MC68360CVR25LR2

IC MPU M683XX 25MHZ 357BGA
Part Description

CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 357-PBGA (25x25)

Quantity 1,353 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC68360
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorCPU32+Device Package357-PBGA (25x25)
ECCNEAR99Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 85°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed25MHzSupplier Device Package357-PBGA (25×25)
Voltage – I/O5.0V

Overview of MC68360CVR25LR2 – IC MPU M683XX 25MHZ 357BGA

The MC68360CVR25LR2 is a single‑core CPU32+ microprocessor IC in the MC68360 series from NXP Semiconductors. It provides a 32‑bit CPU32+ core running at 25 MHz with integrated communications and system integration features suitable for embedded designs.

Targeted for embedded and industrial applications, the device combines a communications processor module (CPM), DRAM controller support, built‑in serial interfaces and a 10 Mbps Ethernet interface, delivered in a 357‑PBGA (25 × 25) surface‑mount package and rated for −40 °C to 85 °C operation.

Key Features

  • Core (CPU32+) Single 32‑bit CPU32+ core operating at 25 MHz for control and processing tasks.
  • Communications Processing Integrated Communications co-processor (CPM) and SCC interfaces to offload serial and protocol handling from the main CPU.
  • Network Interface On‑chip Ethernet capability (10 Mbps) for networked embedded applications.
  • Memory Support DRAM controller support to interface with external dynamic memory for application code and buffering.
  • Power and I/O Standard 5 V I/O voltage for compatibility with legacy embedded systems.
  • Package and Mounting 357‑PBGA (25 × 25) / 357‑BBGA package in a surface‑mount form factor for compact board designs.
  • Industrial Temperature Range Qualified for industrial use with an operating range of −40 °C to 85 °C.
  • RoHS Compliant Meets RoHS requirements for environmental compliance.
  • Documentation Extensive MC68360 series documentation covers CPU32+ programming, SIM60, CPM, memory map and system integration details.

Typical Applications

  • Industrial communications controllers The integrated CPM and SCC interfaces make this device well suited for embedded communication stacks and protocol handling in industrial equipment.
  • Embedded network modules The onboard 10 Mbps Ethernet and DRAM controller support enable compact networked modules for monitoring and control.
  • Control and automation systems Single‑core 32‑bit processing plus serial interfaces support control tasks, data buffering and system integration in automated machinery.
  • Custom serial interface units SCC interfaces and CPM offload allow implementation of custom serial and protocol converters in embedded environments.

Unique Advantages

  • Integrated communications engine: Built‑in Communications Processor Module (CPM) and SCC interfaces reduce external components and simplify serial/protocol handling.
  • Network‑ready: On‑chip 10 Mbps Ethernet provides a native physical network interface for connected embedded applications.
  • Industrial‑grade operation: −40 °C to 85 °C operating range and industrial qualification support deployment in rugged environments.
  • Compact surface‑mount package: 357‑PBGA (25 × 25) package enables higher integration density on board designs.
  • Standard 5 V I/O: Ensures compatibility with existing 5 V embedded platforms and legacy peripherals.
  • Comprehensive documentation: Series user manual and product briefs provide detailed information on CPU32+, SIM60, CPM, memory maps and system integration to accelerate development.

Why Choose MC68360CVR25LR2?

The MC68360CVR25LR2 positions itself as a focused embedded microprocessor for applications that need integrated communications handling, basic Ethernet connectivity and industrial temperature operation. Its CPU32+ core combined with the CPM and DRAM controller support provides a compact, documented solution for communication‑centric embedded designs.

Manufactured by NXP Semiconductors and part of the MC68360 series, this device delivers a balance of processing, communications integration and environmental qualification for engineers designing industrial and embedded networked systems.

Request a quote or submit your requirements to receive pricing and availability information for the MC68360CVR25LR2.

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