 | | MC68360VR25L | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 899 | |
 | | MC68360VR25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 315 | |
 | | MC68360VR33L | NXP Semiconductors | IC MPU M683XX 33MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 865 | |
 | | MC68360ZP25L | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 52 | |
 | | MC68360ZP25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | N/A | 0°C ~ 70°C (TA) | Number of Cores/Bus Width: 1 Core, 32-Bit Co-Processors/DSP: Communications; CPM Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Supplier Device Package: 357-PBGA (25×25) | 1,206 | |
 | | MC68360ZQ25VL | NXP Semiconductors | IC MPU M683XX 25MHZ 357BGA | Microprocessors | 357-PBGA (25x25) | 3.3V | 0°C – 70°C | Number of Cores/Bus Width: 1 Core, 32-Bit Mounting Type: Surface Mount | 1,443 | |
 | | MC68376BACAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 1,542 | |
 | | MC68376BACAB25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 802 | |
 | | MC68376BACFT20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 563 | |
 | | MC68376BAMAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 446 | |
 | | MC68376BAVAB25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 529 | |
 | | MC68376BGCAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 624 | |
 | | MC68376BGCAB25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 1,209 | |
 | | MC68376BGCFT20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 85°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 92 | |
 | | MC68376BGMAB20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 390 | |
 | | MC68376BGMFT20 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 125°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 125°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 1,208 | |
 | | MC68376BGVAB25 | NXP Semiconductors | IC MCU 32BIT ROMLESS 160QFP | Microcontrollers | 160-QFP (28x28) | N/A | -40°C ~ 105°C (TA) | Core Size: 32-Bit Single-Core Connectivity: CANbus, EBI/EMI, SCI, SPI Peripherals: POR, PWM, WDT Program Memory Type: ROMless Voltage – Supply (Vcc/Vdd): 4.75V ~ 5.25V Data Converters: A/D 16x10b Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 160-QFP (28×28) | 944 | |
 | N/A | MC68711E20CFNE2 | NXP Semiconductors | IC MCU 8BIT 20KB OTP 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 20KB (20K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 159 | |
 | N/A | MC68711E20CFNE3 | NXP Semiconductors | IC MCU 8BIT 20KB OTP 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 20KB (20K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 829 | |
 | N/A | MC68711E20CFNE4 | NXP Semiconductors | IC MCU 8BIT 20KB OTP 52PLCC | Microcontrollers | 52-PLCC (19.1x19.1) | N/A | -40°C ~ 85°C (TA) | Program Memory Size: 20KB (20K x 8) Voltage – Supply (Vcc/Vdd): 4.5V ~ 5.5V Operating Temperature: -40°C ~ 85°C (TA) Mounting Type: Surface Mount Supplier Device Package: 52-PLCC (19.1×19.1) Package / Case: 52-LCC (J-Lead) | 249 | |