 | | MC56F8347MPYE | NXP Semiconductors | IC MCU 16BIT 128KB FLASH 160LQFP | Microcontrollers | 160-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 128KB (64K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-LQFP (24×24) | 22 | |
 | | MC56F8347VPYE | NXP Semiconductors | IC MCU 16BIT 128KB FLASH 160LQFP | Microcontrollers | 160-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 128KB (64K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-LQFP (24×24) | 815 | |
 | | MC56F8347VVFE | NXP Semiconductors | IC MCU 16B 128KB FLASH 160MAPBGA | Microcontrollers | 160-MAPBGA (15x15) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 128KB (64K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-MAPBGA (15×15) | 257 | |
 | | MC56F8355MFGE | NXP Semiconductors | IC MCU 16BIT 256KB FLASH 128LQFP | Microcontrollers | 128-LQFP (14x20) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 256KB (128K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 128-LQFP (14×20) | 718 | |
 | | MC56F8355VFGE | NXP Semiconductors | IC MCU 16BIT 256KB FLASH 128LQFP | Microcontrollers | 128-LQFP (14x20) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 256KB (128K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 128-LQFP (14×20) | 206 | |
 | | MC56F8356MFVE | NXP Semiconductors | IC MCU 16BIT 256KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 256KB (128K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 63 | |
 | | MC56F8356VFVE | NXP Semiconductors | IC MCU 16BIT 256KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 256KB (128K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,961 | |
 | N/A | MC56F8357MPYE | NXP Semiconductors | IC MCU 16BIT 256KB FLASH 160LQFP | Microcontrollers | 160-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 256KB (128K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-LQFP (24×24) | 431 | |
 | N/A | MC56F8357VPYE | NXP Semiconductors | IC MCU 16BIT 256KB FLASH 160LQFP | Microcontrollers | 160-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 256KB (128K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-LQFP (24×24) | 562 | |
 | N/A | MC56F8357VVFE | NXP Semiconductors | IC MCU 16B 256KB FLASH 160MAPBGA | Microcontrollers | 160-MAPBGA (15x15) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 256KB (128K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-MAPBGA (15×15) | 1,417 | |
 | | MC56F8365MFGE | NXP Semiconductors | IC MCU 16BIT 512KB FLASH 128LQFP | Microcontrollers | 128-LQFP (14x20) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 128-LQFP (14×20) | 364 | |
 | | MC56F8365VFGE | NXP Semiconductors | IC MCU 16BIT 512KB FLASH 128LQFP | Microcontrollers | 128-LQFP (14x20) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 128-LQFP (14×20) | 146 | |
 | | MC56F83663VLH | NXP Semiconductors | IC MCU 32BIT 128KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Program Memory Size: 128KB (128K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,195 | |
 | | MC56F8366MFVE | NXP Semiconductors | IC MCU 16BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,182 | |
 | | MC56F8366VFVE | NXP Semiconductors | IC MCU 16BIT 512KB FLASH 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 318 | |
 | N/A | MC56F8367MPYE | NXP Semiconductors | IC MCU 16BIT 512KB FLASH 160LQFP | Microcontrollers | 160-LQFP (24x24) | N/A | -40°C ~ 125°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-LQFP (24×24) | 431 | |
 | N/A | MC56F8367VPYE | NXP Semiconductors | IC MCU 16BIT 512KB FLASH 160LQFP | Microcontrollers | 160-LQFP (24x24) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-LQFP (24×24) | 1,378 | |
 | N/A | MC56F8367VVFE | NXP Semiconductors | IC MCU 16B 512KB FLASH 160MAPBGA | Microcontrollers | 160-MAPBGA (15x15) | N/A | -40°C ~ 105°C (TA) | Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, Temp Sensor, WDT Program Memory Size: 512KB (256K x 16) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.25V ~ 3.6V Data Converters: A/D 16x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-MAPBGA (15×15) | 333 | |
 | | MC56F83683VLH | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 64LQFP | Microcontrollers | 64-LQFP (10x10) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 64-LQFP (10×10) | 1,013 | |
 | | MC56F83686VLK | NXP Semiconductors | IC MCU 32BIT 256KB FLASH 80LQFP | Microcontrollers | 80-FQFP (12x12) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, I2C, LINbus, SCI, SPI Peripherals: Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT Program Memory Size: 256KB (256K x 8) Program Memory Type: FLASH Voltage – Supply (Vcc/Vdd): 2.7V ~ 3.6V Data Converters: A/D 20x12b; D/A 2x12b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 80-FQFP (12×12) | 208 | |