MC68360CAI25L

IC MPU M683XX 25MHZ 240FQFP
Part Description

CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 240-FQFP (32x32)

Quantity 76 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC68360
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorCPU32+Device Package240-FQFP (32x32)
ECCN3A991A2Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case240-BFQFPRAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed25MHzSupplier Device Package240-FQFP (32×32)
Voltage – I/O5.0V

Overview of MC68360CAI25L – IC MPU M683XX 25MHZ 240FQFP

The MC68360CAI25L is a CPU32+ microprocessor IC featuring a single 32‑bit core running at 25 MHz in a 240‑lead FQFP package. It integrates the QUICC (Quad Integrated Communication Controller) architecture to combine a CPU core with a rich set of communications peripherals and system integration features.

Designed for communications‑centric embedded designs, the device addresses applications such as ISDN equipment, mid‑range routers, LAN switches, bridges and telecom or wireless infrastructure. The part is qualified for industrial use and rated for an operating range of -40 °C to 85 °C, and it is RoHS compliant.

Key Features

  • Core & Performance CPU32+ single 32‑bit core operating at 25 MHz; complete static design supports operation across the device range stated in the series datasheet.
  • Memory Subsystem On‑chip memory controller with eight banks and a dedicated DRAM controller; glueless interface support for DRAM, SRAM, EPROM and Flash with selectable boot chip‑select widths.
  • Communications & CPM QUICC communications RISC CPM with four SCC channels, two SMCs and one SPI; includes an on‑chip 10 Mbps Ethernet interface (1 port) and additional SCC interfaces for serial communications.
  • Timers & DMA Four general‑purpose timers (configurable as four 16‑bit or two 32‑bit timers) and two independent DMA channels (IDMAs) for efficient data movement.
  • System Integration (SIM60) Integrated SIM60 provides bus monitoring, breakpoint logic, spurious interrupt monitoring, on‑chip bus arbitration and IEEE 1149.1 test access support.
  • Package, Power & Environmental 240‑lead FQFP (32x32 mm) surface‑mount package, 5 V I/O, industrial operating temperature −40 °C to 85 °C, and RoHS compliant.

Typical Applications

  • ISDN Equipment — Built‑in communications processors and serial controllers enable protocol handling and line interfacing in ISDN subsystems.
  • Mid‑range Routers — Integrated CPM, multiple serial channels and DMA support packet handling and peripheral offload in router designs.
  • LAN Switches and Bridges — On‑chip Ethernet interface and serial communications help consolidate control and management functions in switching equipment.
  • Telecom Switching & Transmission — System integration features, timers and robust communications peripherals support telephony and transmission control tasks.
  • Wireless Infrastructure & Base Stations — Communications‑focused integration and industrial temperature rating suit infrastructure applications requiring reliable protocol processing.

Unique Advantages

  • Highly integrated communications set: Four SCCs, two SMCs, SPI and a CPM reduce external peripheral count and simplify board-level design for communications systems.
  • Flexible memory interface: Eight‑bank memory controller with support for DRAM, SRAM and nonvolatile devices enables varied memory architectures and boot options.
  • Built‑in system integration and debug: SIM60 features (bus monitor, breakpoints, IEEE 1149.1) streamline bring‑up and system validation.
  • Deterministic data movement: Two independent IDMAs and multiple timers enable efficient, low‑overhead data transfers and scheduling.
  • Industrial temperature and RoHS compliance: Rated −40 °C to 85 °C and RoHS compliant for deployment in industrial embedded environments.
  • Scalable deployment modes: Slave mode and bus‑sharing capabilities allow multiple QUICC devices to coexist on a system bus or act as intelligent peripherals.

Why Choose MC68360CAI25L?

The MC68360CAI25L pairs a CPU32+ core with extensive communications peripherals and a robust system integration module to deliver a compact, communications‑oriented microprocessor solution. Its integrated memory controller, multiple serial channels, DMA engines and SIM60 diagnostics make it well suited to embedded systems that require consolidated functionality and industrial operating range.

This device is positioned for design teams building routers, switches, telecom equipment and wireless infrastructure who need a single‑chip communications controller with on‑chip system features and support for field‑grade temperature ranges, while benefiting from the series' third‑party tool support and scalable deployment options.

Request a quote or submit a purchase inquiry to receive pricing and availability for the MC68360CAI25L and discuss how it can fit into your next communications‑focused embedded design.

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