Integrated Circuits

Discover a comprehensive selection of high-performance integrated circuits (ICs). Our offerings include microcontrollers, microprocessors, FPGAs, and more, designed to deliver exceptional functionality and reliability. Click one of the categories below to explore our IC solutions.

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About Integrated Circuits

Integrated circuits (ICs) are essential components in modern electronic devices, combining multiple electronic components onto a single semiconductor substrate. These miniature electronic circuits perform a variety of functions, from simple logic gates to complex microprocessors. ICs are known for their small size, efficiency, reliability, and versatility, making them indispensable in a wide range of applications.

What Are Integrated Circuits?

Integrated circuits are semiconductor devices that integrate multiple electronic components—including transistors, resistors, and capacitors—onto a single silicon chip to perform computing, control, or signal processing functions.

Engineers use integrated circuits to deliver compact processing power, control electronic systems, and support applications in consumer electronics, embedded computing, and industrial technology. Integrated circuits often rely on complimentary circuit protection devices to prevent damage from voltage spikes and overcurrent conditions. Explore Suntsu’s portfolio of integrated circuits to source reliable components for your next circuit board or system design.

Types of Integrated Circuits We Offer

Microcontrollers

Microcontrollers are compact integrated circuits that combine a processor core, memory, and input/output interfaces onto a single chip. These devices function as the control unit within embedded electronic systems, allowing engineers to program and manage hardware operations.

Microcontrollers are widely used in consumer electronics, industrial automation, and IoT devices, where efficient processing power and low power consumption are required. Their integrated architecture simplifies circuit board design while enabling flexible system control.

Microprocessors

Microprocessors serve as the central processing unit of computing systems, executing instructions and performing data processing tasks within electronic devices. These integrated circuits contain complex architectures with billions of transistors, enabling high computational performance.

Engineers integrate microprocessors into embedded computing systems, networking equipment, and industrial controllers where advanced processing capabilities are required for machine learning, automation, and data-driven applications.

Field Programmable Gate Arrays (FPGAs)

Field Programmable Gate Arrays (FPGAs) are configurable integrated circuits designed to be programmed after manufacturing. These devices allow engineers to customize digital logic functions by configuring programmable interconnect structures and logic blocks.

FPGAs are commonly used in communications infrastructure, test and measurement equipment, and advanced electronic systems where flexible hardware acceleration and parallel processing are required.

How to Choose the Right Integrated Circuits

Processing Requirements: Determine the level of processing power needed based on the system’s computing workload, control tasks, or signal processing demands.

Application-Specific Functionality: Some designs benefit from application-specific integrated circuits that optimize performance for targeted workloads such as networking, automation, or machine learning.

IC Package and Board Compatibility: Ensure the selected IC package fits the circuit board layout and aligns with manufacturing and thermal requirements.

Power Consumption and System Efficiency: Embedded devices and portable electronics often require integrated circuits designed for efficient power management.

System Architecture and Interconnect Needs: Evaluate how the IC will communicate with other components through memory, peripherals, and interconnect interfaces within the broader electronic system.

Part Search

Total Products: 134,052
ImageData
Sheet
Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp
Additional SpecificationsQtyGet A
Quote
MC68332GCEH25MC68332GCEH25NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
307
MC68332GCFC16MC68332GCFC16NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
817
MC68332GCPV16MC68332GCPV16NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
460
MC68332GCPV16B1MC68332GCPV16B1NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
450
MC68332GCPV20MC68332GCPV20NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
1,640
MC68332GMEH16MC68332GMEH16NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
1,456
MC68332GMEH20MC68332GMEH20NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
893
MC68332GVAG16MC68332GVAG16NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
917
MC68332GVAG25MC68332GVAG25NXP SemiconductorsIC MCU 32BIT ROMLESS 144LQFPMicrocontrollers144-LQFP (20x20)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
144-LQFP (20×20)
Package / Case:
144-LQFP
764
MC68332GVEH20MC68332GVEH20NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
440
MC68332GVEH25MC68332GVEH25NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 105°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
25MHz
Connectivity:
EBI/EMI, SCI, SPI, UART/USART
Peripherals:
POR, PWM, WDT
Number of I/O:
15
Program Memory Type:
ROMless
RAM Size:
2K x 8
Voltage – Supply (Vcc/Vdd):
4.5V ~ 5.5V
Oscillator Type:
Internal
Operating Temperature:
-40°C ~ 105°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
1,190
MC68334GCEH16MC68334GCEH16NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, UART/USART
Number of I/O:
47
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
454
MC68334GCEH20MC68334GCEH20NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
EBI/EMI, UART/USART
Number of I/O:
47
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
1,612
MC68334GCFC16MC68334GCFC16NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, UART/USART
Number of I/O:
47
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
972
MC68334GEH16MC68334GEH16NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, UART/USART
Number of I/O:
47
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
876
MC68334GFC16MC68334GFC16NXP SemiconductorsIC MCU 32BIT ROMLESS 132PQFPMicrocontrollers132-PQFP (24.13x24.13)N/A0°C ~ 70°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
16MHz
Connectivity:
EBI/EMI, UART/USART
Number of I/O:
47
Program Memory Type:
ROMless
RAM Size:
1K x 8
Voltage – Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 8×8/10b
Oscillator Type:
External
Operating Temperature:
0°C ~ 70°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
132-PQFP (24.13×24.13)
Package / Case:
132-BQFP Bumpered
398
MC68336ACAB20MC68336ACAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
1,677
MC68336ACFT20MC68336ACFT20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
467
MC68336AMAB20MC68336AMAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 125°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 125°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
846
MC68336GCAB20MC68336GCAB20NXP SemiconductorsIC MCU 32BIT ROMLESS 160QFPMicrocontrollers160-QFP (28x28)N/A-40°C ~ 85°C (TA)
Core Processor:
CPU32
Core Size:
32-Bit Single-Core
Speed:
20MHz
Connectivity:
CANbus, EBI/EMI, SCI, SPI
Peripherals:
POR, PWM, WDT
Number of I/O:
18
Program Memory Type:
ROMless
RAM Size:
7.5K x 8
Voltage – Supply (Vcc/Vdd):
4.75V ~ 5.25V
Data Converters:
A/D 16x10b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Supplier Device Package:
160-QFP (28×28)
Package / Case:
160-BQFP
731

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