MC68360ZQ25VL

The MC68360ZQ25VL is a CPU32+ based 32‑bit microprocessor offering a single core operating at 25 MHz with a 357‑pin PBGA (25×25) surface‑mount package. Designed for embedded communications and control applications, the device integrates a Communications Processor Module (CPM) and multiple serial channels to support protocol handling and peripheral interfacing within compact systems.

Key Features

• Core and Performance CPU32+ core running at 25 MHz delivering 4.5 MIPS (as specified for the CPU32+ at 25 MHz) with full 32‑bit processing and background debug support.
• Bus and Memory Interface Up to 32‑bit data bus with dynamic bus sizing to 8/16 bits and up to 32 address lines (at least 28 available). Supports external memories including SRAM, EPROM, and Flash with multiple CAS/WE/OE lines and a boot chip select available at reset.
• Communications Processor Module (CPM) On‑chip CPM with a dedicated RISC controller, support for buffer descriptors (224), and features for continuous mode transmission and reception on serial channels—enabling offloaded protocol processing.
• Serial Interfaces Multiple serial channels: four Serial Communications Controllers (SCCs), two Serial Management Controllers (SMCs), and one SPI channel for diverse serial protocol support.
• Timers and DMA Four general‑purpose timers (configurable as four 16‑bit or two 32‑bit timers) and two independent DMAs (IDMAs) with buffer chaining and auto buffer modes for efficient data movement.
• System Integration and Reliability System Integration Module (SIM60) providing bus and fault monitoring, software watchdog, periodic interrupt timer, clock synthesizer, breakpoint logic and IEEE 1149.1 test access for system diagnostics and reliability.
• Ethernet and Serial Networking Supports Ethernet/IEEE 802.3 10 Mbps capability (one port) and HDLC/SDLC support across channels for networked communications and legacy protocol support.
• Power and Packaging 3.3 V I/O voltage, surface‑mount 357‑PBGA (25×25) supplier package, shipped in tray packaging for PCB assembly.

Typical Applications

• Communications Equipment Device integration of CPM and multiple SCC/SMC channels makes it suited for embedded communication controllers and protocol offload functions.
• Network Interface Modules 10 Mbps Ethernet support and HDLC/SDLC channel capability enable use in network interface and link‑level processing modules.
• Embedded Control Systems On‑chip timers, DMA, and extensive memory interface options support control applications that require real‑time I/O handling and local buffering.

Unique Advantages

• Highly integrated communications capability: Combines a CPU32+ core with a dedicated CPM and multiple serial controllers to reduce external components for protocol handling.
• Flexible memory interfacing: Supports a variety of external memory types with dedicated control lines and a boot chip select to simplify system boot and memory configuration.
• Efficient data movement: Dual IDMAs with buffer chaining and auto buffer modes enable high‑efficiency transfers and reduced CPU overhead.
• Built‑in system diagnostics: SIM60 features including watchdog, bus/fault monitors and IEEE 1149.1 TAP support aid development and in‑field diagnostics.
• Compact, manufacturable package: 357‑PBGA (25×25) surface‑mount package and tray shipping support modern assembly and deployment workflows.

Why Choose MC68360ZQ25VL?

The MC68360ZQ25VL positions a CPU32+ core alongside a feature‑rich Communications Processor Module and multiple serial controllers, delivering an integrated platform for embedded communications and control designs. Its combination of memory interface flexibility, DMA engines, timers and system integration features provides the deterministic I/O and protocol offload capabilities needed in compact embedded systems.

This device is well suited for engineers building communication-centric modules, network interfaces, and embedded controllers that require on‑chip peripheral integration, efficient data handling, and robust system diagnostics, while leveraging a 3.3 V I/O and a 357‑pin PBGA form factor for deployment in surface‑mount assemblies.

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