| N/A | | MC68340FT16E | NXP Semiconductors | IC MPU M683XX 16MHZ 144QFP | Microprocessors | 144-QFP (28x28) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-QFP (28×28) | 234 | |
| N/A | | MC68340FT25E | NXP Semiconductors | IC MPU M683XX 25MHZ 144QFP | Microprocessors | 144-QFP (28x28) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-QFP (28×28) | 1,559 | |
 | | MC68340PV16E | NXP Semiconductors | IC MPU M683XX 16MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 1,240 | |
 | | MC68340PV16VE | NXP Semiconductors | IC MPU M683XX 16MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 113 | |
 | | MC68340PV25E | NXP Semiconductors | IC MPU M683XX 25MHZ 144LQFP | Microprocessors | 144-LQFP (20x20) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 144-LQFP (20×20) | 321 | |
 | | MC68360AI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 717 | |
 | | MC68360AI25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 458 | |
 | | MC68360AI33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 127 | |
 | | MC68360CAI25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 251 | |
 | | MC68360CEM25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 624 | |
 | | MC68360CRC25L | NXP Semiconductors | IC MPU M683XX 25MHZ 241PGA | Microprocessors | 241-PGA (47.24x47.24) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Through Hole Supplier Device Package: 241-PGA (47.24×47.24) | 804 | |
 | | MC68360CVR25L | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 622 | |
 | | MC68360CVR25LR2 | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 683 | |
 | | MC68360CZP25L | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | -40°C ~ 85°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,062 | |
 | | MC68360EM25K | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 518 | |
 | | MC68360EM25L | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 244 | |
 | | MC68360EM25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 250 | |
 | | MC68360EM33L | NXP Semiconductors | IC MPU M683XX 33MHZ 240FQFP | Microprocessors | 240-FQFP (32x32) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 240-FQFP (32×32) | 151 | |
 | | MC68360RC25L | NXP Semiconductors | IC MPU M683XX 25MHZ 241PGA | Microprocessors | 241-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 241-PGA (47.24×47.24) | 801 | |
 | | MC68360RC33L | NXP Semiconductors | IC MPU M683XX 33MHZ 241PGA | Microprocessors | 241-PGA (47.24x47.24) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Through Hole Supplier Device Package: 241-PGA (47.24×47.24) | 267 | |