 | | MC68332GCEH25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 307 | |
 | | MC68332GCFC16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 817 | |
 | | MC68332GCPV16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 460 | |
 | | MC68332GCPV16B1 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 450 | |
 | | MC68332GCPV20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,640 | |
 | | MC68332GMEH16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 1,456 | |
 | | MC68332GMEH20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 893 | |
 | | MC68332GVAG16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 917 | |
 | | MC68332GVAG25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 144LQFP | Microcontrollers | 144-LQFP (20x20) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 764 | |
 | | MC68332GVEH20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 440 | |
 | | MC68332GVEH25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, SCI, SPI, UART/USART Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 1,190 | |
 | | MC68334GCEH16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 8×8/10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 454 | |
 | | MC68334GCEH20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 8×8/10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 1,612 | |
 | | MC68334GCFC16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 8×8/10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 972 | |
 | | MC68334GEH16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | 0°C ~ 70°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 8×8/10b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 876 | |
 | | MC68334GFC16 | NXP Semiconductors | IC MCU 32BIT ROMLESS 132PQFP | Microcontrollers | 132-PQFP (24.13x24.13) | N/A | 0°C ~ 70°C (TA) | Core Size: 32-Bit Single-Core Connectivity: EBI/EMI, UART/USART Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 3V ~ 5.5V Data Converters: A/D 8×8/10b Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 132-PQFP (24.13×24.13) Package / Case: 132-BQFP Bumpered | 398 | |
 | | MC68336ACAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 1,677 | |
 | | MC68336ACFT20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 467 | |
 | | MC68336AMAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 846 | |
 | | MC68336GCAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 731 | |