Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MAX324CUA+MAX324CUA+Analog Devices Inc.IC SWITCH SPST-NCX2 60OHM 8UMAXAnalog Switches, Multiplexers, Demultiplexers8-uMAX/uSOPN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
60Ohm
Channel-to-Channel Matching (ΔRon):
800mOhm
Voltage – Supply, Single (V+):
2.7V ~ 16V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
1pC
Channel Capacitance (CS(off), CD(off)):
9pF, 9pF
Current – Leakage (IS(off)) (Max):
100pA
Crosstalk:
-85dB @ 1MHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-TSSOP, 8-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
8-uMAX/uSOP
1,756
MAX324CUA+TMAX324CUA+TAnalog Devices Inc.IC SWITCH SPST-NCX2 60OHM 8UMAXAnalog Switches, Multiplexers, Demultiplexers8-uMAX/uSOPN/A0°C ~ 70°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
60Ohm
Channel-to-Channel Matching (ΔRon):
800mOhm
Voltage – Supply, Single (V+):
2.7V ~ 16V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
1pC
Channel Capacitance (CS(off), CD(off)):
9pF, 9pF
Current – Leakage (IS(off)) (Max):
100pA
Crosstalk:
-85dB @ 1MHz
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-TSSOP, 8-MSOP (0.118″”, 3.00mm Width)
Supplier Device Package:
8-uMAX/uSOP
607
MAX324ESAMAX324ESAAnalog Devices Inc.IC SWITCH SPST-NCX2 60OHM 8SOICAnalog Switches, Multiplexers, Demultiplexers8-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
60Ohm
Channel-to-Channel Matching (ΔRon):
800mOhm
Voltage – Supply, Single (V+):
2.7V ~ 16V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
1pC
Channel Capacitance (CS(off), CD(off)):
9pF, 9pF
Current – Leakage (IS(off)) (Max):
100pA
Crosstalk:
-85dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
562
MAX324ESA+MAX324ESA+Analog Devices Inc.IC SWITCH SPST-NCX2 60OHM 8SOICAnalog Switches, Multiplexers, Demultiplexers8-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
60Ohm
Channel-to-Channel Matching (ΔRon):
800mOhm
Voltage – Supply, Single (V+):
2.7V ~ 16V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
1pC
Channel Capacitance (CS(off), CD(off)):
9pF, 9pF
Current – Leakage (IS(off)) (Max):
100pA
Crosstalk:
-85dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
558
N/AMAX324ESA+G002Analog Devices Inc.INTEGRATED CIRCUITAnalog Switches, Multiplexers, DemultiplexersN/AN/AN/A

N/A

1,059
MAX324ESA+TMAX324ESA+TAnalog Devices Inc.IC SWITCH SPST-NCX2 60OHM 8SOICAnalog Switches, Multiplexers, Demultiplexers8-SOICN/A-40°C ~ 85°C (TA)
Switch Circuit:
SPST – NC
Multiplexer/Demultiplexer Circuit:
1:1
Number of Circuits:
2
On-State Resistance (Max):
60Ohm
Channel-to-Channel Matching (ΔRon):
800mOhm
Voltage – Supply, Single (V+):
2.7V ~ 16V
Switch Time (Ton, Toff) (Max):
150ns, 100ns
Charge Injection:
1pC
Channel Capacitance (CS(off), CD(off)):
9pF, 9pF
Current – Leakage (IS(off)) (Max):
100pA
Crosstalk:
-85dB @ 1MHz
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
8-SOIC (0.154″”, 3.90mm Width)
Supplier Device Package:
8-SOIC
1,982
MAX3250CAI+MAX3250CAI+Analog Devices Inc.IC TRANSCEIVER FULL 2/2 28SSOPDrivers, Receivers, Transceivers28-SSOP3V ~ 5.5V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
500 mV
Data Rate:
250kbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
Supplier Device Package:
28-SSOP
1,434
MAX3250CAI+TMAX3250CAI+TAnalog Devices Inc.IC TRANSCEIVER FULL 2/2 28SSOPDrivers, Receivers, Transceivers28-SSOP3V ~ 5.5V0°C ~ 70°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
500 mV
Data Rate:
250kbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
0°C ~ 70°C
Mounting Type:
Surface Mount
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
Supplier Device Package:
28-SSOP
996
MAX3250EAI+MAX3250EAI+Analog Devices Inc.IC TRANSCEIVER FULL 2/2 28SSOPDrivers, Receivers, Transceivers28-SSOP3V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
500 mV
Data Rate:
250kbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
Supplier Device Package:
28-SSOP
1,595
MAX3250EAI+TMAX3250EAI+TAnalog Devices Inc.IC TRANSCEIVER FULL 2/2 28SSOPDrivers, Receivers, Transceivers28-SSOP3V ~ 5.5V-40°C ~ 85°C
Type:
Transceiver
Protocol:
RS232
Number of Drivers/Receivers:
2/2
Duplex:
Full
Receiver Hysteresis:
500 mV
Data Rate:
250kbps
Voltage – Supply:
3V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Package / Case:
28-SSOP (0.209″”, 5.30mm Width)
Supplier Device Package:
28-SSOP
183
N/AMAX32510-BNJ+Analog Devices Inc.IC MCU 32BIT 512KB FLASH 68TQFNMicrocontrollers68-TQFN (8x8)N/A–
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
60MHz
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
28
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3.3V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
68-TQFN (8×8)
Package / Case:
68-WFQFN Exposed Pad
311
N/AMAX32510-BNS+Analog Devices Inc.IC MCU 32BIT 512KB FLASH 68TQFNMicrocontrollers68-TQFN (8x8)N/A–
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
60MHz
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
28
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3.3V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
68-TQFN (8×8)
Package / Case:
68-WFQFN Exposed Pad
692
N/AMAX32510-BNS+TAnalog Devices Inc.IC MCU 32BIT 512KB FLASH 68TQFNMicrocontrollers68-TQFN (8x8)N/A–
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
60MHz
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
DMA, PWM, WDT
Number of I/O:
28
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3.3V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
68-TQFN (8×8)
Package / Case:
68-WFQFN Exposed Pad
50
N/AMAX32510-DPS+Analog Devices Inc.IC MCU 32BIT 512KB FLASH 68WFQFNMicrocontrollers68-TQFN (8x8)N/A-40°C ~ 85°C
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit
Speed:
60MHz
Connectivity:
I2C, SPI, UART/USART, USB
Peripherals:
Crypto – AES, DMA, PWM, SHA, TRNG, WDT
Number of I/O:
28
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
RAM Size:
96K x 8
Voltage – Supply (Vcc/Vdd):
3.3V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C
Mounting Type:
Surface Mount
Supplier Device Package:
68-TQFN (8×8)
Package / Case:
68-WFQFN Exposed Pad
210
MAX32520-BNJ+N/AMAX32520-BNJ+Analog Devices Inc.IC MCU 32BIT 2MB FLASH 32TQFNMicrocontrollers32-TQFN (5x5)N/A-40°C ~ 105°C (TA)
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
27
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
170K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
357
MAX32520-BNS+TN/AMAX32520-BNS+TAnalog Devices Inc.IC MCU 32BIT 2MB FLASH 32TQFNMicrocontrollers32-TQFN (5x5)N/A–
Core Processor:
ARM® Cortex®-M4F
Core Size:
32-Bit Single-Core
Speed:
120MHz
Connectivity:
I2C, SSP, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
27
Program Memory Size:
2MB (2M x 8)
Program Memory Type:
FLASH
RAM Size:
170K x 8
Voltage – Supply (Vcc/Vdd):
1.71V ~ 3.6V
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
32-TQFN (5×5)
Package / Case:
32-WFQFN Exposed Pad
331
N/AN/AMAX32550-LBJ+Analog Devices Inc.IC MCU 32BIT 1MB FLASH 121CTBGAMicrocontrollers121-CTBGA (8x8)N/A–
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
108MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM
Number of I/O:
70
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.3V
Data Converters:
A/D 2x10b; A/D 1x8b
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
121-CTBGA (8×8)
Package / Case:
121-LFBGA
20
N/AN/AMAX32550-LBS+Analog Devices Inc.IC MCU 32BIT 1MB FLASH 121CTBGAMicrocontrollers121-CTBGA (8x8)N/A–
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
108MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Data Converters:
A/D 2x10b; D/A 1x8b
Oscillator Type:
External
Mounting Type:
Surface Mount
Supplier Device Package:
121-CTBGA (8×8)
Package / Case:
121-LFBGA
756
N/AN/AMAX32550-LCJ+Analog Devices Inc.IC MCU 32BIT 1MB FLASH 121CTBGAMicrocontrollers121-CTBGA (8x8)N/A–
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
108MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM
Number of I/O:
70
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.3V
Data Converters:
A/D 2x10b; A/D 1x8b
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
121-CTBGA (8×8)
Package / Case:
121-LFBGA
816
N/AN/AMAX32550-LCS+Analog Devices Inc.IC MCU 32BIT 1MB FLASH 121CTBGAMicrocontrollers121-CTBGA (8x8)N/A–
Core Processor:
ARM® Cortex®-M3
Core Size:
32-Bit Single-Core
Speed:
108MHz
Connectivity:
I2C, SPI, UART/USART
Peripherals:
DMA, PWM
Number of I/O:
70
Program Memory Size:
1MB (1M x 8)
Program Memory Type:
FLASH
RAM Size:
256K x 8
Voltage – Supply (Vcc/Vdd):
3.3V
Data Converters:
A/D 2x10b; A/D 1x8b
Oscillator Type:
Internal
Mounting Type:
Surface Mount
Supplier Device Package:
121-CTBGA (8×8)
Package / Case:
121-LFBGA
695

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