MC68360CZP25L

The MC68360CZP25L is a CPU32+ microprocessor from the MC68360 series by NXP Semiconductors. It implements a single 32‑bit CPU32+ core running at 25 MHz and integrates communications functionality targeted at embedded applications.

Designed for industrial embedded systems, the device combines a Communications Processor Module (CPM) and a System Integration Module (SIM60) as described in the MC68360 documentation, providing integrated communications and system integration capabilities in a 357‑PBGA surface‑mount package.

Key Features

• Core and Performance  CPU32+ single 32‑bit core operating at 25 MHz, suitable for embedded control tasks requiring a 32‑bit instruction set.
• Communications Co‑Processors  Includes communications co‑processor functionality and a Communications Processor Module (CPM) for offloading serial and network communications tasks.
• System Integration  Built around the QUICC architecture with a System Integration Module (SIM60) referenced in the product documentation for cohesive system-level integration.
• Memory Support  On‑chip DRAM controller support to interface with system memory.
• Ethernet  Integrated 10 Mbps Ethernet interface (1) for networked embedded applications.
• Serial Interfaces  Includes SCC and additional serial interface options as noted in the specifications.
• Voltage  5 V I/O supply specification for legacy and industrial system compatibility.
• Package and Mounting  357‑PBGA (25 × 25 mm) package, surface‑mount mounting for compact board-level integration.
• Qualification and Environment  Industrial qualification with an operating temperature range of −40 °C to 85 °C and RoHS compliance.

Typical Applications

• Industrial Embedded Systems  Control and monitoring applications that benefit from a 32‑bit CPU32+ core with industrial temperature qualification.
• Embedded Communications Controllers  Applications that require integrated communications processing and a CPM for serial/network protocol handling.
• Networking and Interface Devices  Low‑speed Ethernet and serial interface equipment leveraging the integrated 10 Mbps Ethernet and SCC interfaces.
• Legacy Design Upgrades  Projects migrating or upgrading from related MC683xx family devices can use the documented architectural upgrade paths described in the MC68360 materials.

Unique Advantages

• Integrated Communications Processing: The on‑chip Communications Processor Module (CPM) provides dedicated communications functionality that helps consolidate protocol handling within a single device.
• System Integration with SIM60: The QUICC architecture and System Integration Module (SIM60) are documented components of the MC68360 series, enabling cohesive system-level interfacing.
• Industrial‑Grade Operation: Rated for −40 °C to 85 °C operation and listed as industrial qualification, suitable for harsh environment deployments.
• Standard 5 V I/O: 5 V I/O support for compatibility with existing industrial and legacy interfaces.
• Compact PBGA Package: 357‑ball PBGA (25 × 25 mm) surface‑mount package for board‑level space efficiency and assembly compatibility.
• RoHS Compliant: Conforms to RoHS directives as indicated in the product data.

Why Choose MC68360CZP25L?

The MC68360CZP25L positions itself as an integrated embedded microprocessor solution combining a CPU32+ core with dedicated communications processing and system integration features from the MC68360 family. Its industrial qualification, 5 V I/O, and extended temperature range make it suitable for embedded and industrial designs that require on‑device communications capability and controlled environmental performance.

Customers looking for a solution with documented QUICC architecture elements (CPU32+, SIM60, CPM), DRAM controller support, and a compact 357‑PBGA package will find the MC68360CZP25L aligned with those requirements, backed by NXP Semiconductors as the manufacturer and RoHS compliance for regulatory alignment.

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