MC68360RC25L

IC MPU M683XX 25MHZ 241PGA
Part Description

CPU32+ Microprocessor IC M683xx 1 Core, 32-Bit 25MHz 241-PGA (47.24x47.24)

Quantity 1,438 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMC68360
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorCPU32+Device Package241-PGA (47.24x47.24)
ECCN3A991A2Ethernet10Mbps (1)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity LevelNot ApplicableMounting MethodThrough Hole
Mounting TypeThrough HoleNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 70°C (TA)
Package / Case241-BEPGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSpeed25MHzSupplier Device Package241-PGA (47.24×47.24)
Voltage – I/O5.0V

Overview of MC68360RC25L – IC MPU M683XX 25MHZ 241PGA

The MC68360RC25L is a CPU32+ microprocessor IC in the MC68360 series featuring a single 32-bit core running at 25 MHz. It integrates a Communications Processor Module (CPM) and system integration features from the QUICC family to support embedded communications and control applications.

Designed for embedded systems, the device combines on-chip communications coprocessing, DRAM controller support and standard serial interfaces to simplify designs that require integrated communications functionality and through-hole PGA packaging.

Key Features

  • Core: CPU32+ single 32-bit core running at 25 MHz, providing the device's main processing capability.
  • Communications Coprocessor: On-chip Communications Processor Module (CPM) for handling communications and protocol tasks; supports communications and DSP-related functions as documented for the series.
  • Memory & Bus: Includes DRAM controller functionality and a system integration module (SIM60) as part of the MC68360 architecture.
  • Interfaces: Built-in SCC (Serial Communications Controller) and one 10 Mbps Ethernet interface; additional serial/peripheral configurations supported by the QUICC architecture.
  • Power: 5 V I/O voltage for compatibility with legacy embedded I/O systems.
  • Package & Mounting: 241-PGA (241-BEPGA) package, supplier package size 47.24 × 47.24 mm; through-hole mounting.
  • Operating Range: Rated for 0 °C to 70 °C operating temperature.
  • Environmental Compliance: RoHS compliant.

Typical Applications

  • Embedded Communications: Devices that require integrated serial and Ethernet communications using the on-chip CPM and SCC resources.
  • Networking Modules: Network or gateway modules leveraging the 10 Mbps Ethernet interface and communications coprocessing.
  • Industrial Control Systems: Controllers and embedded control equipment that benefit from a single-chip CPU32+ core with DRAM controller support.
  • Legacy / Through-Hole Designs: Systems that require a large PGA through-hole package for board-level mounting or retrofit applications.

Unique Advantages

  • Integrated Communications Processing: The on-chip CPM provides dedicated handling for communications tasks, aligning with the MC68360 QUICC architecture for serial and protocol workloads.
  • Single-Chip System Integration: CPU32+ core combined with DRAM controller and SIM60-based integration reduces the need for external components associated with communications-centric embedded designs.
  • Standard I/O Voltage: 5 V I/O simplifies integration into existing embedded platforms that use legacy TTL/CMOS voltage domains.
  • Robust Packaging for Board-Level Use: 241-PGA through-hole package (47.24 × 47.24 mm) provides a durable mounting option for applications that require larger package footprints.
  • Regulatory Readiness: RoHS compliance supports use in environments requiring lead-free components.

Why Choose MC68360RC25L?

The MC68360RC25L positions itself as a compact, integrated microprocessor solution for embedded communications and control designs that require on-chip communications coprocessing, DRAM controller support, and a CPU32+ core. Its combination of communications interfaces, standard 5 V I/O, and through-hole 241-PGA packaging makes it suitable for systems that prioritize integrated serial/Ethernet capability and durable board mounting.

This device is appropriate for designers seeking a QUICC-based MCU with explicit support for communications tasks and standard operating and environmental parameters, backed by the MC68360 series documentation and integration features.

Request a quote or submit a materials inquiry to receive pricing and availability for the MC68360RC25L.

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