MC68360RC25L
| Part Description |
CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 241-PGA (47.24x47.24) |
|---|---|
| Quantity | 1,438 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MC68360 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | CPU32+ | Device Package | 241-PGA (47.24x47.24) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10Mbps (1) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | Not Applicable | Mounting Method | Through Hole | ||
| Mounting Type | Through Hole | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 70°C (TA) | ||
| Package / Case | 241-BEPGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Speed | 25MHz | Supplier Device Package | 241-PGA (47.24×47.24) | ||
| Voltage – I/O | 5.0V |
Overview of MC68360RC25L – IC MPU M683XX 25MHZ 241PGA
The MC68360RC25L is a CPU32+ microprocessor IC in the MC68360 series featuring a single 32-bit core running at 25 MHz. It integrates a Communications Processor Module (CPM) and system integration features from the QUICC family to support embedded communications and control applications.
Designed for embedded systems, the device combines on-chip communications coprocessing, DRAM controller support and standard serial interfaces to simplify designs that require integrated communications functionality and through-hole PGA packaging.
Key Features
- Core: CPU32+ single 32-bit core running at 25 MHz, providing the device's main processing capability.
- Communications Coprocessor: On-chip Communications Processor Module (CPM) for handling communications and protocol tasks; supports communications and DSP-related functions as documented for the series.
- Memory & Bus: Includes DRAM controller functionality and a system integration module (SIM60) as part of the MC68360 architecture.
- Interfaces: Built-in SCC (Serial Communications Controller) and one 10 Mbps Ethernet interface; additional serial/peripheral configurations supported by the QUICC architecture.
- Power: 5 V I/O voltage for compatibility with legacy embedded I/O systems.
- Package & Mounting: 241-PGA (241-BEPGA) package, supplier package size 47.24 × 47.24 mm; through-hole mounting.
- Operating Range: Rated for 0 °C to 70 °C operating temperature.
- Environmental Compliance: RoHS compliant.
Typical Applications
- Embedded Communications: Devices that require integrated serial and Ethernet communications using the on-chip CPM and SCC resources.
- Networking Modules: Network or gateway modules leveraging the 10 Mbps Ethernet interface and communications coprocessing.
- Industrial Control Systems: Controllers and embedded control equipment that benefit from a single-chip CPU32+ core with DRAM controller support.
- Legacy / Through-Hole Designs: Systems that require a large PGA through-hole package for board-level mounting or retrofit applications.
Unique Advantages
- Integrated Communications Processing: The on-chip CPM provides dedicated handling for communications tasks, aligning with the MC68360 QUICC architecture for serial and protocol workloads.
- Single-Chip System Integration: CPU32+ core combined with DRAM controller and SIM60-based integration reduces the need for external components associated with communications-centric embedded designs.
- Standard I/O Voltage: 5 V I/O simplifies integration into existing embedded platforms that use legacy TTL/CMOS voltage domains.
- Robust Packaging for Board-Level Use: 241-PGA through-hole package (47.24 × 47.24 mm) provides a durable mounting option for applications that require larger package footprints.
- Regulatory Readiness: RoHS compliance supports use in environments requiring lead-free components.
Why Choose MC68360RC25L?
The MC68360RC25L positions itself as a compact, integrated microprocessor solution for embedded communications and control designs that require on-chip communications coprocessing, DRAM controller support, and a CPU32+ core. Its combination of communications interfaces, standard 5 V I/O, and through-hole 241-PGA packaging makes it suitable for systems that prioritize integrated serial/Ethernet capability and durable board mounting.
This device is appropriate for designers seeking a QUICC-based MCU with explicit support for communications tasks and standard operating and environmental parameters, backed by the MC68360 series documentation and integration features.
Request a quote or submit a materials inquiry to receive pricing and availability for the MC68360RC25L.

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