MC68360CVR25LR2
| Part Description |
CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 1,353 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC68360 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | CPU32+ | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | EAR99 | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 85°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 25MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| Voltage – I/O | 5.0V |
Overview of MC68360CVR25LR2 – IC MPU M683XX 25MHZ 357BGA
The MC68360CVR25LR2 is a single‑core CPU32+ microprocessor IC in the MC68360 series from NXP Semiconductors. It provides a 32‑bit CPU32+ core running at 25 MHz with integrated communications and system integration features suitable for embedded designs.
Targeted for embedded and industrial applications, the device combines a communications processor module (CPM), DRAM controller support, built‑in serial interfaces and a 10 Mbps Ethernet interface, delivered in a 357‑PBGA (25 × 25) surface‑mount package and rated for −40 °C to 85 °C operation.
Key Features
- Core (CPU32+) Single 32‑bit CPU32+ core operating at 25 MHz for control and processing tasks.
- Communications Processing Integrated Communications co-processor (CPM) and SCC interfaces to offload serial and protocol handling from the main CPU.
- Network Interface On‑chip Ethernet capability (10 Mbps) for networked embedded applications.
- Memory Support DRAM controller support to interface with external dynamic memory for application code and buffering.
- Power and I/O Standard 5 V I/O voltage for compatibility with legacy embedded systems.
- Package and Mounting 357‑PBGA (25 × 25) / 357‑BBGA package in a surface‑mount form factor for compact board designs.
- Industrial Temperature Range Qualified for industrial use with an operating range of −40 °C to 85 °C.
- RoHS Compliant Meets RoHS requirements for environmental compliance.
- Documentation Extensive MC68360 series documentation covers CPU32+ programming, SIM60, CPM, memory map and system integration details.
Typical Applications
- Industrial communications controllers The integrated CPM and SCC interfaces make this device well suited for embedded communication stacks and protocol handling in industrial equipment.
- Embedded network modules The onboard 10 Mbps Ethernet and DRAM controller support enable compact networked modules for monitoring and control.
- Control and automation systems Single‑core 32‑bit processing plus serial interfaces support control tasks, data buffering and system integration in automated machinery.
- Custom serial interface units SCC interfaces and CPM offload allow implementation of custom serial and protocol converters in embedded environments.
Unique Advantages
- Integrated communications engine: Built‑in Communications Processor Module (CPM) and SCC interfaces reduce external components and simplify serial/protocol handling.
- Network‑ready: On‑chip 10 Mbps Ethernet provides a native physical network interface for connected embedded applications.
- Industrial‑grade operation: −40 °C to 85 °C operating range and industrial qualification support deployment in rugged environments.
- Compact surface‑mount package: 357‑PBGA (25 × 25) package enables higher integration density on board designs.
- Standard 5 V I/O: Ensures compatibility with existing 5 V embedded platforms and legacy peripherals.
- Comprehensive documentation: Series user manual and product briefs provide detailed information on CPU32+, SIM60, CPM, memory maps and system integration to accelerate development.
Why Choose MC68360CVR25LR2?
The MC68360CVR25LR2 positions itself as a focused embedded microprocessor for applications that need integrated communications handling, basic Ethernet connectivity and industrial temperature operation. Its CPU32+ core combined with the CPM and DRAM controller support provides a compact, documented solution for communication‑centric embedded designs.
Manufactured by NXP Semiconductors and part of the MC68360 series, this device delivers a balance of processing, communications integration and environmental qualification for engineers designing industrial and embedded networked systems.
Request a quote or submit your requirements to receive pricing and availability information for the MC68360CVR25LR2.

Date Founded: 2006
Headquarters: Eindhoven, North Brabant, Netherlands
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