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-TSSOP
Package / Case:
16-TSSOP (0.173″”, 4.40mm Width)
136
LPC802M001JDH20FPLPC802M001JDH20FPNXP SemiconductorsIC MCU 32BIT 16KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
144
LPC802M001JDH20JLPC802M001JDH20JNXP SemiconductorsIC MCU 32BIT 16KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
667
LPC802M001JHI33ELPC802M001JHI33ENXP SemiconductorsIC MCU 32BIT 16KB FLASH 33HVQFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
420
LPC802M001JHI33YLPC802M001JHI33YNXP SemiconductorsIC MCU 32BIT 16KB FLASH 33HVQFNMicrocontrollers32-HVQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-HVQFN (5×5)
Package / Case:
32-VFQFN Exposed Pad
266
LPC802M011JDH20FPLPC802M011JDH20FPNXP SemiconductorsIC MCU 32BIT 16KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
576
N/ALPC802M011JDH20JNXP SemiconductorsLPC802M011JDH20Microcontrollers20-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
16
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b SAR
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
844
N/ALPC802UKZNXP SemiconductorsIC MCU 32BIT 16KB FLASH 16WLCSPMicrocontrollers16-WLCSP (1.84x1.84)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
13
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
16-WLCSP (1.84×1.84)
Package / Case:
16-UFBGA, WLCSP
122
LPC804M101JDH20FPLPC804M101JDH20FPNXP SemiconductorsIC MCU 32BIT 32KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
1,998
LPC804M101JDH20JLPC804M101JDH20JNXP SemiconductorsIC MCU 32BIT 32KB FLASH 20TSSOPMicrocontrollers20-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
17
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
20-TSSOP
Package / Case:
20-TSSOP (0.173″”, 4.40mm Width)
778
LPC804M101JDH24FPLPC804M101JDH24FPNXP SemiconductorsIC MCU 32BIT 32KB FLASH 24TSSOPMicrocontrollers24-TSSOPN/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M0+
Core Size:
32-Bit Single-Core
Speed:
15MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
Brown-out Detect/Reset, POR, PWM, WDT
Number of I/O:
21
Program Memory Size:
32KB (32K x 8)
Program Memory Type:
FLASH
RAM Size:
4K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Data Converters:
A/D 12x12b; D/A 1x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
24-TSSOP
Package / Case:
24-TSSOP (0.173″”, 4.40mm Width)
1,212

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