MC68360CEM25L

The MC68360CEM25L is a CPU32+ 32-bit microprocessor in a 240‑pin FQFP package, operating at 25 MHz and targeted at embedded designs. It combines a CPU32+ core with an integrated Communications Processor Module (CPM) and System Integration Module (SIM60) elements described in the MC68360 documentation to support communications-centric embedded applications.

Designed for industrial use, the device provides on-chip communication peripherals, DRAM controller support, a 10 Mbps Ethernet interface, and 5 V I/O compatibility, offering a compact, surface-mount microprocessor solution for industrial embedded systems.

Key Features

• CPU Core  CPU32+ single 32‑bit core running at 25 MHz for deterministic embedded processing.
• Communications Offload  Integrated Communications Processor Module (CPM) and Communications DSP functionality to support protocol handling and serial communications tasks.
• On‑chip Interfaces  Includes a 10 Mbps Ethernet interface (1) and serial communication controllers (SCC) for networking and peripheral connectivity.
• Memory Support  Built‑in DRAM controller functionality to simplify system memory integration.
• I/O and Power  5 V I/O signaling to match legacy industrial logic levels.
• Package and Mounting  240‑pin BFQFP / 240‑FQFP (32 × 32 mm) surface‑mount package for compact board layouts.
• Operating Range & Qualification  Industrial qualification with an operating temperature range of −40 °C to 85 °C.
• Compliance  RoHS compliant.
• Testability & Documentation  Series documentation references features such as an IEEE‑1149.1 test access port and comprehensive user manuals covering CPU32+, SIM60, and CPM operation.

Typical Applications

• Industrial Embedded Systems  Use as a control processor where industrial temperature range and 5 V I/O compatibility are required.
• Embedded Communications Appliances  Offload serial and protocol handling to the CPM and SCC interfaces while using the CPU32+ for application control.
• Ethernet‑enabled Devices  Integrate low‑speed 10 Mbps Ethernet connectivity alongside on‑chip communications resources for networked embedded products.
• OEM Control Platforms  Leverage DRAM controller support and a compact 240‑FQFP package for space‑constrained OEM designs.

Unique Advantages

• Integrated Communications Subsystem:  On‑chip CPM and SCC interfaces reduce external peripheral count and simplify protocol implementation.
• Simplified Memory Integration:  DRAM controller support helps streamline system memory design and reduce board complexity.
• Industrial Temperature Qualification:  Rated for −40 °C to 85 °C operation to meet the demands of industrial deployments.
• Legacy I/O Compatibility:  5 V I/O signaling supports integration with existing industrial logic and peripheral devices.
• Compact Surface‑Mount Package:  240‑FQFP (32 × 32) surface‑mount package balances pin count and board area for embedded applications.
• Standards and Test Support:  Series documentation includes IEEE‑1149.1 test access and detailed programming references to aid development and verification.

Why Choose MC68360CEM25L?

The MC68360CEM25L positions itself as a communications‑focused embedded microprocessor with a CPU32+ core and integrated CPM/SIM60 elements that streamline serial and networked application designs. Its combination of a 32‑bit core, DRAM controller, 10 Mbps Ethernet interface, and industrial temperature rating makes it suitable for embedded OEMs and systems integrators building industrial communications and control products.

Backed by NXP Semiconductors documentation for the MC68360 family, the device is supported by detailed user manuals and programming references that cover CPU32+, CPM, SIM60, and system integration topics to accelerate development and deployment.

Request a quote or submit an inquiry to receive availability and pricing information for the MC68360CEM25L and discuss how it fits your embedded communications design requirements.