Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC56F82748MLHN/AMC56F82748MLHNXP SemiconductorsIC MCU 32BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
56800EX
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,319
MC56F82748MLHRN/AMC56F82748MLHRNXP SemiconductorsIC MCU 32BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
56800EX
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
64KB (64K x 8)
Program Memory Type:
FLASH
RAM Size:
8K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,507
MC56F82748VLHMC56F82748VLHNXP SemiconductorsIC MCU 32BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
56800EX
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
819
MC56F82748VLHRMC56F82748VLHRNXP SemiconductorsIC MCU 32BIT 64KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
56800EX
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, SCI, SPI
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
4K x 16
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 16x12b; D/A 2x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,364
N/AN/AMC56F83163VLHNXP SemiconductorsIC MCU 32BIT 128MB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
56800EX
Core Size:
32-Bit
Speed:
100MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI, USB
Peripherals:
Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O:
54
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
32K x 8
RAM Size:
48K x 8
Voltage – Supply (Vcc/Vdd):
2.7V ~ 3.6V
Data Converters:
A/D 20x12b
Oscillator Type:
External, Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,447
MC56F8322MFAEMC56F8322MFAENXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 125°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
21
Program Memory Size:
32KB (16K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,190
MC56F8322VFAEMC56F8322VFAENXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
21
Program Memory Size:
32KB (16K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
291
MC56F8322VFAER2MC56F8322VFAER2NXP SemiconductorsIC MCU 16BIT 32KB FLASH 48LQFPMicrocontrollers48-LQFP (7x7)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
21
Program Memory Size:
32KB (16K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 6x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
48-LQFP (7×7)
Package / Case:
48-LQFP
1,113
MC56F8323MFBEMC56F8323MFBENXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 125°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
27
Program Memory Size:
32KB (16K x 16)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
10
MC56F8323VFB60MC56F8323VFB60NXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
27
Program Memory Size:
32KB (16K x 16)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
599
MC56F8323VFBEMC56F8323VFBENXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
27
Program Memory Size:
32KB (16K x 16)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
1,200
N/AMC56F8323VFBERNXP SemiconductorsIC MCU 16BIT 32KB FLASH 64LQFPMicrocontrollers64-LQFP (10x10)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
27
Program Memory Size:
32KB (16K x 16)
Program Memory Type:
FLASH
RAM Size:
12K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
64-LQFP (10×10)
Package / Case:
64-LQFP
183
MC56F8335MFGEMC56F8335MFGENXP SemiconductorsIC MCU 16BIT 64KB FLASH 128LQFPMicrocontrollers128-LQFP (14x20)N/A-40°C ~ 125°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
49
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LQFP (14×20)
Package / Case:
128-LQFP
726
MC56F8335VFGEMC56F8335VFGENXP SemiconductorsIC MCU 16BIT 64KB FLASH 128LQFPMicrocontrollers128-LQFP (14x20)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
49
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LQFP (14×20)
Package / Case:
128-LQFP
1,676
MC56F8335VFGERMC56F8335VFGERNXP SemiconductorsIC MCU 16BIT 64KB FLASH 128LQFPMicrocontrollers128-LQFP (14x20)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
49
Program Memory Size:
64KB (32K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LQFP (14×20)
Package / Case:
128-LQFP
626
MC56F8345MFGEMC56F8345MFGENXP SemiconductorsIC MCU 16BIT 128KB FLASH 128LQFPMicrocontrollers128-LQFP (14x20)N/A-40°C ~ 125°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
49
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LQFP (14×20)
Package / Case:
128-LQFP
798
MC56F8345VFGEMC56F8345VFGENXP SemiconductorsIC MCU 16BIT 128KB FLASH 128LQFPMicrocontrollers128-LQFP (14x20)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
49
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
128-LQFP (14×20)
Package / Case:
128-LQFP
279
MC56F8346MFVEMC56F8346MFVENXP SemiconductorsIC MCU 16BIT 128KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 125°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
62
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
334
MC56F8346VFVEMC56F8346VFVENXP SemiconductorsIC MCU 16BIT 128KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)2.25V - 3.6V-40°C – 105°C
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Program Memory Size:
128KB (64K x 16)
Mounting Type:
Surface Mount
670
MC56F8346VFVER2MC56F8346VFVER2NXP SemiconductorsIC MCU 16BIT 128KB FLASH 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
56800E
Core Size:
16-Bit
Speed:
60MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, Temp Sensor, WDT
Number of I/O:
62
Program Memory Size:
128KB (64K x 16)
Program Memory Type:
FLASH
RAM Size:
6K x 16
Voltage – Supply (Vcc/Vdd):
2.25V ~ 3.6V
Data Converters:
A/D 16x12b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
149

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