Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC56F84766VLKN/AMC56F84766VLKNXP SemiconductorsIC MCU 32BIT 128KB FLASH 80FQFPMicrocontrollers80-FQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
56800EX
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b, 10x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-FQFP (12×12)
Package / Case:
80-LQFP
111
MC56F84766VLKRMC56F84766VLKRNXP SemiconductorsIC MCU 32BIT 128KB FLASH 80FQFPMicrocontrollers80-FQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
56800EX
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b, 10x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-FQFP (12×12)
Package / Case:
80-LQFP
912
MC56F84769VLLN/AMC56F84769VLLNXP SemiconductorsIC MCU 32BIT 128KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
56800EX
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
128KB (128K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
24K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b, 16x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
864
MC56F84786VLKMC56F84786VLKNXP SemiconductorsIC MCU 32BIT 256KB FLASH 80FQFPMicrocontrollers80-FQFP (12x12)N/A-40°C ~ 105°C (TA)
Core Processor:
56800EX
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O:
68
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b, 10x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
80-FQFP (12×12)
Package / Case:
80-LQFP
147
MC56F84789VLLMC56F84789VLLNXP SemiconductorsIC MCU 32BIT 256KB FLASH 100LQFPMicrocontrollers100-LQFP (14x14)N/A-40°C ~ 105°C (TA)
Core Processor:
56800EX
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
CANbus, I2C, LINbus, SCI, SPI
Peripherals:
Brown-out Detect/Reset, DMA, LVD, POR, PWM, WDT
Number of I/O:
86
Program Memory Size:
256KB (256K x 8)
Program Memory Type:
FLASH
EEPROM Size:
2K x 8
RAM Size:
32K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x12b, 16x16b; D/A 1x12b
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
100-LQFP (14×14)
Package / Case:
100-LQFP
940
MC68020CEH25EMC68020CEH25ENXP SemiconductorsIC MPU M680X0 25MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A-40°C ~ 85°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
795
MC68020CRC16EMC68020CRC16ENXP SemiconductorsIC MPU M680X0 166MHZ 114PGAMicroprocessors114-PGA (34.55x34.55)N/A-40°C ~ 85°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
114-BPGA
Supplier Device Package:
114-PGA (34.55×34.55)
54
MC68020CRC20EMC68020CRC20ENXP SemiconductorsIC MPU M680X0 20MHZ 114PGAMicroprocessors114-PGA (34.55x34.55)N/A-40°C ~ 85°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
20MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
114-BPGA
Supplier Device Package:
114-PGA (34.55×34.55)
710
MC68020CRC25EMC68020CRC25ENXP SemiconductorsIC MPU M680X0 25MHZ 114PGAMicroprocessors114-PGA (34.55x34.55)N/A-40°C ~ 85°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Through Hole
Package / Case:
114-BPGA
Supplier Device Package:
114-PGA (34.55×34.55)
467
MC68020EH16EMC68020EH16ENXP SemiconductorsIC MPU M680X0 166MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
439
MC68020EH20EMC68020EH20ENXP SemiconductorsIC MPU M680X0 20MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
20MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
400
MC68020EH25EMC68020EH25ENXP SemiconductorsIC MPU M680X0 25MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
316
MC68020EH33EMC68020EH33ENXP SemiconductorsIC MPU M680X0 33MHZ 132PQFPMicroprocessors132-PQFP (46x46)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BQFP Bumpered
Supplier Device Package:
132-PQFP (46×46)
363
MC68020FE16EMC68020FE16ENXP SemiconductorsIC MPU M680X0 166MHZ 132CQFPMicroprocessors132-CQFP (24x24)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
166MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BCQFP
Supplier Device Package:
132-CQFP (24×24)
641
MC68020FE25EMC68020FE25ENXP SemiconductorsIC MPU M680X0 25MHZ 132CQFPMicroprocessors132-CQFP (24x24)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BCQFP
Supplier Device Package:
132-CQFP (24×24)
1,069
MC68020FE33EMC68020FE33ENXP SemiconductorsIC MPU M680X0 33MHZ 132CQFPMicroprocessors132-CQFP (24x24)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Package / Case:
132-BCQFP
Supplier Device Package:
132-CQFP (24×24)
1,049
MC68020RC16EMC68020RC16ENXP SemiconductorsIC MPU M680X0 16MHZ 114PGAMicroprocessors114-PGA (34.55x34.55)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
16MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
114-BPGA
Supplier Device Package:
114-PGA (34.55×34.55)
268
MC68020RC20EMC68020RC20ENXP SemiconductorsIC MPU M680X0 20MHZ 114PGAMicroprocessors114-PGA (34.55x34.55)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
20MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
114-BPGA
Supplier Device Package:
114-PGA (34.55×34.55)
1,114
MC68020RC25EMC68020RC25ENXP SemiconductorsIC MPU M680X0 25MHZ 114PGAMicroprocessors114-PGA (34.55x34.55)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
114-BPGA
Supplier Device Package:
114-PGA (34.55×34.55)
580
MC68020RC33EMC68020RC33ENXP SemiconductorsIC MPU M680X0 33MHZ 114PGAMicroprocessors114-PGA (34.55x34.55)N/A0°C ~ 70°C (TA)
Core Processor:
68020
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
33MHz
Graphics Acceleration:
No
Voltage – I/O:
5.0V
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Through Hole
Package / Case:
114-BPGA
Supplier Device Package:
114-PGA (34.55×34.55)
217

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