Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

Featured Brands

About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
N/AM13S2561616A-4TIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
715
N/AM13S2561616A-5BG2TESMT256Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
207
N/AM13S2561616A-5BIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory60-BGA2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
60-BGA
672
N/AM13S2561616A-5TG2TESMT256Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,317
N/AM13S2561616A-5TIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
765
N/AM13S2561616A-6BG2TESMT256Mb DDR SDRAMDRAM Memory60-BGA2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
60-BGA
1,219
N/AM13S2561616A-6BIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory60-BGA2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
60-BGA
403
N/AM13S2561616A-6TG2TESMT256Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
307
N/AM13S2561616A-6TIG2TESMT256Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
256 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
4M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
595
N/AM13S5121632A-5TG2TESMT512Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
923
N/AM13S5121632A-5TIG2TESMT512Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
165
N/AM13S5121632A-6TG2TESMT512Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
94
N/AM13S5121632A-6TIG2TESMT512Mb DDR SDRAM Ind.DRAM Memory66-TSOPII2.3V ~ 2.7V-40°C – 85°C
Memory Size:
512 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Industrial
Qualification:
JEDEC
Packaging:
66-TSOPII
35
N/AM13S64164A-4TG2CESMT64Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
250 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
10 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
211
N/AM13S64164A-5TG2CESMT64Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
200 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
1,288
N/AM13S64164A-6TG2CESMT64Mb DDR SDRAMDRAM Memory66-TSOPII2.3V ~ 2.7V0°C – 70°C
Memory Size:
64 Mbit
Clock Frequency:
166 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
1M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
66-TSOPII
817
N/AM14D128168A-1.5BG2YESMT128Mb DDR2 SDRAMDRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C – 95°C
Memory Size:
128 Mbit
Clock Frequency:
667 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
84-FBGA
446
N/AM14D128168A-1.6BG2YESMT128Mb DDR2 SDRAMDRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C – 95°C
Memory Size:
128 Mbit
Clock Frequency:
600 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
84-FBGA
1,165
N/AM14D128168A-1.8BG2YESMT128Mb DDR2 SDRAMDRAM Memory84-FBGA (8x12.5)1.7V ~ 1.9V0°C – 95°C
Memory Size:
128 Mbit
Clock Frequency:
533 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
84-FBGA
1,124
N/AM14D128168A-1(2Y)ESMT128Mb DDR SDRAMDRAM Memory84 Ball FBGA2.5V0°C – 95°C
Memory Size:
128 Mbit
Clock Frequency:
667 MHz
Write Cycle Time Word Page:
15 ns
Access Time:
15 ns
Memory Type:
Volatile
Memory Format:
DRAM
Technology:
DDR2 SDRAM
Memory Organization:
8M x 16
Memory Interface:
Parallel
Grade:
Commercial
Qualification:
JEDEC
Packaging:
84 Ball FBGA
688

See What We Have to Offer!

See What We Have to Offer!

keyboard_arrow_up