MC68360EM25L

IC MPU M683XX 25MHZ 240FQFP
Part Description

CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 240-FQFP (32x32)

Quantity 350 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC68360
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorCPU32+Device Package240-FQFP (32x32)
ECCN3A991A2Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 70°C (TA)
Package / Case240-BFQFPRAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed25MHzSupplier Device Package240-FQFP (32×32)
Voltage – I/O5.0V

Overview of MC68360EM25L – IC MPU M683XX 25MHz 240FQFP

The MC68360EM25L is a single‑core, 32‑bit microprocessor in the MC68360 series from NXP Semiconductors, built around the CPU32+ architecture. It integrates a Communications Processor Module (CPM) and system integration functionality suited for embedded communications and control applications.

With a 25 MHz core clock, integrated communications co‑processing, DRAM controller support and a 240‑pin FQFP package, the MC68360EM25L targets embedded designs that require on‑chip communications handling and a compact surface‑mount footprint.

Key Features

  • CPU Core CPU32+ single 32‑bit core operating at 25 MHz for deterministic embedded processing.
  • Communications Processing Integrated Communications Processor Module (CPM) and communications DSP support, designed for serial and network protocol handling.
  • Memory and Bus On‑chip DRAM controller support to simplify external memory interfacing and system memory management.
  • Network Interface 10 Mbps Ethernet (1) support for basic network connectivity in embedded communication systems.
  • Serial Connectivity Additional interfaces including SCC (Serial Communication Controllers) for a range of serial peripheral connections.
  • Package and Mounting 240‑pin FQFP package (240‑BFQFP / 240‑FQFP 32×32) in a surface‑mount form factor suitable for compact PCB layouts.
  • Power and I/O 5 V I/O voltage compatibility for systems using standard TTL/CMOS signaling levels.
  • Operating Range Specified operating temperature range of 0 °C to 70 °C for commercial‑grade embedded applications.
  • Compliance RoHS compliant, meeting common environmental requirements for electronic assemblies.

Typical Applications

  • Embedded Communications Controllers — Use the integrated CPM and communications DSP to offload serial and network protocol processing in communication equipment.
  • Industrial Embedded Systems — Provide control and communications functionality in compact, surface‑mount designs within the 0 °C to 70 °C operating range.
  • Network Interface Modules — Leverage the 10 Mbps Ethernet support and SCC interfaces for basic networking and peripheral connectivity tasks.

Unique Advantages

  • Integrated Communications Subsystem — On‑chip CPM and communications DSP reduce external component count for serial and network protocol handling.
  • Single 32‑Bit CPU32+ Core — Provides a straightforward, 32‑bit processing engine at 25 MHz for deterministic embedded control tasks.
  • Compact 240‑FQFP Package — High pin count in a 32×32 FQFP footprint enables dense integration while remaining surface‑mount friendly.
  • Standard 5 V I/O — Compatibility with common digital I/O voltage levels simplifies interfacing with legacy peripherals and boards.
  • Commercial Temperature Rating — Rated 0 °C to 70 °C for designs targeting commercial embedded environments.
  • RoHS Compliant — Meets environmental compliance requirements for modern electronics manufacturing.

Why Choose MC68360EM25L?

The MC68360EM25L positions itself as an integrated microprocessor solution for embedded systems that require on‑chip communications handling and a 32‑bit CPU32+ core. Its combination of a communications processor module, DRAM controller support, SCC serial interfaces and 10 Mbps Ethernet capability makes it well suited to designs where integrated protocol handling and compact packaging are priorities.

Manufactured by NXP Semiconductors and delivered in a 240‑pin FQFP surface‑mount package with RoHS compliance, the MC68360EM25L is appropriate for engineers and procurement teams implementing commercial‑grade embedded communications and control applications that rely on established MCU architecture and integrated communications features.

Request a quote or submit an inquiry to get pricing and availability for the MC68360EM25L for your next embedded communications or control design.

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